Class information for: |
Basic class information |
| Class id | #P | Avg. number of references |
Database coverage of references |
|---|---|---|---|
| 36537 | 79 | 22.4 | 66% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 2 | 4 | MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER | 2836879 |
| 395 | 3 | ELECTROANALYSIS//CHEMISTRY, ANALYTICAL//ELECTROCHEMISTRY | 30470 |
| 2850 | 2 | SCANNING ELECTROCHEMICAL MICROSCOPY//ELECTROCHEMICAL MACHINING//SECM | 2946 |
| 36537 | 1 | LOCALIZED ELECTROCHEMICAL DEPOSITION//EDM ELECTRODE//LOCALIZED ELECTROCHEMICAL DEPOSITION LECD | 79 |
Terms with highest relevance score |
| rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|---|
| 1 | LOCALIZED ELECTROCHEMICAL DEPOSITION | authKW | 1236886 | 5% | 80% | 4 |
| 2 | EDM ELECTRODE | authKW | 869685 | 4% | 75% | 3 |
| 3 | LOCALIZED ELECTROCHEMICAL DEPOSITION LECD | authKW | 773055 | 3% | 100% | 2 |
| 4 | MICRO ANODE GUIDED ELECTROPLATING | authKW | 773055 | 3% | 100% | 2 |
| 5 | MICROELECTROPLATING | authKW | 515369 | 3% | 67% | 2 |
| 6 | AYER RAJAH C CENT | address | 386527 | 1% | 100% | 1 |
| 7 | BIOLOGICAL ADHERENT CELLS | authKW | 386527 | 1% | 100% | 1 |
| 8 | BIOLOGICAL CELL CULTIVATION | authKW | 386527 | 1% | 100% | 1 |
| 9 | BIOLOGICAL CELL MODELS | authKW | 386527 | 1% | 100% | 1 |
| 10 | CNT MICROARCHITECTURE | authKW | 386527 | 1% | 100% | 1 |
Web of Science journal categories |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | Nanoscience & Nanotechnology | 743 | 33% | 0% | 26 |
| 2 | Engineering, Manufacturing | 411 | 13% | 0% | 10 |
| 3 | Physics, Applied | 324 | 42% | 0% | 33 |
| 4 | Materials Science, Multidisciplinary | 310 | 44% | 0% | 35 |
| 5 | Instruments & Instrumentation | 275 | 19% | 0% | 15 |
| 6 | Electrochemistry | 241 | 15% | 0% | 12 |
| 7 | Mechanics | 114 | 14% | 0% | 11 |
| 8 | Materials Science, Coatings & Films | 109 | 9% | 0% | 7 |
| 9 | Engineering, Electrical & Electronic | 90 | 22% | 0% | 17 |
| 10 | Chemistry, Multidisciplinary | 71 | 22% | 0% | 17 |
Address terms |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | AYER RAJAH C CENT | 386527 | 1% | 100% | 1 |
| 2 | NIMBRE | 386527 | 1% | 100% | 1 |
| 3 | VPAA | 386527 | 1% | 100% | 1 |
| 4 | PRECIS ENGN STRATEG PROGRAMME | 193263 | 1% | 50% | 1 |
| 5 | XIC | 193263 | 1% | 50% | 1 |
| 6 | NANO HYBRID TECHNOL | 108705 | 4% | 9% | 3 |
| 7 | NANOHYBRID TECHNOL | 77304 | 1% | 20% | 1 |
| 8 | OPTOMECHATRON | 64627 | 9% | 2% | 7 |
| 9 | ELECT FUNCT MAT ENGN | 61841 | 3% | 8% | 2 |
| 10 | XRAY IMAGING | 39081 | 4% | 3% | 3 |
Journals |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 6991 | 13% | 0% | 10 |
| 2 | MANUFACTURING ENGINEERING | 4724 | 3% | 1% | 2 |
| 3 | REVISTA DE CHIMIE | 4133 | 10% | 0% | 8 |
| 4 | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY | 1188 | 3% | 0% | 2 |
| 5 | INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE | 1113 | 5% | 0% | 4 |
| 6 | JOURNAL OF MANUFACTURING PROCESSES | 889 | 1% | 0% | 1 |
| 7 | ELECTROCHEMICAL AND SOLID STATE LETTERS | 810 | 4% | 0% | 3 |
| 8 | JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME | 636 | 3% | 0% | 2 |
| 9 | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | 576 | 3% | 0% | 2 |
| 10 | JOURNAL OF ENGINEERING DESIGN | 518 | 1% | 0% | 1 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
| Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
|---|---|---|---|---|
| 1 | LIN, JC , CHANG, TK , YANG, JH , CHEN, YS , CHUANG, CL , (2010) LOCALIZED ELECTROCHEMICAL DEPOSITION OF MICROMETER COPPER COLUMNS BY PULSE PLATING.ELECTROCHIMICA ACTA. VOL. 55. ISSUE 6. P. 1888-1894 | 19 | 100% | 18 |
| 2 | WANG, FL , XIAO, HB , HE, H , (2016) EFFECTS OF APPLIED POTENTIAL AND THE INITIAL GAP BETWEEN ELECTRODES ON LOCALIZED ELECTROCHEMICAL DEPOSITION OF MICROMETER COPPER COLUMNS.SCIENTIFIC REPORTS. VOL. 6. ISSUE . P. - | 16 | 94% | 1 |
| 3 | LIN, JC , CHEN, YS , HUANG, CF , YANG, JH , CHANG, TK , WU, CL , HWANG, YR , CHEN, TC , (2011) MECHANICAL PROPERTIES OF COPPER MICROMETER PILLARS FABRICATED BY INTERMITTENT MAGE PROCESS.INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE. VOL. 6. ISSUE 8. P. 3536-3549 | 13 | 100% | 2 |
| 4 | WANG, FL , WANG, F , HE, H , (2016) PARAMETRIC ELECTROCHEMICAL DEPOSITION OF CONTROLLABLE MORPHOLOGY OF COPPER MICRO-COLUMNS.JOURNAL OF THE ELECTROCHEMICAL SOCIETY. VOL. 163. ISSUE 10. P. E322 -E327 | 11 | 100% | 0 |
| 5 | HWANG, YR , LIN, JC , CHEN, TC , (2012) THE ANALYSIS OF THE DEPOSITION RATE FOR CONTINUOUS MICRO-ANODE GUIDED ELECTROPLATING PROCESS.INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE. VOL. 7. ISSUE 2. P. 1359-1370 | 12 | 100% | 0 |
| 6 | YANG, JH , LIN, JC , CHANG, TK , LAI, GY , JIANG, SB , (2008) ASSESSING THE DEGREE OF LOCALIZATION IN LOCALIZED ELECTROCHEMICAL DEPOSITION OF COPPER.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 18. ISSUE 5. P. - | 12 | 100% | 5 |
| 7 | CHANG, TK , LIN, JC , YANG, JH , YEH, PC , LEE, DL , JIANG, SB , (2007) SURFACE AND TRANSVERSE MORPHOLOGY OF MICROMETER NICKEL COLUMNS FABRICATED BY LOCALIZED ELECTROCHEMICAL DEPOSITION.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 17. ISSUE 11. P. 2336 -2343 | 12 | 100% | 6 |
| 8 | YANG, JH , LIN, JC , CHANG, TK , YOU, XB , JIANG, SB , (2009) LOCALIZED NI DEPOSITION IMPROVED BY SACCHARIN SODIUM IN THE INTERMITTENT MAGE PROCESS.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 19. ISSUE 2. P. - | 11 | 100% | 5 |
| 9 | CIOU, YJ , HWANG, YR , LIN, JC , TSENG, YT , (2016) FABRICATION OF 3D MICROSTRUCTURE BY LOCALIZED ELECTROCHEMICAL DEPOSITION WITH IMAGE FEEDBACK DISTANCE CONTROL AND FIVE-AXIS MOTION PLATFORM.ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY. VOL. 5. ISSUE 7. P. P425 -P432 | 11 | 85% | 0 |
| 10 | LIN, JC , CHANG, TK , YANG, JH , JENG, JH , LEE, DL , JIANG, SB , (2009) FABRICATION OF A MICROMETER NI-CU ALLOY COLUMN COUPLED WITH A CU MICRO-COLUMN FOR THERMAL MEASUREMENT.JOURNAL OF MICROMECHANICS AND MICROENGINEERING. VOL. 19. ISSUE 1. P. - | 15 | 71% | 8 |
Classes with closest relation at Level 1 |