Class information for: |
Basic class information |
| Class id | #P | Avg. number of references |
Database coverage of references |
|---|---|---|---|
| 37446 | 58 | 18.1 | 36% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Terms with highest relevance score |
| rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|---|
| 1 | EXCESS CONDUCTION LOSS | authKW | 1579433 | 5% | 100% | 3 |
| 2 | CHARACTERIZATION OF CARD WIRING PERMITTIVITY | authKW | 526478 | 2% | 100% | 1 |
| 3 | COMP AIDED CIRCUIT DESIGN GRP | address | 526478 | 2% | 100% | 1 |
| 4 | CONDUCTOR SURFACE ROUGHNESS | authKW | 526478 | 2% | 100% | 1 |
| 5 | DIELECTRIC CONSTANT DK | authKW | 526478 | 2% | 100% | 1 |
| 6 | ELECTROMAGNETIC EM MATERIALS CHARACTERIZATION | authKW | 526478 | 2% | 100% | 1 |
| 7 | ERROR COMPONENTS MODELLING | authKW | 526478 | 2% | 100% | 1 |
| 8 | ERROR COMPONENTS SEPARATION | authKW | 526478 | 2% | 100% | 1 |
| 9 | GLASS IMPREGNATED EPOXY RESIN MATERIAL | authKW | 526478 | 2% | 100% | 1 |
| 10 | HEMISPHERICAL BOSSES | authKW | 526478 | 2% | 100% | 1 |
Web of Science journal categories |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | Engineering, Electrical & Electronic | 1019 | 76% | 0% | 44 |
| 2 | Telecommunications | 881 | 33% | 0% | 19 |
| 3 | Optics | 54 | 14% | 0% | 8 |
| 4 | Engineering, Manufacturing | 47 | 5% | 0% | 3 |
| 5 | Physics, Applied | 39 | 19% | 0% | 11 |
| 6 | Materials Science, Coatings & Films | 25 | 5% | 0% | 3 |
| 7 | Computer Science, Information Systems | 7 | 3% | 0% | 2 |
| 8 | Materials Science, Multidisciplinary | 5 | 10% | 0% | 6 |
| 9 | Physics, Condensed Matter | 5 | 7% | 0% | 4 |
| 10 | Computer Science, Hardware & Architecture | 4 | 2% | 0% | 1 |
Address terms |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | COMP AIDED CIRCUIT DESIGN GRP | 526478 | 2% | 100% | 1 |
| 2 | SIGNAL INTEGR POWER DELIVERY | 526478 | 2% | 100% | 1 |
| 3 | INTEGRATED SUPPLY CHAIN | 175491 | 2% | 33% | 1 |
| 4 | ADV CIRCUIT MAT | 131618 | 2% | 25% | 1 |
| 5 | OPTELECT INFORMAT | 105294 | 2% | 20% | 1 |
| 6 | COMPONENTS | 93816 | 10% | 3% | 6 |
| 7 | BOULDER S | 44803 | 3% | 4% | 2 |
| 8 | TELECOMMUN SCI | 36942 | 3% | 4% | 2 |
| 9 | PAUL ALLEN | 21057 | 2% | 4% | 1 |
| 10 | ELECT EQUIPMENT STRUCT DESIGN | 16448 | 3% | 2% | 2 |
Journals |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | 6108 | 10% | 0% | 6 |
| 2 | IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY | 3969 | 3% | 0% | 2 |
| 3 | IEEE MICROWAVE MAGAZINE | 3398 | 3% | 0% | 2 |
| 4 | IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2662 | 14% | 0% | 8 |
| 5 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2079 | 3% | 0% | 2 |
| 6 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 1570 | 3% | 0% | 2 |
| 7 | ELECTRONICS & COMMUNICATION ENGINEERING JOURNAL | 1452 | 2% | 0% | 1 |
| 8 | IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 1246 | 5% | 0% | 3 |
| 9 | MICROWAVE JOURNAL | 1192 | 3% | 0% | 2 |
| 10 | IET MICROWAVES ANTENNAS & PROPAGATION | 1038 | 3% | 0% | 2 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
| Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
|---|---|---|---|---|
| 1 | TSANG, L , BRAUNISCH, H , DING, RH , GU, XX , (2010) RANDOM ROUGH SURFACE EFFECTS ON WAVE PROPAGATION IN INTERCONNECTS.IEEE TRANSACTIONS ON ADVANCED PACKAGING. VOL. 33. ISSUE 4. P. 839-856 | 10 | 83% | 17 |
| 2 | DING, RH , TSANG, L , BRAUNISCH, H , (2009) WAVE PROPAGATION IN A RANDOMLY ROUGH PARALLEL-PLATE WAVEGUIDE.IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. VOL. 57. ISSUE 5. P. 1216-1223 | 8 | 89% | 14 |
| 3 | DING, RH , TSANG, L , BRAUNISCH, H , (2012) RANDOM ROUGH SURFACE EFFECTS IN WAVEGUIDES USING MODE MATCHING TECHNIQUE AND THE METHOD OF MOMENTS.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. VOL. 2. ISSUE 1. P. 140 -148 | 8 | 67% | 2 |
| 4 | LIU, S , HU, J , ZHANG, Y , LIU, YP , REN, TH , XU, RM , XUE, Q , (2015) SUB-MILLIMETER-WAVE 10 DB DIRECTIONAL COUPLER BASED ON MICROMACHINING TECHNIQUE.INTERNATIONAL JOURNAL OF ANTENNAS AND PROPAGATION. VOL. . ISSUE . P. - | 6 | 75% | 0 |
| 5 | YI, M , LI, SS , YU, H , KHAN, W , ULUSOY, C , VERA-LOPEZ, A , PAPAPOLYMEROU, J , SWAMINATHAN, M , (2016) SURFACE ROUGHNESS MODELING OF SUBSTRATE INTEGRATED WAVEGUIDE IN D-BAND.IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. VOL. 64. ISSUE 4. P. 1209 -1216 | 8 | 53% | 0 |
| 6 | GU, XX , TSANG, L , BRAUNISCH, H , (2007) MODELING EFFECTS OF RANDOM ROUGH INTERFACE ON POWER ABSORPTION BETWEEN DIELECTRIC AND CONDUCTIVE MEDIUM IN 3-D PROBLEM.IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. VOL. 55. ISSUE 3. P. 511-517 | 6 | 86% | 13 |
| 7 | GU, XX , (2007) SCATTERING AND ABSORPTION OF ELECTROMAGNETIC WAVES ON A PLANE WITH HEMISPHERICAL BOSSES.MICROWAVE AND OPTICAL TECHNOLOGY LETTERS. VOL. 49. ISSUE 11. P. 2681-2686 | 5 | 83% | 0 |
| 8 | LI, N , ZHENG, F , (2011) EFFECT OF MICRO/NANO-SCALE ROUGH SURFACE ON POWER DISSIPATION OF THE WAVEGUIDE: MODEL AND SIMULATE.JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY. VOL. 11. ISSUE 12. P. 11222-11226 | 5 | 71% | 1 |
| 9 | GUO, XC , JACKSON, DR , KOLEDINTSEVA, MY , HINAGA, S , DREWNIAK, JL , CHEN, J , (2014) AN ANALYSIS OF CONDUCTOR SURFACE ROUGHNESS EFFECTS ON SIGNAL PROPAGATION FOR STRIPLINE INTERCONNECTS.IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY. VOL. 56. ISSUE 3. P. 707-714 | 4 | 67% | 4 |
| 10 | DING, RH , TSANG, L , BRAUNISCH, H , CHANG, WM , (2012) WAVE PROPAGATION IN PARALLEL PLATE METALLIC WAVEGUIDE WITH FINITE CONDUCTIVITY AND THREE DIMENSIONAL ROUGHNESS.IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION. VOL. 60. ISSUE 12. P. 5867-5880 | 6 | 46% | 6 |
Classes with closest relation at Level 1 |