Class information for:
Level 1: LOW K//LOW K DIELECTRICS//LOW K MATERIALS

Basic class information
Class id #P Avg. number of
references		 Database coverage
of references
2036 2378 21.4 65%


Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
2 4 MATERIALS SCIENCE, MULTIDISCIPLINARY//PHYSICS, APPLIED//PHYSICS, CONDENSED MATTER 2836879
567 3       PLASMA POLYMERIZATION//PLASMA PROCESSES AND POLYMERS//RADIATION GRAFTING 16936
1545 2             PLASMA POLYMERIZATION//LOW K//PLASMA PROCESSES AND POLYMERS 7423
2036 1                   LOW K//LOW K DIELECTRICS//LOW K MATERIALS 2378

Terms with highest relevance score


rank Term termType Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 LOW K authKW 1260963 8% 53% 187
2 LOW K DIELECTRICS authKW 796471 5% 57% 108
3 LOW K MATERIALS authKW 474498 3% 60% 62
4 PLASMA PROC TECHNOL address 456509 2% 83% 43
5 SIOC H FILMS authKW 436525 1% 100% 34
6 SIOF authKW 267470 1% 83% 25
7 NANO THIN FILM MAT address 267405 1% 77% 27
8 LOG TECHNOL DEV address 260142 2% 43% 47
9 LOW DIELECTRIC CONSTANT authKW 250937 3% 31% 63
10 POROUS LOW K authKW 223281 1% 87% 20

Web of Science journal categories


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with term
in class
1 Physics, Applied 26457 67% 0% 1582
2 Materials Science, Coatings & Films 23686 23% 0% 545
3 Nanoscience & Nanotechnology 8230 20% 0% 485
4 Engineering, Electrical & Electronic 3696 25% 0% 587
5 Materials Science, Multidisciplinary 3124 27% 0% 651
6 Physics, Condensed Matter 2497 19% 0% 442
7 Electrochemistry 1948 8% 0% 195
8 Optics 1106 10% 0% 244
9 Materials Science, Ceramics 98 2% 0% 39
10 Physics, Multidisciplinary 38 4% 0% 88

Address terms


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 PLASMA PROC TECHNOL 456509 2% 83% 43
2 NANO THIN FILM MAT 267405 1% 77% 27
3 LOG TECHNOL DEV 260142 2% 43% 47
4 NANOTHIN FILM MAT 110961 0% 79% 11
5 XPEQT 103994 0% 90% 9
6 MECH ENERGY PROD ENGN 81160 1% 45% 14
7 NANODEVICES SYST 64674 1% 15% 33
8 MAT CALCULAT 45851 0% 71% 5
9 OCOTILLO MAT 42013 0% 55% 6
10 SEMICOND MAT PROC 42001 1% 27% 12

Journals


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class
1 MICROELECTRONIC ENGINEERING 66288 10% 2% 229
2 THIN SOLID FILMS 15129 9% 1% 208
3 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 14929 8% 1% 188
4 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 10592 5% 1% 118
5 ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 8851 1% 2% 30
6 SOLID STATE TECHNOLOGY 7493 1% 2% 33
7 JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 6857 5% 0% 130
8 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 6129 3% 1% 83
9 ELECTROCHEMICAL AND SOLID STATE LETTERS 5745 2% 1% 44
10 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 4303 1% 2% 19

Author Key Words


Rank Term Chi square Shr. of publ. in
class containing
term		 Class's shr. of
term's tot. occurrences		 #P with
term in
class		 LCSH search Wikipedia search
1 LOW K 1260963 8% 53% 187 Search LOW+K Search LOW+K
2 LOW K DIELECTRICS 796471 5% 57% 108 Search LOW+K+DIELECTRICS Search LOW+K+DIELECTRICS
3 LOW K MATERIALS 474498 3% 60% 62 Search LOW+K+MATERIALS Search LOW+K+MATERIALS
4 SIOC H FILMS 436525 1% 100% 34 Search SIOC+H+FILMS Search SIOC+H+FILMS
5 SIOF 267470 1% 83% 25 Search SIOF Search SIOF
6 LOW DIELECTRIC CONSTANT 250937 3% 31% 63 Search LOW+DIELECTRIC+CONSTANT Search LOW+DIELECTRIC+CONSTANT
7 POROUS LOW K 223281 1% 87% 20 Search POROUS+LOW+K Search POROUS+LOW+K
8 LOW K DIELECTRIC THIN FILMS 205735 1% 64% 25 Search LOW+K+DIELECTRIC+THIN+FILMS Search LOW+K+DIELECTRIC+THIN+FILMS
9 SIOCH 190197 1% 74% 20 Search SIOCH Search SIOCH
10 ORGANOSILICATE GLASS 166907 1% 100% 13 Search ORGANOSILICATE+GLASS Search ORGANOSILICATE+GLASS

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.


Rank Reference # ref. in
cl.		 Shr. of ref. in
cl.		 Citations
1 VOLKSEN, W , MILLER, RD , DUBOIS, G , (2010) LOW DIELECTRIC CONSTANT MATERIALS.CHEMICAL REVIEWS. VOL. 110. ISSUE 1. P. 56-110 177 46% 254
2 KING, SW , (2015) DIELECTRIC BARRIER, ETCH STOP, AND METAL CAPPING MATERIALS FOR STATE OF THE ART AND BEYOND METAL INTERCONNECTS.ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY. VOL. 4. ISSUE 1. P. N3029 -N3047 209 46% 9
3 BAKLANOV, MR , DE MARNEFFE, JF , SHAMIRYAN, D , URBANOWICZ, AM , SHI, HL , RAKHIMOVA, TV , HUANG, H , HO, PS , (2013) PLASMA PROCESSING OF LOW-K DIELECTRICS.JOURNAL OF APPLIED PHYSICS. VOL. 113. ISSUE 4. P. - 109 69% 89
4 LIONTI, K , VOLKSEN, W , MAGBITANG, T , DARNON, M , DUBOIS, G , (2015) TOWARD SUCCESSFUL INTEGRATION OF POROUS LOW-K MATERIALS: STRATEGIES ADDRESSING PLASMA DAMAGE.ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY. VOL. 4. ISSUE 1. P. N3071 -N3083 81 93% 11
5 MAEX, K , BAKLANOV, MR , SHAMIRYAN, D , IACOPI, F , BRONGERSMA, SH , YANOVITSKAYA, ZS , (2003) LOW DIELECTRIC CONSTANT MATERIALS FOR MICROELECTRONICS.JOURNAL OF APPLIED PHYSICS. VOL. 93. ISSUE 11. P. 8793 -8841 85 58% 952
6 WU, C , LI, Y , BAKLANOV, MR , CROES, K , (2015) ELECTRICAL RELIABILITY CHALLENGES OF ADVANCED LOW-K DIELECTRICS.ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY. VOL. 4. ISSUE 1. P. N3065 -N3070 56 98% 7
7 POMORSKI, TA , BITTEL, BC , LENAHAN, PM , MAYS, E , EGE, C , BIELEFELD, J , MICHALAK, D , KING, SW , (2014) DEFECT STRUCTURE AND ELECTRONIC PROPERTIES OF SIOC:H FILMS USED FOR BACK END OF LINE DIELECTRICS.JOURNAL OF APPLIED PHYSICS. VOL. 115. ISSUE 23. P. - 76 70% 18
8 MICHALAK, DJ , BLACKWELL, JM , TORRES, JM , SENGUPTA, A , KRENO, LE , CLARKE, JS , PANTUSO, D , (2015) POROSITY SCALING STRATEGIES FOR LOW-K FILMS.JOURNAL OF MATERIALS RESEARCH. VOL. 30. ISSUE 22. P. 3363 -3385 71 72% 7
9 MCGAHAY, V , (2010) POROUS DIELECTRICS IN MICROELECTRONIC WIRING APPLICATIONS.MATERIALS. VOL. 3. ISSUE 1. P. 536 -562 67 89% 15
10 MUTCH, MJ , POMORSKI, T , BITTEL, BC , COCHRANE, CJ , LENAHAN, PM , LIU, X , NEMANICH, RJ , BROCKMAN, J , FRENCH, M , KUHN, M , ET AL (2016) BAND DIAGRAM FOR LOW-K/CU INTERCONNECTS: THE STARTING POINT FOR UNDERSTANDING BACK-END-OF-LINE (BEOL) ELECTRICAL RELIABILITY.MICROELECTRONICS RELIABILITY. VOL. 63. ISSUE . P. 201 -213 71 53% 1

Classes with closest relation at Level 1


Rank Class id link
1 20485 FLUORINATED AMORPHOUS CARBON//A C F//FLUORINATED AMORPHOUS CARBON FILMS
2 11111 TEOS PECVD//TEOS//FEATURE SCALE
3 17943 NANO COMPONENT//ADHESION FAILURE LOAD//PIN PULL TEST
4 3427 DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE
5 24473 BK MOL SCI//LEHRSTUHL FUNKT MAT//DONGGUK MED
6 36951 SUPERCONDUCTORS OXIDES INNOVAT MAT DEVIC//MAT SCI SEVILLE ICMSE//NANOTECHNOL SUR ES
7 27623 BENZOCYCLOBUTENE//INTERCONNECTION TECHNIQUE//WATER ABSORPTIONS
8 20305 SILICON CARBONITRIDE//SICN//SILICON CARBON NITRIDE
9 8455 MESOPOROUS SILICA FILM//SCI MAT NANOTECNOL//CR M
10 21652 ATOMIC LAYER ETCHING//NEUTRAL BEAM//NEUTRAL BEAM ETCHING

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