Class information for: |
Basic class information |
| Class id | #P | Avg. number of references |
Database coverage of references |
|---|---|---|---|
| 16855 | 632 | 20.4 | 37% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 2 | 4 | MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER | 2836879 |
| 330 | 3 | ELECTROCHEMISTRY//ELECTRODEPOSITION//ELECTROCOAGULATION | 38062 |
| 544 | 2 | PLATING AND SURFACE FINISHING//ELECTRODEPOSITION//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING | 14700 |
| 16855 | 1 | THERMAL EQUILIBRIUM DIAGRAM//TIN ELECTRODEPOSITION//CONNECTING RELIABILITY | 632 |
Terms with highest relevance score |
| rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|---|
| 1 | THERMAL EQUILIBRIUM DIAGRAM | authKW | 295923 | 1% | 88% | 7 |
| 2 | TIN ELECTRODEPOSITION | authKW | 248471 | 1% | 86% | 6 |
| 3 | CONNECTING RELIABILITY | authKW | 193257 | 1% | 100% | 4 |
| 4 | POLYETHER LAPROL | authKW | 193257 | 1% | 100% | 4 |
| 5 | TIN COPPER ALLOYS | authKW | 193257 | 1% | 100% | 4 |
| 6 | N N BISPOLYOXYETHYLENEOCTADECYLAMINE | authKW | 144943 | 0% | 100% | 3 |
| 7 | PLATED FILM | authKW | 144943 | 0% | 100% | 3 |
| 8 | POLYETHER SINTANOL | authKW | 144943 | 0% | 100% | 3 |
| 9 | SN ZN DEPOSIT | authKW | 144943 | 0% | 100% | 3 |
| 10 | THERMAL EQUILIBRIUM PHASE DIAGRAM | authKW | 144943 | 0% | 100% | 3 |
Web of Science journal categories |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | Electrochemistry | 12544 | 38% | 0% | 238 |
| 2 | Materials Science, Coatings & Films | 12400 | 32% | 0% | 202 |
| 3 | Metallurgy & Metallurgical Engineering | 4536 | 29% | 0% | 181 |
| 4 | Materials Science, Multidisciplinary | 194 | 15% | 0% | 97 |
| 5 | Physics, Applied | 185 | 14% | 0% | 87 |
| 6 | Chemistry, Applied | 52 | 3% | 0% | 22 |
| 7 | Chemistry, Multidisciplinary | 41 | 8% | 0% | 53 |
| 8 | Engineering, Manufacturing | 36 | 2% | 0% | 10 |
| 9 | Chemistry, Analytical | 31 | 5% | 0% | 29 |
| 10 | Physics, Condensed Matter | 15 | 5% | 0% | 31 |
Address terms |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | THIO FINE CHEM | 62115 | 0% | 43% | 3 |
| 2 | NOVOMOSKOVSK | 59031 | 2% | 11% | 11 |
| 3 | ADV WELDING JOINING TECHNOL SERV | 48314 | 0% | 100% | 1 |
| 4 | ALL RUSSIA SCI TECHNOL INFORMAT | 48314 | 0% | 100% | 1 |
| 5 | CHAIRE MAT IND METALL CERAM | 48314 | 0% | 100% | 1 |
| 6 | COLD ROLLED COATED SHEET | 48314 | 0% | 100% | 1 |
| 7 | COURSES REG ENVIRONM SYST | 48314 | 0% | 100% | 1 |
| 8 | DIPARTIMETNO SCI MAT INGN CHIM | 48314 | 0% | 100% | 1 |
| 9 | ELE OCHEM MAT GRP ST JEROMEUMR 6264 | 48314 | 0% | 100% | 1 |
| 10 | ELE OCHEM PLATING TECHNOL | 48314 | 0% | 100% | 1 |
Journals |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | PLATING AND SURFACE FINISHING | 108426 | 9% | 4% | 56 |
| 2 | TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING | 40791 | 5% | 3% | 32 |
| 3 | CHEMIJA | 14985 | 2% | 3% | 10 |
| 4 | JOURNAL OF APPLIED ELECTROCHEMISTRY | 8490 | 5% | 1% | 32 |
| 5 | PROTECTION OF METALS | 5668 | 2% | 1% | 13 |
| 6 | SURFACE & COATINGS TECHNOLOGY | 5227 | 7% | 0% | 46 |
| 7 | JOURNAL OF THE JAPAN INSTITUTE OF METALS | 4701 | 4% | 0% | 24 |
| 8 | ELECTROCHIMICA ACTA | 3726 | 7% | 0% | 46 |
| 9 | RUSSIAN JOURNAL OF ELECTROCHEMISTRY | 3695 | 3% | 0% | 18 |
| 10 | SURFACE TECHNOLOGY | 2961 | 1% | 1% | 6 |
Author Key Words |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | THERMAL EQUILIBRIUM DIAGRAM | 295923 | 1% | 88% | 7 | Search THERMAL+EQUILIBRIUM+DIAGRAM | Search THERMAL+EQUILIBRIUM+DIAGRAM |
| 2 | TIN ELECTRODEPOSITION | 248471 | 1% | 86% | 6 | Search TIN+ELECTRODEPOSITION | Search TIN+ELECTRODEPOSITION |
| 3 | CONNECTING RELIABILITY | 193257 | 1% | 100% | 4 | Search CONNECTING+RELIABILITY | Search CONNECTING+RELIABILITY |
| 4 | POLYETHER LAPROL | 193257 | 1% | 100% | 4 | Search POLYETHER+LAPROL | Search POLYETHER+LAPROL |
| 5 | TIN COPPER ALLOYS | 193257 | 1% | 100% | 4 | Search TIN+COPPER+ALLOYS | Search TIN+COPPER+ALLOYS |
| 6 | N N BISPOLYOXYETHYLENEOCTADECYLAMINE | 144943 | 0% | 100% | 3 | Search N+N+BISPOLYOXYETHYLENEOCTADECYLAMINE | Search N+N+BISPOLYOXYETHYLENEOCTADECYLAMINE |
| 7 | PLATED FILM | 144943 | 0% | 100% | 3 | Search PLATED+FILM | Search PLATED+FILM |
| 8 | POLYETHER SINTANOL | 144943 | 0% | 100% | 3 | Search POLYETHER+SINTANOL | Search POLYETHER+SINTANOL |
| 9 | SN ZN DEPOSIT | 144943 | 0% | 100% | 3 | Search SN+ZN+DEPOSIT | Search SN+ZN+DEPOSIT |
| 10 | THERMAL EQUILIBRIUM PHASE DIAGRAM | 144943 | 0% | 100% | 3 | Search THERMAL+EQUILIBRIUM+PHASE+DIAGRAM | Search THERMAL+EQUILIBRIUM+PHASE+DIAGRAM |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
| Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
|---|---|---|---|---|
| 1 | GOH, YX , HASEEB, ASMA , SABRI, MFM , (2013) ELECTRODEPOSITION OF LEAD-FREE SOLDER ALLOYS.SOLDERING & SURFACE MOUNT TECHNOLOGY. VOL. 25. ISSUE 2. P. 76-90 | 42 | 71% | 1 |
| 2 | PEWNIM, N , ROY, S , (2013) ELECTRODEPOSITION OF TIN-RICH CU-SN ALLOYS FROM A METHANESULFONIC ACID ELECTROLYTE.ELECTROCHIMICA ACTA. VOL. 90. ISSUE . P. 498-506 | 29 | 66% | 17 |
| 3 | SURVILA, A , MOCKUS, Z , KANAPECKAITE, S , STALNIONIS, G , JUSKENAS, R , JASULAITIENE, V , (2013) CODEPOSITION OF ZINC AND COPPER IN GLUCONATE-SULFATE SOLUTIONS.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 160. ISSUE 10. P. D428 -D433 | 25 | 81% | 4 |
| 4 | BAKKALI, S , TOUIR, R , CHERKAOUI, M , TOUHAMI, ME , (2015) INFLUENCE OF S-DODECYLMERCAPTOBENZIMIDAZOLE AS ORGANIC ADDITIVE ON ELECTRODEPOSITION OF TIN.SURFACE & COATINGS TECHNOLOGY. VOL. 261. ISSUE . P. 337 -343 | 18 | 82% | 1 |
| 5 | SURVILA, A , MOCKUS, Z , KANAPECKAITE, S , STALNIONIS, G , (2012) KINETICS OF SN(II) REDUCTION IN ACID SULPHATE SOLUTIONS CONTAINING GLUCONIC ACID.JOURNAL OF ELECTROANALYTICAL CHEMISTRY. VOL. 667. ISSUE . P. 59 -65 | 21 | 70% | 9 |
| 6 | WALSH, FC , LOW, CTJ , (2016) A REVIEW OF DEVELOPMENTS IN THE ELECTRODEPOSITION OF TIN.SURFACE & COATINGS TECHNOLOGY. VOL. 288. ISSUE . P. 79 -94 | 28 | 50% | 0 |
| 7 | GOH, Y , HASEEB, ASMA , SABRI, MFM , (2013) EFFECTS OF HYDROQUINONE AND GELATIN ON THE ELECTRODEPOSITION OF SN-BI LOW TEMPERATURE PB-FREE SOLDER.ELECTROCHIMICA ACTA. VOL. 90. ISSUE . P. 265-273 | 19 | 70% | 19 |
| 8 | SURVILA, A , MOCKUS, Z , KANAPECKAITE, S , STALNIONIS, G , JUSKENAS, R , (2013) TIN PLATING IN ACID SN(II) GLUCONATE SOLUTIONS CONTAINING EXCESS OF SULPHATE.TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING. VOL. 91. ISSUE 4. P. 197 -201 | 20 | 74% | 1 |
| 9 | TSAI, YD , HU, CC , (2011) COMPOSITION CONTROL OF THE EUTECTIC SN-BASED ALLOYS: SN-AG, SN-CU, SN-AG-CU, FROM SIMPLE PLATING BATHS.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 158. ISSUE 8. P. D527 -D534 | 25 | 61% | 4 |
| 10 | SHARMA, A , JANG, YJ , JUNG, JP , (2015) EFFECT OF CURRENT DENSITY ON MORPHOLOGY OF ELECTROPLATED TIN.SURFACE ENGINEERING. VOL. 31. ISSUE 6. P. 458 -464 | 13 | 100% | 4 |
Classes with closest relation at Level 1 |