Class information for: |
Basic class information |
| Class id | #P | Avg. number of references |
Database coverage of references |
|---|---|---|---|
| 34487 | 111 | 23.1 | 26% |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Terms with highest relevance score |
| rank | Term | termType | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|---|
| 1 | DMSMS | authKW | 2475860 | 8% | 100% | 9 |
| 2 | OBSOLESCENCE MANAGEMENT | authKW | 982481 | 5% | 71% | 5 |
| 3 | PARAMETER CONFORMANCE | authKW | 825287 | 3% | 100% | 3 |
| 4 | PARAMETER RECHARACTERIZATION | authKW | 825287 | 3% | 100% | 3 |
| 5 | STRESS BALANCING | authKW | 825287 | 3% | 100% | 3 |
| 6 | OBSOLESCENCE | authKW | 795782 | 16% | 16% | 18 |
| 7 | CALCE ELECT PROD SYST | address | 670977 | 17% | 13% | 19 |
| 8 | TECHNOLOGY INSERTION | authKW | 628786 | 4% | 57% | 4 |
| 9 | DESIGN REFRESH | authKW | 550191 | 2% | 100% | 2 |
| 10 | PART RATING | authKW | 550191 | 2% | 100% | 2 |
Web of Science journal categories |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | Engineering, Industrial | 854 | 15% | 0% | 17 |
| 2 | Engineering, Manufacturing | 754 | 14% | 0% | 16 |
| 3 | Engineering, General | 603 | 18% | 0% | 20 |
| 4 | Management | 304 | 12% | 0% | 13 |
| 5 | Engineering, Electrical & Electronic | 212 | 27% | 0% | 30 |
| 6 | Operations Research & Management Science | 161 | 9% | 0% | 10 |
| 7 | Engineering, Aerospace | 131 | 5% | 0% | 6 |
| 8 | Computer Science, Software Engineering | 123 | 8% | 0% | 9 |
| 9 | COMPUTER APPLICATIONS & CYBERNETICS | 103 | 1% | 0% | 1 |
| 10 | Materials Science, Multidisciplinary | 74 | 21% | 0% | 23 |
Address terms |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | CALCE ELECT PROD SYST | 670977 | 17% | 13% | 19 |
| 2 | ADV DESIGN OPTIMIZAT ADOPT | 275096 | 1% | 100% | 1 |
| 3 | AESA GRP | 275096 | 1% | 100% | 1 |
| 4 | GLOBAL TRAINING LOGIST | 275096 | 1% | 100% | 1 |
| 5 | HQ AFMC | 275096 | 1% | 100% | 1 |
| 6 | KATEDRA MARKETINGU MEDZINARODNEHO OBCHODU | 275096 | 1% | 100% | 1 |
| 7 | MFG TECHNOL BRANCH | 275096 | 1% | 100% | 1 |
| 8 | ORBITAL SCI FAIRCHILD DEF | 275096 | 1% | 100% | 1 |
| 9 | SEXTANT IN FLIGHT SYST | 275096 | 1% | 100% | 1 |
| 10 | SIMULAT TRAINING SUPPORT | 275096 | 1% | 100% | 1 |
Journals |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
|---|---|---|---|---|---|
| 1 | PROCEEDINGS : ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM | 73621 | 10% | 2% | 11 |
| 2 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 61260 | 14% | 1% | 16 |
| 3 | ENGINEERING MANAGEMENT JOURNAL | 35204 | 4% | 3% | 4 |
| 4 | EMJ-ENGINEERING MANAGEMENT JOURNAL | 27813 | 3% | 3% | 3 |
| 5 | COMMUTATION & TRANSMISSION | 27508 | 1% | 10% | 1 |
| 6 | SYSTEMS ENGINEERING | 8358 | 3% | 1% | 3 |
| 7 | DATA PROCESSING | 5189 | 1% | 2% | 1 |
| 8 | IEEE AEROSPACE AND ELECTRONIC SYSTEMS MAGAZINE | 4261 | 4% | 0% | 4 |
| 9 | IEEE CIRCUITS & DEVICES | 3186 | 2% | 1% | 2 |
| 10 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 2782 | 2% | 1% | 2 |
Author Key Words |
| Rank | Term | Chi square | Shr. of publ. in class containing term |
Class's shr. of term's tot. occurrences |
#P with term in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | DMSMS | 2475860 | 8% | 100% | 9 | Search DMSMS | Search DMSMS |
| 2 | OBSOLESCENCE MANAGEMENT | 982481 | 5% | 71% | 5 | Search OBSOLESCENCE+MANAGEMENT | Search OBSOLESCENCE+MANAGEMENT |
| 3 | PARAMETER CONFORMANCE | 825287 | 3% | 100% | 3 | Search PARAMETER+CONFORMANCE | Search PARAMETER+CONFORMANCE |
| 4 | PARAMETER RECHARACTERIZATION | 825287 | 3% | 100% | 3 | Search PARAMETER+RECHARACTERIZATION | Search PARAMETER+RECHARACTERIZATION |
| 5 | STRESS BALANCING | 825287 | 3% | 100% | 3 | Search STRESS+BALANCING | Search STRESS+BALANCING |
| 6 | OBSOLESCENCE | 795782 | 16% | 16% | 18 | Search OBSOLESCENCE | Search OBSOLESCENCE |
| 7 | TECHNOLOGY INSERTION | 628786 | 4% | 57% | 4 | Search TECHNOLOGY+INSERTION | Search TECHNOLOGY+INSERTION |
| 8 | DESIGN REFRESH | 550191 | 2% | 100% | 2 | Search DESIGN+REFRESH | Search DESIGN+REFRESH |
| 9 | PART RATING | 550191 | 2% | 100% | 2 | Search PART+RATING | Search PART+RATING |
| 10 | UPRATING | 458486 | 5% | 33% | 5 | Search UPRATING | Search UPRATING |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
| Rank | Reference | # ref. in cl. |
Shr. of ref. in cl. |
Citations |
|---|---|---|---|---|
| 1 | PECHT, MG , HUMPHREY, D , (2008) ADDRESSING OBSOLESCENCE - THE UPRATING OPTION.IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. VOL. 31. ISSUE 3. P. 741-745 | 13 | 93% | 0 |
| 2 | PECHT, M , HUMPHREY, D , (2006) UPRATING OF ELECTRONIC PARTS TO ADDRESS OBSOLESCENCE.MICROELECTRONICS INTERNATIONAL. VOL. 23. ISSUE 2. P. 32-36 | 11 | 100% | 6 |
| 3 | ROJO, FJR , ROY, R , SHEHAB, E , CHERUVU, K , MASON, P , (2012) A COST ESTIMATING FRAMEWORK FOR ELECTRONIC, ELECTRICAL AND ELECTROMECHANICAL (EEE) COMPONENTS OBSOLESCENCE WITHIN THE USE-ORIENTED PRODUCT-SERVICE SYSTEMS CONTRACTS.PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE. VOL. 226. ISSUE B1. P. 154-166 | 10 | 71% | 5 |
| 4 | ROJO, FJR , ROY, R , SHEHAB, E , (2010) OBSOLESCENCE MANAGEMENT FOR LONG-LIFE CONTRACTS: STATE OF THE ART AND FUTURE TRENDS.INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY. VOL. 49. ISSUE 9-12. P. 1235-1250 | 8 | 89% | 11 |
| 5 | ZHENG, LY , TERPENNY, J , SANDBORN, P , (2015) DESIGN REFRESH PLANNING MODELS FOR MANAGING OBSOLESCENCE.IIE TRANSACTIONS. VOL. 47. ISSUE 12. P. 1407 -1423 | 8 | 80% | 1 |
| 6 | MURRAY, S , BORN, M , PECHT, MG , ERHART, D , (2002) TRACKING SEMICONDUCTOR PART CHANGES THROUGH THE PART SUPPLY CHAIN.IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. VOL. 25. ISSUE 2. P. 230-238 | 8 | 89% | 2 |
| 7 | PENDSE, N , THOMAS, D , DAS, D , PECHT, MG , (2002) UPRATING OF A SINGLE INLINE MEMORY MODULE.IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. VOL. 25. ISSUE 2. P. 266 -269 | 8 | 89% | 1 |
| 8 | KONOZA, A , SANDBORN, P , (2014) EVALUATING THE END OF MAINTENANCE DATES FOR ELECTRONIC ASSEMBLIES COMPOSED OF OBSOLETE PARTS.JOURNAL OF MECHANICAL DESIGN. VOL. 136. ISSUE 3. P. - | 7 | 64% | 0 |
| 9 | CLUFF, KD , SCALISE, JA , (2002) END ITEM TEMPERATURE TEST - AN IMPROVED LINE REPLACEMENT UNIT (LRU)-LEVEL SCREEN.IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. VOL. 25. ISSUE 4. P. 723-726 | 6 | 100% | 0 |
| 10 | DAS, D , PENDSE, N , WILKINSON, C , PECHT, MG , (2001) PARAMETER RECHARACTERIZATION: A METHOD OF THERMAL UPRATING.IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. VOL. 24. ISSUE 4. P. 729-737 | 6 | 100% | 7 |
Classes with closest relation at Level 1 |