Class information for:
Level 2: IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY//ELECTROSTATIC DISCHARGE ESD//REVERBERATION CHAMBER

Basic class information

Class id #P Avg. number of
references
Database coverage
of references
1426 7939 16.3 42%



Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes

The table includes all classes above and classes immediately below the current class.



Cluster id Level Cluster label #P
10 4 OPTICS//PHYSICS, PARTICLES & FIELDS//PHYSICS, MULTIDISCIPLINARY 1131262
42 3       IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION//MICROWAVE AND OPTICAL TECHNOLOGY LETTERS//ENGINEERING, ELECTRICAL & ELECTRONIC 97664
1426 2             IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY//ELECTROSTATIC DISCHARGE ESD//REVERBERATION CHAMBER 7939
5646 1                   HIGH SPEED INTERCONNECTS//NONUNIFORM TRANSMISSION LINES//MULTICONDUCTOR TRANSMISSION LINES 1593
10961 1                   ELECTROSTATIC DISCHARGE ESD//SILICON CONTROLLED RECTIFIER SCR//NANOELECT GIGASCALE SYST 1021
11170 1                   SIMULTANEOUS SWITCHING NOISE//SIMULTANEOUS SWITCHING NOISE SSN//SIGNAL INTEGRITY 1003
16332 1                   IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY//SHIELDING EFFECTIVENESS//SHIELDING EFFECTIVENESS SE 660
17149 1                   SUBSTRATE NOISE//SUBSTRATE COUPLING//POWER SUPPLY NOISE 615
17502 1                   ANTENNA FACTOR//TEM CELL//IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY 596
18544 1                   REVERBERATION CHAMBER//REVERBERATION CHAMBER RC//MODE STIRRED CHAMBER 547
19578 1                   PARTIAL ELEMENT EQUIVALENT CIRCUIT PEEC//PEEC//MODEL ORDER REDUCTION MOR 499
22116 1                   ELECTROSTATIC DISCHARGE//KKU SEAGATE COOPERAT//ESD 392
24269 1                   INTENTIONAL ELECTROMAGNETIC INTERFERENCE IEMI//SEMICONDUCTOR BRIDGE//HIGH POWER ELECTROMAGNETIC HPEM 318
24750 1                   DIRECT POWER INJECTION DPI//AFDELING ESAT MICAS//IMMUNITY TO ELECTROMAGNETIC INTERFERENCES 302
24989 1                   IMBALANCE DIFFERENCE MODEL//COMMON MODE RADIATION//COMMON MODE CURRENT 294
35294 1                   AM RADIO//BAUM LIU TESCHE BLT//BIFILAR DESIGNS 99

Terms with highest relevance score



rank Term termType Chi square Shr. of publ. in
class containing
term
Class's shr. of
term's tot. occurrences
#P with term
in class
1 IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY journal 2362403 17% 45% 1380
2 ELECTROSTATIC DISCHARGE ESD authKW 740962 3% 70% 277
3 REVERBERATION CHAMBER authKW 631677 2% 86% 191
4 SIGNAL INTEGRITY authKW 380908 2% 53% 186
5 ELECTROSTATIC DISCHARGE authKW 265233 2% 49% 141
6 SILICON CONTROLLED RECTIFIER SCR authKW 244763 1% 86% 74
7 SIMULTANEOUS SWITCHING NOISE authKW 238428 1% 89% 70
8 SUBSTRATE NOISE authKW 237910 1% 76% 81
9 POWER INTEGRITY authKW 224995 1% 86% 68
10 NANOELECT GIGASCALE SYST address 222789 1% 71% 82

Web of Science journal categories



Rank Term Chi square Shr. of publ. in
class containing
term
Class's shr. of
term's tot. occurrences
#P with term
in class
1 Engineering, Electrical & Electronic 178076 85% 1% 6774
2 Telecommunications 98993 30% 1% 2362
3 Computer Science, Hardware & Architecture 11021 7% 1% 546
4 Physics, Applied 3487 16% 0% 1276
5 Engineering, Manufacturing 2960 4% 0% 286
6 Nanoscience & Nanotechnology 1068 5% 0% 388
7 Computer Science, Interdisciplinary Applications 891 4% 0% 278
8 Instruments & Instrumentation 480 3% 0% 263
9 Engineering, General 348 2% 0% 169
10 Optics 263 4% 0% 311

Address terms



Rank Term Chi square Shr. of publ. in
class containing
term
Class's shr. of
term's tot. occurrences
#P with term
in class
1 NANOELECT GIGASCALE SYST 222789 1% 71% 82
2 UAQ EMC 138359 1% 67% 54
3 ELE OMAGNET COMPATIBIL 100186 1% 45% 58
4 ESD 45633 0% 42% 28
5 TERAHERTZ INTERCONNECT PACKAGE 34587 0% 60% 15
6 ELECT CAD 29982 0% 35% 22
7 THEORET ELEKTROTECH 28162 0% 33% 22
8 KKU SEAGATE COOPERAT 27669 0% 60% 12
9 CORP ESD 24600 0% 80% 8
10 ELECT ENGN 22033 15% 1% 1181

Journals



Rank Term Chi square Shr. of publ. in
class containing
term
Class's shr. of
term's tot. occurrences
#P with term
in class
1 IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY 2362403 17% 45% 1380
2 IEEE TRANSACTIONS ON ADVANCED PACKAGING 180367 3% 22% 218
3 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES 80666 7% 4% 517
4 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 61825 2% 11% 147
5 MICROELECTRONICS RELIABILITY 50925 4% 4% 304
6 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING 42300 1% 17% 65
7 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 32999 1% 9% 96
8 IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS 25101 2% 4% 179
9 JOURNAL OF ELECTROSTATICS 20507 1% 5% 118
10 JOURNAL OF ELECTROMAGNETIC WAVES AND APPLICATIONS 16071 2% 3% 129

Author Key Words



Rank Term Chi square Shr. of publ. in
class containing
term
Class's shr. of
term's tot. occurrences
#P with
term in
class
LCSH search Wikipedia search
1 ELECTROSTATIC DISCHARGE ESD 740962 3% 70% 277 Search ELECTROSTATIC+DISCHARGE+ESD Search ELECTROSTATIC+DISCHARGE+ESD
2 REVERBERATION CHAMBER 631677 2% 86% 191 Search REVERBERATION+CHAMBER Search REVERBERATION+CHAMBER
3 SIGNAL INTEGRITY 380908 2% 53% 186 Search SIGNAL+INTEGRITY Search SIGNAL+INTEGRITY
4 ELECTROSTATIC DISCHARGE 265233 2% 49% 141 Search ELECTROSTATIC+DISCHARGE Search ELECTROSTATIC+DISCHARGE
5 SILICON CONTROLLED RECTIFIER SCR 244763 1% 86% 74 Search SILICON+CONTROLLED+RECTIFIER+SCR Search SILICON+CONTROLLED+RECTIFIER+SCR
6 SIMULTANEOUS SWITCHING NOISE 238428 1% 89% 70 Search SIMULTANEOUS+SWITCHING+NOISE Search SIMULTANEOUS+SWITCHING+NOISE
7 SUBSTRATE NOISE 237910 1% 76% 81 Search SUBSTRATE+NOISE Search SUBSTRATE+NOISE
8 POWER INTEGRITY 224995 1% 86% 68 Search POWER+INTEGRITY Search POWER+INTEGRITY
9 SIMULTANEOUS SWITCHING NOISE SSN 203421 1% 84% 63 Search SIMULTANEOUS+SWITCHING+NOISE+SSN Search SIMULTANEOUS+SWITCHING+NOISE+SSN
10 REVERBERATION CHAMBER RC 191349 1% 89% 56 Search REVERBERATION+CHAMBER+RC Search REVERBERATION+CHAMBER+RC

Core articles

The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.



Rank Reference # ref.
in cl.
Shr. of ref. in
cl.
Citations
1 WU, TL , BUESINK, F , CANAVERO, F , (2013) OVERVIEW OF SIGNAL INTEGRITY AND EMC DESIGN TECHNOLOGIES ON PCB: FUNDAMENTALS AND LATEST PROGRESS.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 55. ISSUE 4. P. 624 -638 59 74% 22
2 ACHAR, R , NAKHLA, MS , (2001) SIMULATION OF HIGH-SPEED INTERCONNECTS.PROCEEDINGS OF THE IEEE. VOL. 89. ISSUE 5. P. 693 -728 52 88% 326
3 WU, TL , CHUANG, HH , WANG, TK , (2010) OVERVIEW OF POWER INTEGRITY SOLUTIONS ON PACKAGE AND PCB: DECOUPLING AND EBG ISOLATION.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 52. ISSUE 2. P. 346 -356 45 92% 73
4 AFZALI-KUSHA, A , NAGATA, M , VERGHESE, NK , ALLSTOT, DJ , (2006) SUBSTRATE NOISE COUPLING IN SOC DESIGN: MODELING, AVOIDANCE, AND VALIDATION.PROCEEDINGS OF THE IEEE. VOL. 94. ISSUE 12. P. 2109 -2138 49 89% 43
5 MANFREDI, P , DE ZUTTER, D , GINSTE, DV , (2016) ANALYSIS OF NONUNIFORM TRANSMISSION LINES WITH AN ITERATIVE AND ADAPTIVE PERTURBATION TECHNIQUE.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 58. ISSUE 3. P. 859 -867 36 90% 0
6 MOGLIE, F , BASTIANELLI, L , PRIMIANI, VM , (2016) RELIABLE FINITE-DIFFERENCE TIME-DOMAIN SIMULATIONS OF REVERBERATION CHAMBERS BY USING EQUIVALENT VOLUMETRIC LOSSES.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 58. ISSUE 3. P. 653 -660 31 94% 1
7 PRIMIANI, VM , MOGLIE, F , (2012) NUMERICAL SIMULATION OF REVERBERATION CHAMBER PARAMETERS AFFECTING THE RECEIVED POWER STATISTICS.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 54. ISSUE 3. P. 522 -532 34 97% 8
8 RAMDANI, M , SICARD, E , BOYER, A , BEN DHIA, S , WHALEN, JJ , HUBING, TH , COENEN, M , WADA, O , (2009) THE ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS-PAST, PRESENT, AND FUTURE.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 51. ISSUE 1. P. 78-100 36 82% 85
9 WANG, CD , WU, TL , (2013) MODEL AND MECHANISM OF MINIATURIZED AND STOPBAND-ENHANCED INTERLEAVED EBG STRUCTURE FOR POWER/GROUND NOISE SUPPRESSION.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 55. ISSUE 1. P. 159-167 28 100% 11
10 ZHANG, MS , TAN, HZ , MAO, JF , (2014) A NOVEL LAYER STACK-UP WITH FREE CAVITY RESONANCE FOR HIGH-PERFORMANCE POWER NOISE SUPPRESSION.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 4. ISSUE 12. P. 1973 -1980 30 97% 0

Classes with closest relation at Level 2



Rank Class id link
1 2621 IEEE TRANSACTIONS ON POWER DELIVERY//GROUNDING SYSTEM//AMPACITY
2 1449 ABSORBING BOUNDARY CONDITIONS//PERFECTLY MATCHED LAYER//FINITE DIFFERENCE TIME DOMAIN FDTD METHOD
3 3391 SIX PORT//SIX PORT REFLECTOMETER//VECTOR NETWORK ANALYZER VNA
4 1987 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES//LEAKY WAVE ANTENNAS//NRD GUIDE
5 717 IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION//ELECTROMAGNETIC SCATTERING//METHOD OF MOMENTS MOM
6 2364 IEEE JOURNAL OF SOLID-STATE CIRCUITS//TIME TO DIGITAL CONVERTER TDC//CLOCK AND DATA RECOVERY CDR
7 470 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE//IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS//NETWORK ON CHIP
8 131 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES//IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS//MICROWAVE AND OPTICAL TECHNOLOGY LETTERS
9 2642 THROUGH SILICON VIA TSV//WAFER BONDING//THROUGH SILICON VIA
10 3252 JUNCTION TEMPERATURE//COMPACT THERMAL MODEL//DYNAMIC THERMAL MANAGEMENT

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