Publications by Bhanu Singh
Peer reviewed
Articles
[1]
T. Huang et al., "Failure Characterization of Discrete SiC MOSFETs under Forward Power Cycling Test," Energies, vol. 17, no. 11, 2024.
Conference papers
[2]
B. P. Singh et al., "Analysis of the Thermo-mechanical Performance of Double-Sided Cooled Power Modules," in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024, 2024.
[3]
B. P. Singh et al., "Analysis of the Performance of Different Packaging Technologies of SiC Power Modules during Power Cycling Test," in 2023 29TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINIC, 2023.
[4]
B. P. Singh et al., "Analyzing the Impact of Die Positions inside the Power Module on the Reliability of Solder Layers for Different Power Cycling Scenarios," in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, 2023.
[5]
B. P. Singh et al., "Change in SiC MOSFET body-diode voltage drop in TO-247 packages during inverse-mode and forward-mode power cycling test," in ETG-Fachbericht, 2022, pp. 423-428.
Latest sync with DiVA:
2024-07-17 10:57:57