Class information for:
Level 2: LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
688 12395 20.8 54%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 3)


ID, lev.
above		 Publications Label for level above
396 27964 IEEE TRANSACTIONS ON RELIABILITY//MICROELECTRONICS AND RELIABILITY//RELIABILITY ENGINEERING & SYSTEM SAFETY

Classes in level below (level 1)


ID, lev. below Publications Label for level below
96 4318 LEAD FREE SOLDER//PB FREE SOLDER//LEAD FREE SOLDERS
2655 2108 JOURNAL OF ELECTRONIC PACKAGING//SOLDERING & SURFACE MOUNT TECHNOLOGY//SOLDER JOINT
5609 1534 WAFER BONDING//ANODIC BONDING//SILICON WAFER BONDING
10680 976 THROUGH SILICON VIA TSV//3 D INTEGRATION//KEEP OUT ZONE KOZ
11060 945 ANISOTROPIC CONDUCTIVE ADHESIVE ACA//ANISOTROPIC CONDUCTIVE FILM ACF//ANISOTROPIC CONDUCTIVE FILM
15861 619 UNDERFILL FLOW//WIRE SWEEP//BUMP PITCH
20212 408 FLUXLESS BONDING//AU SN SOLDER//MAT MFG TECHNOL PROGRAM
21204 369 TIN WHISKER//TIN WHISKERS//SN WHISKER
21815 347 NANOSCALE SILVER PASTE//NANOSILVER PASTE//TIANJIN ADV JOINING TECHNOL
23210 299 BENZOCYCLOBUTENE//MICROWAVE MICROSYST//NON PLANAR DEVICES
24792 251 THERMAL ENGN TECHNOL//J AN MARINE SCI TECHNOL//INP WAFERS
33359 93 INNER LEAD BONDING ILB//INNER LEAD BONDING//LASER SOLDERING
34687 65 PLATED THROUGH HOLE//ENDICOTT ELECT PACKAGING//THREE DIMENSIONAL 3 D CHIP STACKING
34760 63 HEAT TRANSFER INSTABILITY//INDIUM JOINT//INFRARED IR EMISSIONS

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of publ.
in class
1 LEAD FREE SOLDER Author keyword 804 70% 5% 677
2 SOLDERING & SURFACE MOUNT TECHNOLOGY Journal 341 73% 2% 262
3 PB FREE SOLDER Author keyword 314 79% 2% 202
4 SOLDER Author keyword 262 52% 3% 357
5 JOURNAL OF ELECTRONIC MATERIALS Journal 216 15% 11% 1302
6 LEAD FREE SOLDERS Author keyword 215 72% 1% 171
7 JOURNAL OF ELECTRONIC PACKAGING Journal 201 37% 3% 432
8 SOLDERING Author keyword 161 45% 2% 266
9 SOLDER JOINT Author keyword 144 55% 1% 178
10 SOLDERS Author keyword 138 69% 1% 118

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 LEAD FREE SOLDER 804 70% 5% 677 Search LEAD+FREE+SOLDER Search LEAD+FREE+SOLDER
2 PB FREE SOLDER 314 79% 2% 202 Search PB+FREE+SOLDER Search PB+FREE+SOLDER
3 SOLDER 262 52% 3% 357 Search SOLDER Search SOLDER
4 LEAD FREE SOLDERS 215 72% 1% 171 Search LEAD+FREE+SOLDERS Search LEAD+FREE+SOLDERS
5 SOLDERING 161 45% 2% 266 Search SOLDERING Search SOLDERING
6 SOLDER JOINT 144 55% 1% 178 Search SOLDER+JOINT Search SOLDER+JOINT
7 SOLDERS 138 69% 1% 118 Search SOLDERS Search SOLDERS
8 FLIP CHIP 135 32% 3% 351 Search FLIP+CHIP Search FLIP+CHIP
9 INTERMETALLIC COMPOUND IMC 110 74% 1% 82 Search INTERMETALLIC+COMPOUND+IMC Search INTERMETALLIC+COMPOUND+IMC
10 SN AG CU 108 73% 1% 83 Search SN+AG+CU Search SN+AG+CU

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of publ.
in class
1 LEAD FREE SOLDERS 990 79% 5% 635
2 LEAD FREE SOLDER 585 80% 3% 361
3 INTERFACIAL REACTIONS 331 48% 4% 503
4 PB FREE SOLDERS 311 89% 1% 140
5 EUTECTIC SNPB 308 77% 2% 210
6 SN AG CU 291 77% 2% 200
7 BUMP METALLIZATION 288 85% 1% 154
8 SN AG 241 77% 1% 165
9 JOINTS 237 17% 10% 1267
10 SOLDER JOINTS 228 57% 2% 272

Journals


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of publ.
in class
1 SOLDERING & SURFACE MOUNT TECHNOLOGY 341 73% 2% 262
2 JOURNAL OF ELECTRONIC MATERIALS 216 15% 11% 1302
3 JOURNAL OF ELECTRONIC PACKAGING 201 37% 3% 432
4 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 110 29% 3% 328
5 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 107 29% 2% 306
6 MICROELECTRONICS RELIABILITY 96 13% 6% 715
7 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 82 40% 1% 159
8 IEEE TRANSACTIONS ON ADVANCED PACKAGING 70 25% 2% 249
9 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 47 18% 2% 235
10 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING 33 27% 1% 104

Reviews


Title Publ. year Cit. Active references % act. ref.
to same field
Six cases of reliability study of Pb-free solder joints in electronic packaging technology 2002 850 55 87%
Lead-free solders in microelectronics 2000 1001 20 80%
Interfacial reactions between lead-free solders and common base materials 2005 529 56 86%
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications 2006 293 43 86%
Properties of lead-free solder alloys with rare earth element additions 2004 312 69 99%
A review of mechanical properties of lead-free solders for electronic packaging 2009 114 41 95%
Interfacial reaction issues for lead-free electronic solders 2007 138 82 99%
Magnetic nanoparticle-based solder composites for electronic packaging applications 2015 2 128 65%
Advances in lead-free electronics soldering 2001 355 49 92%
A review: On the development of low melting temperature Pb-free solders 2014 9 108 96%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 COMPONENT QUAL TECHNOL GRP 64 100% 0.2% 21
2 ELECT PACKAGING MAT 55 78% 0.3% 36
3 ST S RELIABIL 49 79% 0.3% 31
4 ELECT PACKAGING 31 39% 0.5% 63
5 KEY STATE NEW DISPLAYS SYST PLICAT 23 79% 0.1% 15
6 MICROJOINING 22 47% 0.3% 34
7 ADV VEHICLE ELECT 21 73% 0.1% 16
8 ELECT ASSEMBLY PACKAGING 17 79% 0.1% 11
9 ELECT PROD 16 54% 0.2% 21
10 ASSEMBLY RELIABIL TECHNOL 15 82% 0.1% 9

Related classes at same level (level 2)


Rank Relatedness score Related classes
1 0.0000019834 ELECTROCHEMICAL MIGRATION//SECT PROD PROC QUAL//MECHANICAL RELIABILITY PREDICTION
2 0.0000016684 ULTRASONIC WELDING//WIRE BONDING//ULTRASONIC CONSOLIDATION
3 0.0000015181 OKON ERNAHRUNGSWIRT AFT//ELECT MFG ENGN GRP//TIME PRESSURE DISPENSING
4 0.0000007606 DIFFUSION BARRIER//ELECTROMIGRATION//CU METALLIZATION
5 0.0000007404 NANOELECT GIGASCALE SYST//ELECTROSTATIC DISCHARGE ESD//SILICON CONTROLLED RECTIFIER SCR
6 0.0000006219 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY//ARC EROSION//AG SNO2
7 0.0000006005 CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY//METALLURGICAL TRANSACTIONS B-PROCESS METALLURGY//MOLECULAR INTERACTION VOLUME MODEL
8 0.0000005724 PLATING AND SURFACE FINISHING//ELECTRODEPOSITION//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING
9 0.0000004835 INTERFACIAL SHEARS//MICROBENDING LOSS//RAPID THERMAL PROCESSING RTP
10 0.0000004643 DIFFUS SOLIDS GRP//KIRKENDALL EFFECT//DICTRA