Simon Bleiker

Simon J. Bleiker received his M.Sc. degree in electrical engineering from the Swiss Federal Institute of Technology (ETH) in Zurich, Switzerland in 2012 and his Ph.D. degree from the Royal Institute of Technology (KTH) in Stockholm, Sweden in 2017. His expertise lies in 3D-integration and packaging of MEMS and NEMS technology. Simon has published major contributions in the fields of nano-electromechanical switches, low temperature wafer bonding, self assembly, and through-silicon vias (TSVs). Currently, he is continuing his research on NEM switches and 3D integration in the department of Micro and Nanosystems at KTH Stockholm.