Class information for:
Level 2: CHEMICAL MECHANICAL POLISHING//CMP//GRINDING

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
1656 6878 19.0 49%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
406 3       ENGINEERING, MANUFACTURING//INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE//CUTTING FORCE 29578
1656 2             CHEMICAL MECHANICAL POLISHING//CMP//GRINDING 6878
2701 1                   CHEMICAL MECHANICAL POLISHING//CMP//CHEMICAL MECHANICAL PLANARIZATION 2169
4779 1                   GRINDING//GRINDING WHEEL//CENTERLESS GRINDING 1728
9310 1                   ABRASIVE FLOW MACHINING//MAGNETIC ABRASIVE FINISHING//BONNET POLISHING 1168
14700 1                   VITRIFIED BOND//INDUSTRIAL DIAMOND REVIEW//PROVINCIAL KEY STONE MACHINING 755
20633 1                   DIAMOND BURS//HIGH SPEED EQUIPMENT//AIR TURBINE HANDPIECE 451
21221 1                   WIRE SAWING//MAKYOH TOPOGRAPHY//MULTI WIRE SAWING 428
29822 1                   VIBRATORY FINISHING//EDGE CHIPPING//MASS FINISHING 179

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 CHEMICAL MECHANICAL POLISHING authKW 1175386 5% 71% 374
2 CMP authKW 572036 3% 55% 233
3 GRINDING authKW 540607 8% 23% 528
4 CHEMICAL MECHANICAL PLANARIZATION authKW 375324 1% 83% 102
5 CHEMICAL MECHANICAL POLISHING CMP authKW 355136 2% 65% 123
6 POLISHING authKW 320537 3% 32% 224
7 MATERIAL REMOVAL authKW 250825 1% 59% 96
8 GRINDING WHEEL authKW 244033 1% 62% 89
9 ENGINEERING, MANUFACTURING WoSSC 227135 31% 2% 2162
10 ABRASIVE FLOW MACHINING authKW 183385 1% 92% 45

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 Engineering, Manufacturing 227135 31% 2% 2162
2 Engineering, Mechanical 33959 23% 1% 1588
3 Engineering, Industrial 13755 8% 1% 547
4 Materials Science, Multidisciplinary 10737 29% 0% 2027
5 Materials Science, Coatings & Films 9607 9% 0% 612
6 Materials Science, Ceramics 8948 7% 0% 512
7 Automation & Control Systems 7757 7% 0% 501
8 Materials Science, Composites 5653 4% 0% 300
9 Physics, Applied 3246 17% 0% 1137
10 Electrochemistry 2885 6% 0% 417

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 NANO SOI PROC 80513 0% 55% 33
2 PROVINCIAL KEY STONE MACHINING 75440 0% 100% 17
3 KEY STONE MACHINING 57983 0% 93% 14
4 FAB 55751 0% 74% 17
5 ADV MAT PROC 41859 2% 8% 115
6 ENGN HIGH EFFICIENCY GRINDING 41355 0% 55% 17
7 ENERGY OURCES TECHNOL 39116 0% 42% 21
8 ULTR RECIS SCI TECHNOL 35969 0% 34% 24
9 AMTREL 32674 0% 82% 9
10 SHENZHEN MICRO NANO MFG 31578 0% 65% 11

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 INDUSTRIAL DIAMOND REVIEW 178204 1% 39% 103
2 INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE 172098 5% 10% 375
3 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY 84493 7% 4% 460
4 CIRP ANNALS-MANUFACTURING TECHNOLOGY 66391 3% 8% 185
5 MACHINING SCIENCE AND TECHNOLOGY 57870 1% 16% 83
6 KEY ENGINEERING MATERIALS 37748 4% 3% 291
7 INTERNATIONAL JOURNAL OF THE JAPAN SOCIETY FOR PRECISION ENGINEERING 35833 1% 15% 53
8 JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 34124 5% 2% 322
9 PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY 25856 1% 6% 91
10 PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE 20473 2% 4% 123

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 CHEMICAL MECHANICAL POLISHING 1175386 5% 71% 374 Search CHEMICAL+MECHANICAL+POLISHING Search CHEMICAL+MECHANICAL+POLISHING
2 CMP 572036 3% 55% 233 Search CMP Search CMP
3 GRINDING 540607 8% 23% 528 Search GRINDING Search GRINDING
4 CHEMICAL MECHANICAL PLANARIZATION 375324 1% 83% 102 Search CHEMICAL+MECHANICAL+PLANARIZATION Search CHEMICAL+MECHANICAL+PLANARIZATION
5 CHEMICAL MECHANICAL POLISHING CMP 355136 2% 65% 123 Search CHEMICAL+MECHANICAL+POLISHING+CMP Search CHEMICAL+MECHANICAL+POLISHING+CMP
6 POLISHING 320537 3% 32% 224 Search POLISHING Search POLISHING
7 MATERIAL REMOVAL 250825 1% 59% 96 Search MATERIAL+REMOVAL Search MATERIAL+REMOVAL
8 GRINDING WHEEL 244033 1% 62% 89 Search GRINDING+WHEEL Search GRINDING+WHEEL
9 ABRASIVE FLOW MACHINING 183385 1% 92% 45 Search ABRASIVE+FLOW+MACHINING Search ABRASIVE+FLOW+MACHINING
10 CHEMICAL MECHANICAL PLANARIZATION CMP 169714 1% 75% 51 Search CHEMICAL+MECHANICAL+PLANARIZATION+CMP Search CHEMICAL+MECHANICAL+PLANARIZATION+CMP

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref. in
cl.		 Shr. of ref. in
cl.		 Citations
1 WEGENER, K , HOFFMEISTER, HW , KARPUSCHEWSKI, B , KUSTER, F , HAHMANN, WC , RABIEY, M , (2011) CONDITIONING AND MONITORING OF GRINDING WHEELS.CIRP ANNALS-MANUFACTURING TECHNOLOGY. VOL. 60. ISSUE 2. P. 757 -777 103 91% 49
2 LEE, H , LEE, D , JEONG, H , (2016) MECHANICAL ASPECTS OF THE CHEMICAL MECHANICAL POLISHING PROCESS: A REVIEW.INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING. VOL. 17. ISSUE 4. P. 525 -536 74 95% 1
3 ZHAO, DW , LU, XC , (2013) CHEMICAL MECHANICAL POLISHING: THEORY AND EXPERIMENT.FRICTION. VOL. 1. ISSUE 4. P. 306 -326 76 93% 12
4 LI, HN , AXINTE, D , (2016) TEXTURED GRINDING WHEELS: A REVIEW.INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE. VOL. 109. ISSUE . P. 8 -35 76 85% 0
5 ZANTYE, PB , KUMAR, A , SIKDER, AK , (2004) CHEMICAL MECHANICAL PLANARIZATION FOR MICROELECTRONICS APPLICATIONS.MATERIALS SCIENCE & ENGINEERING R-REPORTS. VOL. 45. ISSUE 3-6. P. 89 -220 99 64% 244
6 XU, QZ , CHEN, L , (2015) A MATERIAL REMOVAL RATE MODEL FOR ALUMINUM GATE CHEMICAL MECHANICAL PLANARIZATION.ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY. VOL. 4. ISSUE 3. P. P101 -P107 59 98% 2
7 BRINKSMEIER, E , AURICH, JC , GOVEKAR, E , HEINZEL, C , HOFFMEISTER, HW , KLOCKE, F , PETERS, J , RENTSCH, R , STEPHENSON, DJ , UHLMANN, E , ET AL (2006) ADVANCES IN MODELING AND SIMULATION OF GRINDING PROCESSES.CIRP ANNALS-MANUFACTURING TECHNOLOGY. VOL. 55. ISSUE 2. P. 667-696 69 81% 107
8 SRINIVASAN, R , DANDU, PVR , BABU, SV , (2015) SHALLOW TRENCH ISOLATION CHEMICAL MECHANICAL PLANARIZATION: A REVIEW.ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY. VOL. 4. ISSUE 11. P. P5029 -P5039 61 82% 2
9 XU, QZ , CHEN, L , FANG, JJ , YANG, F , (2015) A CHEMICAL MECHANICAL PLANARIZATION MODEL FOR ALUMINUM GATE STRUCTURES.MICROELECTRONIC ENGINEERING. VOL. 131. ISSUE . P. 58 -67 52 91% 3
10 WANG, Y , ZHAO, YW , CHEN, X , (2012) CHEMICAL MECHANICAL PLANARIZATION FROM MACRO-SCALE TO MOLECULAR-SCALE.MATERIALS AND MANUFACTURING PROCESSES. VOL. 27. ISSUE 6. P. 641 -649 54 95% 7

Classes with closest relation at Level 2


Rank Class id link
1 471 ENGINEERING, MANUFACTURING//CUTTING FORCE//TOOL WEAR
2 1676 NANOINDENTATION//INDENTATION//SPHERICAL INDENTATION
3 2850 SCANNING ELECTROCHEMICAL MICROSCOPY//ELECTROCHEMICAL MACHINING//SECM
4 2552 CAVITATION EROSION//SOLID PARTICLE EROSION//WEAR
5 3149 CLEANROOM//PHOTORESIST REMOVAL//MINIENVIRONMENT
6 1771 LASER INDUCED DAMAGE//ELLIPSOMETRY//APPLIED OPTICS
7 362 WEAR//JOURNAL OF TRIBOLOGY-TRANSACTIONS OF THE ASME//FRETTING FATIGUE
8 3051 LAMINATED GLASS//STRUCTURAL GLASS//GLASS STRENGTH
9 2642 THROUGH SILICON VIA TSV//WAFER BONDING//THROUGH SILICON VIA
10 1223 PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY//THERMAL ERROR//COORDINATE MEASURING MACHINE

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