Class information for:
Level 1: ETCHING FACTOR//SPRAY ETCHING//42 ALLOY

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
27888 219 18.4 45%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
6 3       PHYSICS, APPLIED//IEEE TRANSACTIONS ON ELECTRON DEVICES//SILICON 155028
3149 2             CLEANROOM//PHOTORESIST REMOVAL//MINIENVIRONMENT 2235
27888 1                   ETCHING FACTOR//SPRAY ETCHING//42 ALLOY 219

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ETCHING FACTOR authKW 557724 2% 100% 4
2 SPRAY ETCHING authKW 446178 2% 80% 4
3 42 ALLOY authKW 278862 1% 100% 2
4 BOTTOM UP COST MODELING authKW 278862 1% 100% 2
5 ETCH FACTOR authKW 278862 1% 100% 2
6 PATTERN ELECTRODEPOSITION authKW 278862 1% 100% 2
7 POTASSIUM HEXAFLUOROSILICATE authKW 278862 1% 100% 2
8 PHOTOCHEMICAL MACHINING authKW 278858 2% 50% 4
9 MASS TRANSFER EFFECT authKW 209143 1% 50% 3
10 NITROPHOSPHATE authKW 209143 1% 50% 3

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Materials Science, Coatings & Films 1666 20% 0% 44
2 Electrochemistry 1496 22% 0% 49
3 Engineering, Manufacturing 1080 12% 0% 27
4 Engineering, Industrial 278 6% 0% 14
5 Mechanics 169 11% 0% 23
6 Materials Science, Multidisciplinary 152 21% 0% 46
7 Engineering, Mechanical 147 9% 0% 20
8 Thermodynamics 114 6% 0% 14
9 Nanoscience & Nanotechnology 91 8% 0% 17
10 Physics, Applied 81 15% 0% 33

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ABT BLWTP 139431 0% 100% 1
2 AIST TSUKUBA EAST 139431 0% 100% 1
3 BIOTECHNOL CHEM ENGN PROC TECHNOL 139431 0% 100% 1
4 CEPREI 139431 0% 100% 1
5 ENGN PANDHARPUR 139431 0% 100% 1
6 ENVIRONM CONSCIOUS DESIGN MFG SYST GRP 139431 0% 100% 1
7 EXCELLENCE NANOCHEM 139431 0% 100% 1
8 HBEREICH PROD 4 139431 0% 100% 1
9 MECNAN ENGN 139431 0% 100% 1
10 SODIUM FLUOSILICATE PLANT 139431 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 7073 18% 0% 39
2 RCA REVIEW 6530 1% 2% 3
3 KAGAKU KOGAKU RONBUNSHU 1988 4% 0% 8
4 MATHEMATICAL MODELLING 1491 1% 1% 2
5 INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING 1111 2% 0% 4
6 JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 1033 5% 0% 10
7 CIRP ANNALS-MANUFACTURING TECHNOLOGY 972 2% 0% 4
8 NUMERICAL HEAT TRANSFER PART B-FUNDAMENTALS 904 1% 0% 3
9 JOURNAL OF ENGINEERING MATHEMATICS 724 1% 0% 3
10 CIRCUIT WORLD 699 0% 1% 1

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 ETCHING FACTOR 557724 2% 100% 4 Search ETCHING+FACTOR Search ETCHING+FACTOR
2 SPRAY ETCHING 446178 2% 80% 4 Search SPRAY+ETCHING Search SPRAY+ETCHING
3 42 ALLOY 278862 1% 100% 2 Search 42+ALLOY Search 42+ALLOY
4 BOTTOM UP COST MODELING 278862 1% 100% 2 Search BOTTOM+UP+COST+MODELING Search BOTTOM+UP+COST+MODELING
5 ETCH FACTOR 278862 1% 100% 2 Search ETCH+FACTOR Search ETCH+FACTOR
6 PATTERN ELECTRODEPOSITION 278862 1% 100% 2 Search PATTERN+ELECTRODEPOSITION Search PATTERN+ELECTRODEPOSITION
7 POTASSIUM HEXAFLUOROSILICATE 278862 1% 100% 2 Search POTASSIUM+HEXAFLUOROSILICATE Search POTASSIUM+HEXAFLUOROSILICATE
8 PHOTOCHEMICAL MACHINING 278858 2% 50% 4 Search PHOTOCHEMICAL+MACHINING Search PHOTOCHEMICAL+MACHINING
9 MASS TRANSFER EFFECT 209143 1% 50% 3 Search MASS+TRANSFER+EFFECT Search MASS+TRANSFER+EFFECT
10 NITROPHOSPHATE 209143 1% 50% 3 Search NITROPHOSPHATE Search NITROPHOSPHATE

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 RATH, P , CHAI, JC , LAM, YC , MURUKESHAN, VM , ZHENG, H , (2007) A TOTAL CONCENTRATION FIXED-GRID METHOD FOR TWO-DIMENSIONAL WET CHEMICAL ETCHING.JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME. VOL. 129. ISSUE 4. P. 509-516 13 81% 3
2 DRIESEN, EH , KUERTEN, JGM , KUIKEN, HK , (2000) MASS TRANSPORT IN A PARTIALLY COVERED FLUID-FILLED CAVITY.INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER. VOL. 43. ISSUE 10. P. 1823-1835 15 79% 3
3 RATH, P , CHAI, JC , ZHENG, H , LAM, YC , MURUKESHAN, VM , (2006) MODELING TWO-DIMENSIONAL DIFFUSION-CONTROLLED WET CHEMICAL ETCHING USING A TOTAL CONCENTRATION APPROACH.INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER. VOL. 49. ISSUE 7-8. P. 1480-1488 13 65% 7
4 YEH, TK , TSAI, MH , WANG, MY , WENG, CK , (2008) IMPROVED SHAPE EVOLUTION OF COPPER INTERCONNECTS PREPARED BY JET-STREAM ETCHING.JOURNAL OF APPLIED ELECTROCHEMISTRY. VOL. 38. ISSUE 11. P. 1495-1500 11 73% 1
5 RATH, P , CHAI, JC , ZHENG, H , LAM, YC , MURUKESHAN, VM , (2006) TOTAL CONCENTRATION APPROACH FOR THREE-DIMENSIONAL DIFFUSION-CONTROLLED WET CHEMICAL ETCHING.INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER. VOL. 49. ISSUE 19-20. P. 3408-3416 13 65% 2
6 RATH, P , CHAI, JC , (2008) MODELING CONVECTION-DRIVEN DIFFUSION-CONTROLLED WET CHEMICAL ETCHING USING A TOTAL-CONCENTRATION FIXED-GRID METHOD.NUMERICAL HEAT TRANSFER PART B-FUNDAMENTALS. VOL. 53. ISSUE 2. P. 143-159 13 50% 3
7 ZHOU, YF , CHEN, SH , EDMOND, S , BOSSEBOEUF, A , (2013) DEEP WET ETCHING IN HYDROFLUORIC ACID, NITRIC ACID, AND ACETIC ACID OF CAVITIES IN A SILICON WAFER.JAPANESE JOURNAL OF APPLIED PHYSICS. VOL. 52. ISSUE 7. P. - 9 64% 0
8 KONDO, K , SUZUKI, Y , SAITO, T , OKAMOTO, N , KOYAMA, Y , (2009) SHAPE EVOLUTION OF ELECTRODEPOSITED BUMPS WITH SHALLOW AND DEEP CAVITIES.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 156. ISSUE 12. P. D548 -D552 7 88% 4
9 HAYASHI, K , FUKUI, K , TANAKA, Z , KONDO, K , (2001) SHAPE EVOLUTION OF ELECTRODEPOSITED BUMPS INTO DEEP CAVITIES.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 148. ISSUE 3. P. C145-C148 7 100% 8
10 KONDO, K , FUKUI, K , YOKOYAMA, M , SHINOHARA, K , (1997) SHAPE EVOLUTION OF ELECTRODEPOSITED COPPER BUMPS WITH HIGH PECLET NUMBERS.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 144. ISSUE 2. P. 466-470 8 100% 8

Classes with closest relation at Level 1


Rank Class id link
1 10633 ELECTROCHEMICAL MACHINING//ELECTROCHEMICAL MICROMACHINING//TOY GAME DESIGN
2 28150 TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING//ELECTROFORMING//ULTRASONIC ASSISTED JET ELECTRODEPOSITION
3 5989 COPPER ELECTRODEPOSITION//BOTTOM UP FILLING//SELF ANNEALING
4 18800 COMPUTAT THEORET FLUID DYNAM//METHOD OF SUPERPOSITION//BIORTHOGONALITY CONDITIONS
5 19855 ELECTROPLATING SYSTEM//ELECTROCHEMICAL REACTOR//RECIPROCATING PLATE AGITATOR
6 35841 QAS//2 CHLORO 1 1 2 TRIFLUOROETHYL METHYL ETHER//ANHYDROUS FLUORINE GAS
7 25791 TEXTURED INTERFACE//MICRORELIEF INTERFACE//BEIJING CONDENSD MATTER PHYS
8 11950 ANISOTROPIC ETCHING//MICRONANOSYST ENGN//MEMS MICRO NANO SYST
9 27344 WET ETCHING OF GLASS//DEEP GLASS ETCHING//NI HARD MASK
10 8494 HYDROGEN TERMINATION//NATIVE OXIDE//HYDRIDE SPECIES

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