Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
3544 | 966 | 19.8 | 29% |
Classes in level above (level 3) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
396 | 27964 | IEEE TRANSACTIONS ON RELIABILITY//MICROELECTRONICS AND RELIABILITY//RELIABILITY ENGINEERING & SYSTEM SAFETY |
Classes in level below (level 1) |
ID, lev. below | Publications | Label for level below |
---|---|---|
22621 | 319 | ELECTROCHEMICAL MIGRATION//MECHANICAL RELIABILITY PREDICTION//CONDUCTIVE ANODIC FILAMENT |
23934 | 275 | PLASTIC ENCAPSULATED MICROCIRCUIT//NONHERMETIC//DORMANT STORAGE |
25555 | 230 | COMMERCIAL RELIABILITY PROGRAM//ELECTRONIC COMPONENT RELIABILITY//INTERNET CALIBRATION |
34267 | 75 | SECT PROD PROC QUAL//MATURITY INDEX ON RELIABILITY MIR//FAST FIELD FEEDBACK |
34596 | 67 | BAYESIAN SEQUENTIAL TEST//INGENIOUS MICROMFG SYST GRP//PROJECTION PURSUIT TYPE STATISTIC |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | ELECTROCHEMICAL MIGRATION | Author keyword | 28 | 60% | 3% | 31 |
2 | SECT PROD PROC QUAL | Address | 17 | 79% | 1% | 11 |
3 | MECHANICAL RELIABILITY PREDICTION | Author keyword | 15 | 88% | 1% | 7 |
4 | CONDUCTIVE ANODIC FILAMENT | Author keyword | 11 | 100% | 1% | 6 |
5 | MATURITY INDEX ON RELIABILITY MIR | Author keyword | 9 | 83% | 1% | 5 |
6 | ELECTROCHEMICAL MIGRATION ECM | Author keyword | 8 | 60% | 1% | 9 |
7 | CS MANAGEMENT | Address | 7 | 64% | 1% | 7 |
8 | PLASTIC ENCAPSULATED MICROCIRCUIT | Author keyword | 7 | 67% | 1% | 6 |
9 | SOLDER FLUX | Author keyword | 6 | 80% | 0% | 4 |
10 | SURFACE INSULATION RESISTANCE SIR | Author keyword | 4 | 67% | 0% | 4 |
Web of Science journal categories |
Author Key Words |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | ELECTROCHEMICAL MIGRATION | 14 | 64% | 1% | 14 |
2 | SILVER MIGRATION | 5 | 41% | 1% | 9 |
3 | ANODIC FILAMENT FORMATION | 3 | 100% | 0% | 3 |
4 | CONDUCTOR SYSTEMS | 3 | 100% | 0% | 3 |
5 | NA2SO4 SOLUTIONS | 3 | 45% | 1% | 5 |
6 | NEUROLOGICAL PROSTHESES | 3 | 38% | 1% | 6 |
7 | NONHERMETIC ALUMINUM SICS | 2 | 67% | 0% | 2 |
8 | SURFACE INSULATION RESISTANCE | 2 | 67% | 0% | 2 |
9 | FAILURE MECHANISM MODELS | 2 | 50% | 0% | 3 |
10 | HUMIDITY BIAS BEHAVIOR | 2 | 43% | 0% | 3 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
---|---|---|---|---|
Corrosion-induced degradation of microelectronic devices | 1996 | 21 | 4 | 100% |
A system view of the No Fault Found (NFF) phenomenon | 2007 | 16 | 8 | 75% |
Corrosion of silicon integrated circuits and lifetime predictions in implantable electronic devices | 2013 | 3 | 33 | 58% |
No-fault-found and intermittent failures in electronic products | 2008 | 20 | 11 | 27% |
TUTORIAL - ELECTROLYTIC MODELS FOR METALLIC ELECTROMIGRATION FAILURE MECHANISMS | 1995 | 11 | 12 | 83% |
No Fault Found events in maintenance engineering Part 2: Root causes, technical developments and future research | 2014 | 1 | 39 | 33% |
Plastic packages survive where hermetic packages fail | 1996 | 3 | 1 | 100% |
No Fault Found events in maintenance engineering Part 1: Current trends, implications and organizational practices | 2014 | 0 | 30 | 47% |
FAILURE PHYSICS OF INTEGRATED-CIRCUITS - A REVIEW | 1983 | 24 | 18 | 67% |
THE CHALLENGES FOR HERMETIC ENCAPSULATION OF IMPLANTED DEVICES - A REVIEW | 1994 | 28 | 27 | 26% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | SECT PROD PROC QUAL | 17 | 79% | 1.1% | 11 |
2 | CS MANAGEMENT | 7 | 64% | 0.7% | 7 |
3 | CALCE ELECT PROD SYST | 2 | 10% | 1.6% | 15 |
4 | BOUWDIENST RIJKSWATERSTAAT | 1 | 100% | 0.2% | 2 |
5 | BRITISH HEART FDN SKELETAL MUSCLE ASSIST GRP | 1 | 50% | 0.2% | 2 |
6 | PROD PROC QUAL SECT | 1 | 100% | 0.2% | 2 |
7 | SYST PACKAGING 3D | 1 | 33% | 0.3% | 3 |
8 | IMPLANTED DEVICES GRP | 1 | 21% | 0.5% | 5 |
9 | EPRC | 1 | 25% | 0.3% | 3 |
10 | CALCE ELECT PACKAGING | 1 | 23% | 0.3% | 3 |
Related classes at same level (level 2) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000019834 | LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER |
2 | 0.0000017248 | ATMOSPHERIC CORROSION//GREEN RUST//WEATHERING STEEL |
3 | 0.0000013804 | ULTRASONIC WELDING//WIRE BONDING//ULTRASONIC CONSOLIDATION |
4 | 0.0000013133 | IEEE TRANSACTIONS ON RELIABILITY//RELIABILITY ENGINEERING & SYSTEM SAFETY//MICROELECTRONICS AND RELIABILITY |
5 | 0.0000009911 | TINPLATE//ABHURITE//MAT PROC TERMOMECAN |
6 | 0.0000008988 | SYSTEMS ENGINEERING//INTEGRATION READINESS LEVEL IRL//SYSTEM READINESS LEVEL SRL |
7 | 0.0000008251 | NANOELECT GIGASCALE SYST//ELECTROSTATIC DISCHARGE ESD//SILICON CONTROLLED RECTIFIER SCR |
8 | 0.0000007508 | FUNCTIONAL ELECTRICAL STIMULATION//RETINAL PROSTHESIS//VISUAL PROSTHESIS |
9 | 0.0000007359 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY//ARC EROSION//AG SNO2 |
10 | 0.0000005969 | DIFFUSION BARRIER//ELECTROMIGRATION//CU METALLIZATION |