Class information for: |
Basic class information |
Class id | #P | Avg. number of references |
Database coverage of references |
---|---|---|---|
1426 | 7939 | 16.3 | 42% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Terms with highest relevance score |
rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | journal | 2362403 | 17% | 45% | 1380 |
2 | ELECTROSTATIC DISCHARGE ESD | authKW | 740962 | 3% | 70% | 277 |
3 | REVERBERATION CHAMBER | authKW | 631677 | 2% | 86% | 191 |
4 | SIGNAL INTEGRITY | authKW | 380908 | 2% | 53% | 186 |
5 | ELECTROSTATIC DISCHARGE | authKW | 265233 | 2% | 49% | 141 |
6 | SILICON CONTROLLED RECTIFIER SCR | authKW | 244763 | 1% | 86% | 74 |
7 | SIMULTANEOUS SWITCHING NOISE | authKW | 238428 | 1% | 89% | 70 |
8 | SUBSTRATE NOISE | authKW | 237910 | 1% | 76% | 81 |
9 | POWER INTEGRITY | authKW | 224995 | 1% | 86% | 68 |
10 | NANOELECT GIGASCALE SYST | address | 222789 | 1% | 71% | 82 |
Web of Science journal categories |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | Engineering, Electrical & Electronic | 178076 | 85% | 1% | 6774 |
2 | Telecommunications | 98993 | 30% | 1% | 2362 |
3 | Computer Science, Hardware & Architecture | 11021 | 7% | 1% | 546 |
4 | Physics, Applied | 3487 | 16% | 0% | 1276 |
5 | Engineering, Manufacturing | 2960 | 4% | 0% | 286 |
6 | Nanoscience & Nanotechnology | 1068 | 5% | 0% | 388 |
7 | Computer Science, Interdisciplinary Applications | 891 | 4% | 0% | 278 |
8 | Instruments & Instrumentation | 480 | 3% | 0% | 263 |
9 | Engineering, General | 348 | 2% | 0% | 169 |
10 | Optics | 263 | 4% | 0% | 311 |
Address terms |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | NANOELECT GIGASCALE SYST | 222789 | 1% | 71% | 82 |
2 | UAQ EMC | 138359 | 1% | 67% | 54 |
3 | ELE OMAGNET COMPATIBIL | 100186 | 1% | 45% | 58 |
4 | ESD | 45633 | 0% | 42% | 28 |
5 | TERAHERTZ INTERCONNECT PACKAGE | 34587 | 0% | 60% | 15 |
6 | ELECT CAD | 29982 | 0% | 35% | 22 |
7 | THEORET ELEKTROTECH | 28162 | 0% | 33% | 22 |
8 | KKU SEAGATE COOPERAT | 27669 | 0% | 60% | 12 |
9 | CORP ESD | 24600 | 0% | 80% | 8 |
10 | ELECT ENGN | 22033 | 15% | 1% | 1181 |
Journals |
Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | 2362403 | 17% | 45% | 1380 |
2 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 180367 | 3% | 22% | 218 |
3 | IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 80666 | 7% | 4% | 517 |
4 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 61825 | 2% | 11% | 147 |
5 | MICROELECTRONICS RELIABILITY | 50925 | 4% | 4% | 304 |
6 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 42300 | 1% | 17% | 65 |
7 | IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 32999 | 1% | 9% | 96 |
8 | IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS | 25101 | 2% | 4% | 179 |
9 | JOURNAL OF ELECTROSTATICS | 20507 | 1% | 5% | 118 |
10 | JOURNAL OF ELECTROMAGNETIC WAVES AND APPLICATIONS | 16071 | 2% | 3% | 129 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
---|---|---|---|---|
1 | WU, TL , BUESINK, F , CANAVERO, F , (2013) OVERVIEW OF SIGNAL INTEGRITY AND EMC DESIGN TECHNOLOGIES ON PCB: FUNDAMENTALS AND LATEST PROGRESS.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 55. ISSUE 4. P. 624 -638 | 59 | 74% | 22 |
2 | ACHAR, R , NAKHLA, MS , (2001) SIMULATION OF HIGH-SPEED INTERCONNECTS.PROCEEDINGS OF THE IEEE. VOL. 89. ISSUE 5. P. 693 -728 | 52 | 88% | 326 |
3 | WU, TL , CHUANG, HH , WANG, TK , (2010) OVERVIEW OF POWER INTEGRITY SOLUTIONS ON PACKAGE AND PCB: DECOUPLING AND EBG ISOLATION.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 52. ISSUE 2. P. 346 -356 | 45 | 92% | 73 |
4 | AFZALI-KUSHA, A , NAGATA, M , VERGHESE, NK , ALLSTOT, DJ , (2006) SUBSTRATE NOISE COUPLING IN SOC DESIGN: MODELING, AVOIDANCE, AND VALIDATION.PROCEEDINGS OF THE IEEE. VOL. 94. ISSUE 12. P. 2109 -2138 | 49 | 89% | 43 |
5 | MANFREDI, P , DE ZUTTER, D , GINSTE, DV , (2016) ANALYSIS OF NONUNIFORM TRANSMISSION LINES WITH AN ITERATIVE AND ADAPTIVE PERTURBATION TECHNIQUE.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 58. ISSUE 3. P. 859 -867 | 36 | 90% | 0 |
6 | MOGLIE, F , BASTIANELLI, L , PRIMIANI, VM , (2016) RELIABLE FINITE-DIFFERENCE TIME-DOMAIN SIMULATIONS OF REVERBERATION CHAMBERS BY USING EQUIVALENT VOLUMETRIC LOSSES.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 58. ISSUE 3. P. 653 -660 | 31 | 94% | 1 |
7 | PRIMIANI, VM , MOGLIE, F , (2012) NUMERICAL SIMULATION OF REVERBERATION CHAMBER PARAMETERS AFFECTING THE RECEIVED POWER STATISTICS.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 54. ISSUE 3. P. 522 -532 | 34 | 97% | 8 |
8 | RAMDANI, M , SICARD, E , BOYER, A , BEN DHIA, S , WHALEN, JJ , HUBING, TH , COENEN, M , WADA, O , (2009) THE ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS-PAST, PRESENT, AND FUTURE.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 51. ISSUE 1. P. 78-100 | 36 | 82% | 85 |
9 | WANG, CD , WU, TL , (2013) MODEL AND MECHANISM OF MINIATURIZED AND STOPBAND-ENHANCED INTERLEAVED EBG STRUCTURE FOR POWER/GROUND NOISE SUPPRESSION.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 55. ISSUE 1. P. 159-167 | 28 | 100% | 11 |
10 | ZHANG, MS , TAN, HZ , MAO, JF , (2014) A NOVEL LAYER STACK-UP WITH FREE CAVITY RESONANCE FOR HIGH-PERFORMANCE POWER NOISE SUPPRESSION.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 4. ISSUE 12. P. 1973 -1980 | 30 | 97% | 0 |
Classes with closest relation at Level 2 |