Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 396 | 27964 | 20.4 | 46% |
Classes in level above (level 4) |
| ID, lev. above |
Publications | Label for level above |
|---|---|---|
| 8 | 1101574 | ECONOMICS//OPERATIONS RESEARCH & MANAGEMENT SCIENCE//BUSINESS |
Classes in level below (level 2) |
| ID, lev. below |
Publications | Label for level below |
|---|---|---|
| 549 | 13894 | IEEE TRANSACTIONS ON RELIABILITY//RELIABILITY ENGINEERING & SYSTEM SAFETY//MICROELECTRONICS AND RELIABILITY |
| 688 | 12395 | LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER |
| 3544 | 966 | ELECTROCHEMICAL MIGRATION//SECT PROD PROC QUAL//MECHANICAL RELIABILITY PREDICTION |
| 3741 | 709 | OKON ERNAHRUNGSWIRT AFT//ELECT MFG ENGN GRP//TIME PRESSURE DISPENSING |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | IEEE TRANSACTIONS ON RELIABILITY | Journal | 1289 | 55% | 6% | 1593 |
| 2 | MICROELECTRONICS AND RELIABILITY | Journal | 845 | 58% | 3% | 978 |
| 3 | RELIABILITY ENGINEERING & SYSTEM SAFETY | Journal | 824 | 41% | 6% | 1577 |
| 4 | LEAD FREE SOLDER | Author keyword | 815 | 70% | 2% | 680 |
| 5 | SOLDERING & SURFACE MOUNT TECHNOLOGY | Journal | 531 | 83% | 1% | 299 |
| 6 | PB FREE SOLDER | Author keyword | 320 | 79% | 1% | 203 |
| 7 | SOLDER | Author keyword | 277 | 53% | 1% | 365 |
| 8 | JOURNAL OF ELECTRONIC MATERIALS | Journal | 223 | 16% | 5% | 1322 |
| 9 | LEAD FREE SOLDERS | Author keyword | 219 | 72% | 1% | 172 |
| 10 | JOURNAL OF ELECTRONIC PACKAGING | Journal | 218 | 39% | 2% | 448 |
Web of Science journal categories |
Author Key Words |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | LEAD FREE SOLDER | 815 | 70% | 2% | 680 | Search LEAD+FREE+SOLDER | Search LEAD+FREE+SOLDER |
| 2 | PB FREE SOLDER | 320 | 79% | 1% | 203 | Search PB+FREE+SOLDER | Search PB+FREE+SOLDER |
| 3 | SOLDER | 277 | 53% | 1% | 365 | Search SOLDER | Search SOLDER |
| 4 | LEAD FREE SOLDERS | 219 | 72% | 1% | 172 | Search LEAD+FREE+SOLDERS | Search LEAD+FREE+SOLDERS |
| 5 | MINIMAL REPAIR | 212 | 74% | 1% | 158 | Search MINIMAL+REPAIR | Search MINIMAL+REPAIR |
| 6 | SOLDERING | 171 | 47% | 1% | 273 | Search SOLDERING | Search SOLDERING |
| 7 | SOLDERS | 149 | 71% | 0% | 121 | Search SOLDERS | Search SOLDERS |
| 8 | SOLDER JOINT | 148 | 56% | 1% | 180 | Search SOLDER+JOINT | Search SOLDER+JOINT |
| 9 | FLIP CHIP | 142 | 33% | 1% | 359 | Search FLIP+CHIP | Search FLIP+CHIP |
| 10 | SOFTWARE RELIABILITY | 126 | 37% | 1% | 276 | Search SOFTWARE+RELIABILITY | Search SOFTWARE+RELIABILITY |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | LEAD FREE SOLDERS | 996 | 79% | 2% | 636 |
| 2 | LEAD FREE SOLDER | 591 | 80% | 1% | 362 |
| 3 | INTERFACIAL REACTIONS | 331 | 48% | 2% | 503 |
| 4 | MINIMAL REPAIR | 320 | 81% | 1% | 194 |
| 5 | PB FREE SOLDERS | 311 | 89% | 1% | 140 |
| 6 | EUTECTIC SNPB | 308 | 77% | 1% | 210 |
| 7 | SN AG CU | 291 | 77% | 1% | 200 |
| 8 | BUMP METALLIZATION | 288 | 85% | 1% | 154 |
| 9 | SN AG | 241 | 77% | 1% | 165 |
| 10 | JOINTS | 237 | 17% | 5% | 1268 |
Journals |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | IEEE TRANSACTIONS ON RELIABILITY | 1289 | 55% | 6% | 1593 |
| 2 | MICROELECTRONICS AND RELIABILITY | 845 | 58% | 3% | 978 |
| 3 | RELIABILITY ENGINEERING & SYSTEM SAFETY | 824 | 41% | 6% | 1577 |
| 4 | SOLDERING & SURFACE MOUNT TECHNOLOGY | 531 | 83% | 1% | 299 |
| 5 | JOURNAL OF ELECTRONIC MATERIALS | 223 | 16% | 5% | 1322 |
| 6 | JOURNAL OF ELECTRONIC PACKAGING | 218 | 39% | 2% | 448 |
| 7 | MICROELECTRONICS RELIABILITY | 209 | 18% | 4% | 1037 |
| 8 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 131 | 31% | 1% | 355 |
| 9 | PROCEEDINGS ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM | 126 | 53% | 1% | 168 |
| 10 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 118 | 31% | 1% | 321 |
Reviews |
| Title | Publ. year | Cit. | Active references | % act. ref. to same field |
|---|---|---|---|---|
| Lead-free solders in microelectronics | 2000 | 1001 | 20 | 80% |
| Six cases of reliability study of Pb-free solder joints in electronic packaging technology | 2002 | 850 | 55 | 87% |
| Interfacial reactions between lead-free solders and common base materials | 2005 | 529 | 56 | 86% |
| Remaining useful life estimation - A review on the statistical data driven approaches | 2011 | 138 | 130 | 85% |
| A survey of maintenance policies of deteriorating systems | 2002 | 481 | 109 | 95% |
| Properties of lead-free solder alloys with rare earth element additions | 2004 | 312 | 69 | 99% |
| Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications | 2006 | 293 | 43 | 88% |
| Rotating machinery prognostics: State of the art, challenges and opportunities | 2009 | 175 | 56 | 80% |
| Risk evaluation approaches in failure mode and effects analysis: A literature review | 2013 | 36 | 53 | 83% |
| A survey of the application of gamma processes in maintenance | 2009 | 181 | 65 | 68% |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | ABORAT AUTON COMP | 64 | 72% | 0.2% | 50 |
| 2 | COMPONENT QUAL TECHNOL GRP | 64 | 100% | 0.1% | 21 |
| 3 | RELIABIL | 57 | 58% | 0.2% | 66 |
| 4 | ELECT PACKAGING MAT | 55 | 78% | 0.1% | 36 |
| 5 | ST S RELIABIL | 49 | 79% | 0.1% | 31 |
| 6 | ADV LIFE CYCLE ENGN | 44 | 57% | 0.2% | 52 |
| 7 | CALCE | 41 | 50% | 0.2% | 59 |
| 8 | CALCE ELECT PROD SYST | 38 | 45% | 0.2% | 65 |
| 9 | ELECT MFG ENGN GRP | 38 | 78% | 0.1% | 25 |
| 10 | PLANNING DEV TECHNOL | 34 | 63% | 0.1% | 35 |
Related classes at same level (level 3) |