Class information for:
Level 1: CHEMICAL MECHANICAL POLISHING//CMP//CHEMICAL MECHANICAL PLANARIZATION

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
2701 2169 21.1 57%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
406 3       ENGINEERING, MANUFACTURING//INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE//CUTTING FORCE 29578
1656 2             CHEMICAL MECHANICAL POLISHING//CMP//GRINDING 6878
2701 1                   CHEMICAL MECHANICAL POLISHING//CMP//CHEMICAL MECHANICAL PLANARIZATION 2169

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 CHEMICAL MECHANICAL POLISHING authKW 3629783 17% 70% 369
2 CMP authKW 1799418 11% 55% 232
3 CHEMICAL MECHANICAL PLANARIZATION authKW 1167381 5% 82% 101
4 CHEMICAL MECHANICAL POLISHING CMP authKW 1126688 6% 65% 123
5 CHEMICAL MECHANICAL PLANARIZATION CMP authKW 538393 2% 75% 51
6 POLISHING PAD authKW 338223 1% 83% 29
7 DISHING authKW 306946 1% 84% 26
8 NANO SOI PROC address 255455 2% 55% 33
9 PLANARIZATION authKW 249263 3% 29% 62
10 REMOVAL RATE authKW 241142 3% 31% 56

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Materials Science, Coatings & Films 26760 25% 0% 552
2 Engineering, Manufacturing 11585 13% 0% 278
3 Electrochemistry 9979 18% 0% 401
4 Physics, Applied 7547 39% 0% 841
5 Materials Science, Multidisciplinary 3609 30% 0% 657
6 Engineering, Mechanical 2106 11% 0% 234
7 Nanoscience & Nanotechnology 1861 11% 0% 232
8 Engineering, Electrical & Electronic 1822 19% 0% 411
9 Physics, Condensed Matter 1738 17% 0% 359
10 Engineering, Industrial 504 3% 0% 63

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 NANO SOI PROC 255455 2% 55% 33
2 FAB 176863 1% 74% 17
3 ADV MAT PROC 126370 5% 8% 112
4 ENERGY OURCES TECHNOL 124129 1% 42% 21
5 SHENZHEN MICRO NANO MFG 100182 1% 65% 11
6 ADV SEMICOND MAT DEVICE DEV 74042 1% 48% 11
7 STATE TRIBOL 73932 4% 5% 97
8 GP TECHNOL 70381 0% 100% 5
9 ADV SEMICOND MAT DEVICES DEV 63070 1% 41% 11
10 SEMICOND DISPLAY 45043 0% 80% 4

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 60907 3% 6% 75
2 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 60462 17% 1% 359
3 ELECTROCHEMICAL AND SOLID STATE LETTERS 36903 5% 2% 106
4 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING 30204 3% 4% 58
5 MICROELECTRONIC ENGINEERING 27461 7% 1% 141
6 SOLID STATE TECHNOLOGY 20473 2% 3% 52
7 MICRO 11495 1% 7% 12
8 INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY 9303 0% 7% 10
9 CIRP ANNALS-MANUFACTURING TECHNOLOGY 4794 1% 1% 28
10 JAPANESE JOURNAL OF APPLIED PHYSICS 3773 3% 0% 66

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 CHEMICAL MECHANICAL POLISHING 3629783 17% 70% 369 Search CHEMICAL+MECHANICAL+POLISHING Search CHEMICAL+MECHANICAL+POLISHING
2 CMP 1799418 11% 55% 232 Search CMP Search CMP
3 CHEMICAL MECHANICAL PLANARIZATION 1167381 5% 82% 101 Search CHEMICAL+MECHANICAL+PLANARIZATION Search CHEMICAL+MECHANICAL+PLANARIZATION
4 CHEMICAL MECHANICAL POLISHING CMP 1126688 6% 65% 123 Search CHEMICAL+MECHANICAL+POLISHING+CMP Search CHEMICAL+MECHANICAL+POLISHING+CMP
5 CHEMICAL MECHANICAL PLANARIZATION CMP 538393 2% 75% 51 Search CHEMICAL+MECHANICAL+PLANARIZATION+CMP Search CHEMICAL+MECHANICAL+PLANARIZATION+CMP
6 POLISHING PAD 338223 1% 83% 29 Search POLISHING+PAD Search POLISHING+PAD
7 DISHING 306946 1% 84% 26 Search DISHING Search DISHING
8 PLANARIZATION 249263 3% 29% 62 Search PLANARIZATION Search PLANARIZATION
9 REMOVAL RATE 241142 3% 31% 56 Search REMOVAL+RATE Search REMOVAL+RATE
10 POST CMP CLEANING 221691 1% 75% 21 Search POST+CMP+CLEANING Search POST+CMP+CLEANING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 LEE, H , LEE, D , JEONG, H , (2016) MECHANICAL ASPECTS OF THE CHEMICAL MECHANICAL POLISHING PROCESS: A REVIEW.INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING. VOL. 17. ISSUE 4. P. 525 -536 73 94% 1
2 ZHAO, DW , LU, XC , (2013) CHEMICAL MECHANICAL POLISHING: THEORY AND EXPERIMENT.FRICTION. VOL. 1. ISSUE 4. P. 306 -326 76 93% 12
3 ZANTYE, PB , KUMAR, A , SIKDER, AK , (2004) CHEMICAL MECHANICAL PLANARIZATION FOR MICROELECTRONICS APPLICATIONS.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 45. ISSUE 3-6. P. 89 -220 99 64% 244
4 XU, QZ , CHEN, L , (2015) A MATERIAL REMOVAL RATE MODEL FOR ALUMINUM GATE CHEMICAL MECHANICAL PLANARIZATION.ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY. VOL. 4. ISSUE 3. P. P101 -P107 59 98% 2
5 SRINIVASAN, R , DANDU, PVR , BABU, SV , (2015) SHALLOW TRENCH ISOLATION CHEMICAL MECHANICAL PLANARIZATION: A REVIEW.ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY. VOL. 4. ISSUE 11. P. P5029 -P5039 61 82% 2
6 XU, QZ , CHEN, L , FANG, JJ , YANG, F , (2015) A CHEMICAL MECHANICAL PLANARIZATION MODEL FOR ALUMINUM GATE STRUCTURES.MICROELECTRONIC ENGINEERING. VOL. 131. ISSUE . P. 58 -67 52 91% 3
7 KWON, TY , RAMACHANDRAN, M , PARK, JG , (2013) SCRATCH FORMATION AND ITS MECHANISM IN CHEMICAL MECHANICAL PLANARIZATION (CMP).FRICTION. VOL. 1. ISSUE 4. P. 279 -305 56 85% 9
8 WANG, Y , ZHAO, YW , CHEN, X , (2012) CHEMICAL MECHANICAL PLANARIZATION FROM MACRO-SCALE TO MOLECULAR-SCALE.MATERIALS AND MANUFACTURING PROCESSES. VOL. 27. ISSUE 6. P. 641 -649 53 93% 7
9 KRISHNAN, M , NALASKOWSKI, JW , COOK, LM , (2010) CHEMICAL MECHANICAL PLANARIZATION: SLURRY CHEMISTRY, MATERIALS, AND MECHANISMS.CHEMICAL REVIEWS. VOL. 110. ISSUE 1. P. 178 -204 58 67% 102
10 XU, QZ , FANG, JJ , CHEN, L , (2016) A CHIP-SCALE CHEMICAL MECHANICAL PLANARIZATION MODEL FOR COPPER INTERCONNECT STRUCTURES.MICROELECTRONIC ENGINEERING. VOL. 149. ISSUE . P. 14 -24 38 93% 0

Classes with closest relation at Level 1


Rank Class id link
1 9310 ABRASIVE FLOW MACHINING//MAGNETIC ABRASIVE FINISHING//BONNET POLISHING
2 21221 WIRE SAWING//MAKYOH TOPOGRAPHY//MULTI WIRE SAWING
3 4642 BRASS//COPPER CORROSION//BENZOTRIAZOLE
4 24284 CERAMIC BALLS//CERAMIC BEARINGS//MAGNETIC FLOAT POLISHING MFP
5 33538 DEBRIS PARTICLES//UNIT ENVIRONM CATALYZES PROC ANAL//MAT PHYS NANOMAT PL ENVIRONM L HYMNE
6 21308 BEAM CHANNEL TRANSISTOR//MEMORY DEVICE BUSINESS//IMPURITY ENHANCED OXIDATION
7 33074 TIGHT BINDING QUANTUM CHEMICAL MOLECULAR DYNAMICS//COMBINATORIAL COMPUTATIONAL CHEMISTRY//TIGHT BINDING QUANTUM CHEMICAL MOLECULAR DYNAMICS METHOD
8 34813 ELECTROSTATIC CHUCK//PIN CHUCK//WAFER FLATNESS
9 5989 COPPER ELECTRODEPOSITION//BOTTOM UP FILLING//SELF ANNEALING
10 3427 DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE

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