Class information for:
Level 1: ANISOTROPIC ETCHING//MICRONANOSYST ENGN//MEMS MICRO NANO SYST

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
11950 943 20.5 57%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
376 3       SENSORS AND ACTUATORS A-PHYSICAL//JOURNAL OF MICROELECTROMECHANICAL SYSTEMS//MEMS 32422
308 2             JOURNAL OF MICROELECTROMECHANICAL SYSTEMS//MEMS//JOURNAL OF MICROMECHANICS AND MICROENGINEERING 18480
11950 1                   ANISOTROPIC ETCHING//MICRONANOSYST ENGN//MEMS MICRO NANO SYST 943

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ANISOTROPIC ETCHING authKW 1056275 9% 38% 87
2 MICRONANOSYST ENGN address 333044 1% 86% 12
3 MEMS MICRO NANO SYST address 269826 1% 83% 10
4 TMAH authKW 260900 4% 23% 35
5 ELECTROCHEMICAL ETCH STOP authKW 218558 1% 75% 9
6 SILICON ANISOTROPIC ETCHING authKW 218558 1% 75% 9
7 MICRO NANOSYST ENGN address 188386 1% 73% 8
8 ETCHING SIMULATION authKW 166522 1% 86% 6
9 CONVEX CORNER authKW 158656 1% 70% 7
10 CORNER COMPENSATION authKW 134913 1% 83% 5

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Instruments & Instrumentation 18151 43% 0% 409
2 Engineering, Electrical & Electronic 7190 51% 0% 481
3 Nanoscience & Nanotechnology 5752 27% 0% 252
4 Physics, Applied 3113 38% 0% 357
5 Materials Science, Coatings & Films 1907 11% 0% 100
6 Electrochemistry 1747 12% 0% 113
7 Materials Science, Multidisciplinary 1625 31% 0% 290
8 Mechanics 1263 13% 0% 127
9 Engineering, Mechanical 76 4% 0% 36
10 Physics, Condensed Matter 55 6% 0% 59

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 MICRONANOSYST ENGN 333044 1% 86% 12
2 MEMS MICRO NANO SYST 269826 1% 83% 10
3 MICRO NANOSYST ENGN 188386 1% 73% 8
4 MICRONANO MED DEVICES 103613 0% 80% 4
5 RIM SOLID STATE CHEM 67533 1% 19% 11
6 INTRUMENTAC IMAGEN MOL 64759 0% 100% 2
7 JIANGING SECT 64759 0% 100% 2
8 MEMS MICRONANO SYST 64759 0% 100% 2
9 YONSEI MICROSYST 64759 0% 100% 2
10 INTEGRAT SENSORS ACTUATORS 64755 0% 50% 4

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 SENSORS AND ACTUATORS A-PHYSICAL 94389 18% 2% 170
2 JOURNAL OF MICROMECHANICS AND MICROENGINEERING 91526 13% 2% 125
3 SENSORS AND MATERIALS 35313 4% 3% 34
4 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 10863 3% 1% 30
5 MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS 6015 3% 1% 25
6 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 5832 8% 0% 74
7 SENSORS AND ACTUATORS 2386 1% 1% 7
8 CANADIAN JOURNAL OF ELECTRICAL AND COMPUTER ENGINEERING-REVUE CANADIENNE DE GENIE ELECTRIQUE ET INFORMATIQUE 1606 1% 1% 5
9 MICROELECTRONICS JOURNAL 1196 1% 0% 12
10 MICRO & NANO LETTERS 977 1% 0% 7

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 ANISOTROPIC ETCHING 1056275 9% 38% 87 Search ANISOTROPIC+ETCHING Search ANISOTROPIC+ETCHING
2 TMAH 260900 4% 23% 35 Search TMAH Search TMAH
3 ELECTROCHEMICAL ETCH STOP 218558 1% 75% 9 Search ELECTROCHEMICAL+ETCH+STOP Search ELECTROCHEMICAL+ETCH+STOP
4 SILICON ANISOTROPIC ETCHING 218558 1% 75% 9 Search SILICON+ANISOTROPIC+ETCHING Search SILICON+ANISOTROPIC+ETCHING
5 ETCHING SIMULATION 166522 1% 86% 6 Search ETCHING+SIMULATION Search ETCHING+SIMULATION
6 CONVEX CORNER 158656 1% 70% 7 Search CONVEX+CORNER Search CONVEX+CORNER
7 CORNER COMPENSATION 134913 1% 83% 5 Search CORNER+COMPENSATION Search CORNER+COMPENSATION
8 KOH 119695 3% 13% 28 Search KOH Search KOH
9 ANISOTROPIC ETCHING OF SILICON 115638 1% 71% 5 Search ANISOTROPIC+ETCHING+OF+SILICON Search ANISOTROPIC+ETCHING+OF+SILICON
10 ANISOTROPIC WET CHEMICAL ETCHING 115638 1% 71% 5 Search ANISOTROPIC+WET+CHEMICAL+ETCHING Search ANISOTROPIC+WET+CHEMICAL+ETCHING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 FOSTER, AS , NIEMINEN, RM , TANAKA, H , GOSALVEZ, MA , SATO, K , (2007) AN ATOMISTIC INTRODUCTION TO ANISOTROPIC ETCHING.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 17. ISSUE 4. P. S1 -S26 49 88% 43
2 SMILJANIC, MM , RADJENOVIC, B , RADMILOVIC-RADJENOVIC, M , LAZIC, Z , JOVIC, V , (2014) SIMULATION AND EXPERIMENTAL STUDY OF MASKLESS CONVEX CORNER COMPENSATION IN TMAH WATER SOLUTION.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 24. ISSUE 11. P. - 40 95% 1
3 PAL, P , SATO, K , GOSALVEZ, MA , SHIKIDA, M , (2007) STUDY OF ROUNDED CONCAVE AND SHARP EDGE CONVEX CORNERS UNDERCUTTING IN CMOS COMPATIBLE ANISOTROPIC ETCHANTS.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 17. ISSUE 11. P. 2299 -2307 39 100% 16
4 MINEY, PG , CUNNANE, VJ , (2004) A STUDY OF THE PASSIVATION PEAK CURRENT DENSITY FOR (100) ORIENTED SILICON IN TETRAMETHYLAMMONIUM HYDROXIDE (TMAH): EFFECT OF TEMPERATURE, CONCENTRATION AND CARRIER TYPE.ELECTROCHIMICA ACTA. VOL. 49. ISSUE 7. P. 1009 -1018 42 100% 2
5 ROLA, KP , ZUBEL, I , (2013) TRITON SURFACTANT AS AN ADDITIVE TO KOH SILICON ETCHANT.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. VOL. 22. ISSUE 6. P. 1373-1382 34 92% 4
6 PAL, P , SATO, K , SHIKIDA, M , GOSALVEZ, MA , (2009) STUDY OF CORNER COMPENSATING STRUCTURES AND FABRICATION OF VARIOUS SHAPES OF MEMS STRUCTURES IN PURE AND SURFACTANT ADDED TMAH.SENSORS AND ACTUATORS A-PHYSICAL. VOL. 154. ISSUE 2. P. 192-203 35 92% 25
7 MINEY, PG , CUNNANE, VJ , (2003) A STUDY OF THE CHEMICAL BREAKDOWN OF THE ANODIC OXIDE FORMED ON (100) ORIENTED SILICON IN TETRAMETHYLAMMONIUM HYDROXIDE (TMAH) SOLUTIONS.ELECTROCHIMICA ACTA. VOL. 48. ISSUE 11. P. 1475-1482 43 93% 1
8 PAL, P , HALDAR, S , SINGH, SS , ASHOK, A , YAN, X , SATO, K , (2014) A DETAILED INVESTIGATION AND EXPLANATION OF THE APPEARANCE OF DIFFERENT UNDERCUT PROFILES IN KOH AND TMAH.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 24. ISSUE 9. P. - 29 97% 3
9 ZHOU, ZF , HUANG, QA , LI, WH , (2009) MODELING AND SIMULATIONS OF ANISOTROPIC ETCHING OF SILICON IN ALKALINE SOLUTIONS WITH EXPERIMENTAL VERIFICATION.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 156. ISSUE 2. P. F29 -F37 31 100% 9
10 SMILJANIC, MM , JOVIC, V , LAZIC, Z , (2012) MASKLESS CONVEX CORNER COMPENSATION TECHNIQUE ON A (100) SILICON SUBSTRATE IN A 25 WT% TMAH WATER SOLUTION.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 22. ISSUE 11. P. - 29 94% 3

Classes with closest relation at Level 1


Rank Class id link
1 9810 PRESSURE SENSOR//PIEZORESISTANCE//CAPACITIVE PRESSURE SENSOR
2 13493 CHAIR GEN MAT SCI//MACROPOROUS SILICON//ELECTROCHEMICAL ETCHING
3 8494 HYDROGEN TERMINATION//NATIVE OXIDE//HYDRIDE SPECIES
4 27888 ETCHING FACTOR//SPRAY ETCHING//42 ALLOY
5 5474 MEMS GYROSCOPE//GYROSCOPE//ANGULAR RATE SENSOR
6 2963 METAL ASSISTED CHEMICAL ETCHING//SILICON NANOWIRES//METAL ASSISTED ETCHING
7 18030 MICROHOTPLATE//MICROHEATER//MICRO GAS SENSOR
8 23603 ELECT ELECT MAT TECHNOL//CELL ADVANCING METHOD//LC ANALOGUE
9 20023 ELECTROSTATIC SUSPENSION//MICROMOTOR//ELECTROSTATIC MOTOR
10 22717 GALLIUM ORTHOPHOSPHATE//BAZNO2//CNRS UM2 ENSCM UM1 UMR5253

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