Class information for:
Level 1: WIRE SAWING//MAKYOH TOPOGRAPHY//MULTI WIRE SAWING

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
21221 428 17.7 47%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
406 3       ENGINEERING, MANUFACTURING//INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE//CUTTING FORCE 29578
1656 2             CHEMICAL MECHANICAL POLISHING//CMP//GRINDING 6878
21221 1                   WIRE SAWING//MAKYOH TOPOGRAPHY//MULTI WIRE SAWING 428

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 WIRE SAWING authKW 1245253 6% 73% 24
2 MAKYOH TOPOGRAPHY authKW 719377 3% 92% 11
3 MULTI WIRE SAWING authKW 594525 2% 83% 10
4 SILICON WAFER authKW 416943 11% 13% 46
5 SEMICONDUCTOR MATERIAL authKW 236984 3% 24% 14
6 WAFER PRODUCTION authKW 228297 1% 80% 4
7 DIAMOND WIRE authKW 218481 2% 44% 7
8 DICING BLADE authKW 214030 1% 100% 3
9 WIRE SAW MACHINING authKW 214030 1% 100% 3
10 DIE STRENGTH authKW 190246 1% 67% 4

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 Engineering, Manufacturing 12782 30% 0% 128
2 Engineering, Mechanical 2495 25% 0% 107
3 Materials Science, Multidisciplinary 950 34% 0% 147
4 Physics, Applied 747 29% 0% 122
5 Engineering, Electrical & Electronic 391 20% 0% 84
6 Nanoscience & Nanotechnology 371 11% 0% 46
7 Engineering, Industrial 310 5% 0% 21
8 Instruments & Instrumentation 289 9% 0% 38
9 Materials Science, Ceramics 278 5% 0% 23
10 Automation & Control Systems 185 5% 0% 20

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 LEADERS GLOBAL OPERAT 142687 0% 100% 2
2 METROL SYST 142687 0% 100% 2
3 ADV MFG SCI AMS 71343 0% 100% 1
4 AUTOMATISIERUNGSTECH GMBH 71343 0% 100% 1
5 BO POWER TOOLS ACCESSORIES 71343 0% 100% 1
6 DISRUPT ELECT PLICAT 71343 0% 100% 1
7 ENGN MOLDING PROD 71343 0% 100% 1
8 GEO UMWELTNATURWISSEN AFTEN 71343 0% 100% 1
9 GEWOWISS 71343 0% 100% 1
10 KRISTALLOG GEOWISS 71343 0% 100% 1

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 INDUSTRIAL DIAMOND REVIEW 21872 2% 3% 9
2 INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE 15430 7% 1% 28
3 SOLID STATE TECHNOLOGY 7531 3% 1% 14
4 GEC-JOURNAL OF SCIENCE & TECHNOLOGY 6484 0% 9% 1
5 PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY 6092 3% 1% 11
6 JOURNAL OF ELECTRONIC PACKAGING 4673 2% 1% 9
7 MACHINING SCIENCE AND TECHNOLOGY 3375 1% 1% 5
8 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 2882 1% 1% 4
9 GALVANOTECHNIK 2742 0% 4% 1
10 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY 2304 4% 0% 19

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 WIRE SAWING 1245253 6% 73% 24 Search WIRE+SAWING Search WIRE+SAWING
2 MAKYOH TOPOGRAPHY 719377 3% 92% 11 Search MAKYOH+TOPOGRAPHY Search MAKYOH+TOPOGRAPHY
3 MULTI WIRE SAWING 594525 2% 83% 10 Search MULTI+WIRE+SAWING Search MULTI+WIRE+SAWING
4 SILICON WAFER 416943 11% 13% 46 Search SILICON+WAFER Search SILICON+WAFER
5 SEMICONDUCTOR MATERIAL 236984 3% 24% 14 Search SEMICONDUCTOR+MATERIAL Search SEMICONDUCTOR+MATERIAL
6 WAFER PRODUCTION 228297 1% 80% 4 Search WAFER+PRODUCTION Search WAFER+PRODUCTION
7 DIAMOND WIRE 218481 2% 44% 7 Search DIAMOND+WIRE Search DIAMOND+WIRE
8 DICING BLADE 214030 1% 100% 3 Search DICING+BLADE Search DICING+BLADE
9 WIRE SAW MACHINING 214030 1% 100% 3 Search WIRE+SAW+MACHINING Search WIRE+SAW+MACHINING
10 DIE STRENGTH 190246 1% 67% 4 Search DIE+STRENGTH Search DIE+STRENGTH

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref.
in cl.		 Shr. of ref. in
cl.		 Citations
1 PEI, ZJ , FISHER, GR , LIU, J , (2008) GRINDING OF SILICON WAFERS: A REVIEW FROM HISTORICAL PERSPECTIVES.INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE. VOL. 48. ISSUE 12-13. P. 1297-1307 26 93% 40
2 WU, H , (2016) WIRE SAWING TECHNOLOGY: A STATE-OF-THE-ART REVIEW.PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY. VOL. 43. ISSUE . P. 1 -9 28 56% 2
3 RIESZ, F , (2003) MAKYOH TOPOGRAPHY: A SIMPLE YET POWERFUL OPTICAL METHOD FOR SURFACE FLATNESS AND DEFECT CHARACTERISATION.DEFECTS AND DIFFUSION IN SEMICONDUCTORS: AN ANNUAL RETROSPECTIVE VI. VOL. 221-2. ISSUE . P. 51 -61 29 85% 1
4 YAO, CY , PENG, W , LIU, FQ , (2013) FORMULATION AND IMPLEMENTATION OF ENERGY EFFICIENT ULTRAVIOLET CURING FOR PHOTOSENSITIVE RESIN-BOUND DIAMOND WIRE SAWS.MATHEMATICAL PROBLEMS IN ENGINEERING. VOL. . ISSUE . P. - 15 94% 0
5 TEOMETE, E , (2011) INVESTIGATION OF LONG WAVINESS INDUCED BY THE WIRE SAW PROCESS.PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE. VOL. 225. ISSUE B7. P. 1153-1162 14 93% 4
6 LIU, TY , GE, PQ , GAO, YF , BI, WB , (2017) DEPTH OF CUT FOR SINGLE ABRASIVE AND CUTTING FORCE IN RESIN BONDED DIAMOND WIRE SAWING.INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY. VOL. 88. ISSUE 5-8. P. 1763 -1773 17 68% 0
7 ZHU, XL , KANG, RK , FENG, G , LV, HM , (2011) RESEARCH ON TOPOGRAPHY CONTROL OF TWO-SPINDLE AND THREE-WORKSTATION WAFER GRINDER.PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE. VOL. 225. ISSUE C9. P. 2232-2241 13 100% 0
8 GAO, YF , GE, PQ , LIU, TY , (2016) EXPERIMENT STUDY ON ELECTROPLATED DIAMOND WIRE SAW SLICING SINGLE-CRYSTAL SILICON.MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. VOL. 56. ISSUE . P. 106 -114 14 82% 0
9 RIESZ, F , (2013) NON-LINEARITY AND RELATED FEATURES OF MAKYOH (MAGIC-MIRROR) IMAGING.JOURNAL OF OPTICS. VOL. 15. ISSUE 7. P. - 12 86% 0
10 GAO, S , KANG, RK , DONG, ZG , ZHANG, B , (2013) EDGE CHIPPING OF SILICON WAFERS IN DIAMOND GRINDING.INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE. VOL. 64. ISSUE . P. 31 -37 10 100% 3

Classes with closest relation at Level 1


Rank Class id link
1 6736 NANOMETRIC CUTTING//DUCTILE MODE MACHINING//NANOCUTTING
2 4779 GRINDING//GRINDING WHEEL//CENTERLESS GRINDING
3 36793 MAT SCI TECHNOL VITREOUS MAT//ISOPLANAR OPTICAL SYSTEM//EIKONAL THEORY
4 20633 DIAMOND BURS//HIGH SPEED EQUIPMENT//AIR TURBINE HANDPIECE
5 14700 VITRIFIED BOND//INDUSTRIAL DIAMOND REVIEW//PROVINCIAL KEY STONE MACHINING
6 24200 NONCONTACT HANDLING//BERNOULLI GRIPPER//VORTEX GRIPPER
7 24284 CERAMIC BALLS//CERAMIC BEARINGS//MAGNETIC FLOAT POLISHING MFP
8 16327 METALLURGICAL GRADE SILICON//SOLAR GRADE SILICON//SOLVENT REFINING
9 13411 DYNAMIC FRACTURE//INTERSONIC CRACK PROPAGATION//SELF SIMILAR FUNCTIONS
10 2701 CHEMICAL MECHANICAL POLISHING//CMP//CHEMICAL MECHANICAL PLANARIZATION

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