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Wafer bonding for MEMS
Wafer-level packaging of MEMS
Nanogap tunnelling sensors
Magnetic assembly processes for MEMS
Graphene-based sensors
Through-silicon and through-glass vias (TSVs & TGVs)
Infrared bolometers
Heterogeneous integration for MEMS
Laser micro machining for MEMS
Intradermal glucose monitoring
Submillimeter-wave radar systems
GASENS
Real time monitoring of human cells
Synthetic microfluidic paper and lateral flow devices
Detection of Airborne Viruses
Micromachined microwave medical sensors
Exhaled breath sensors
Electrical DNA detection
Wafer-level packaging of MEMS
More information can be found
here
.
