Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
2900 | 2299 | 20.1 | 58% |
Classes in level above (level 3) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
15 | 127408 | IEEE TRANSACTIONS ON ELECTRON DEVICES//IEEE ELECTRON DEVICE LETTERS//SOLID-STATE ELECTRONICS |
Classes in level below (level 1) |
ID, lev. below | Publications | Label for level below |
---|---|---|
6060 | 1468 | HYDROGEN TERMINATION//SHIZUOKA TORY//LAYER BY LAYER OXIDATION |
22426 | 325 | CLEANROOM//FAN FILTER UNIT//ORGANIC CONTAMINATION |
24219 | 267 | SPRAY ETCHING//ETCH FACTOR//ETCHING FACTOR |
25232 | 239 | WET OZONE//PHOTORESIST REMOVAL//RESIST REMOVAL |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | PHOTORESIST REMOVAL | Author keyword | 14 | 65% | 1% | 13 |
2 | WET OZONE | Author keyword | 14 | 100% | 0% | 7 |
3 | HYDROGEN TERMINATION | Author keyword | 11 | 28% | 1% | 33 |
4 | SHIZUOKA TORY | Address | 11 | 100% | 0% | 6 |
5 | LAYER BY LAYER OXIDATION | Author keyword | 11 | 69% | 0% | 9 |
6 | CLEANROOM | Author keyword | 9 | 24% | 1% | 33 |
7 | NATIVE OXIDE | Author keyword | 9 | 26% | 1% | 28 |
8 | H TERMINATION | Author keyword | 8 | 46% | 1% | 13 |
9 | ORGANIC CONTAMINATION | Author keyword | 6 | 23% | 1% | 23 |
10 | NATIVE OXIDE GROWTH | Author keyword | 6 | 100% | 0% | 4 |
Web of Science journal categories |
Author Key Words |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | PHOTORESIST REMOVAL | 14 | 65% | 1% | 13 | Search PHOTORESIST+REMOVAL | Search PHOTORESIST+REMOVAL |
2 | WET OZONE | 14 | 100% | 0% | 7 | Search WET+OZONE | Search WET+OZONE |
3 | HYDROGEN TERMINATION | 11 | 28% | 1% | 33 | Search HYDROGEN+TERMINATION | Search HYDROGEN+TERMINATION |
4 | LAYER BY LAYER OXIDATION | 11 | 69% | 0% | 9 | Search LAYER+BY+LAYER+OXIDATION | Search LAYER+BY+LAYER+OXIDATION |
5 | CLEANROOM | 9 | 24% | 1% | 33 | Search CLEANROOM | Search CLEANROOM |
6 | NATIVE OXIDE | 9 | 26% | 1% | 28 | Search NATIVE+OXIDE | Search NATIVE+OXIDE |
7 | H TERMINATION | 8 | 46% | 1% | 13 | Search H+TERMINATION | Search H+TERMINATION |
8 | ORGANIC CONTAMINATION | 6 | 23% | 1% | 23 | Search ORGANIC+CONTAMINATION | Search ORGANIC+CONTAMINATION |
9 | NATIVE OXIDE GROWTH | 6 | 100% | 0% | 4 | Search NATIVE+OXIDE+GROWTH | Search NATIVE+OXIDE+GROWTH |
10 | PREOXIDE | 6 | 100% | 0% | 4 | Search PREOXIDE | Search PREOXIDE |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | HYDROGEN TERMINATION | 151 | 55% | 8% | 190 |
2 | HF TREATMENT | 39 | 49% | 3% | 59 |
3 | WAFER SURFACES | 27 | 51% | 2% | 38 |
4 | RESIST REMOVAL | 23 | 100% | 0% | 10 |
5 | ORGANIC CONTAMINATION | 23 | 56% | 1% | 28 |
6 | H TERMINATED SI111 | 22 | 68% | 1% | 19 |
7 | LEAKAGE CURRENT DENSITY | 21 | 90% | 0% | 9 |
8 | NH4F | 19 | 46% | 1% | 30 |
9 | HEATED CATALYZER | 17 | 72% | 1% | 13 |
10 | MINIENVIRONMENT | 15 | 88% | 0% | 7 |
Journals |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | MICRO | 2 | 11% | 1% | 20 |
Reviews |
Title | Publ. year | Cit. | Active references | % act. ref. to same field |
---|---|---|---|---|
Photoelectron spectroscopy studies of SiO2/Si interfaces | 2007 | 56 | 103 | 33% |
Non-Aqueous Cleaning Challenges for Preventing Damage to Fragile Nano-Structures: A Review | 2014 | 2 | 18 | 33% |
HYDROGEN ON SI - UBIQUITOUS SURFACE TERMINATION AFTER WET-CHEMICAL PROCESSING | 1995 | 62 | 78 | 63% |
Silicon dioxide sacrificial layer etching in surface micromachining | 1997 | 61 | 28 | 50% |
The picture tells the story: using surface morphology to probe chemical etching reactions | 2001 | 22 | 27 | 48% |
Functionalization of oxide-free silicon surfaces | 2013 | 3 | 166 | 27% |
Chemical structures of the SiO2/Si interface | 1995 | 72 | 169 | 34% |
WET CHEMICAL ETCHING OF SILICATE-GLASSES IN HYDROFLUORIC-ACID BASED SOLUTIONS | 1993 | 135 | 41 | 29% |
Development of an Environmentally Friendly Resist-Removal Process Using Wet Ozone | 2012 | 0 | 24 | 79% |
A REVIEW OF THE CHEMICAL-REACTION MECHANISM AND KINETICS FOR HYDROFLUORIC-ACID ETCHING OF SILICON DIOXIDE FOR SURFACE MICROMACHING APPLICATIONS | 1993 | 75 | 32 | 41% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | SHIZUOKA TORY | 11 | 100% | 0.3% | 6 |
2 | SYST SOLUT PLANNING | 4 | 67% | 0.2% | 4 |
3 | ABT SILIZIUMPHOTOVOLTAIK | 4 | 75% | 0.1% | 3 |
4 | DISPLAY TECHNOL DEV GRP | 4 | 44% | 0.3% | 7 |
5 | PHOTOENERGET ORGAN MAT | 4 | 19% | 0.8% | 18 |
6 | J AN SCI TECHNOL ORG | 4 | 46% | 0.3% | 6 |
7 | INTEGRATED TECHNOL SYST | 3 | 20% | 0.6% | 13 |
8 | LIQUID CRYSTAL DISPLAY GRP | 2 | 67% | 0.1% | 2 |
9 | T PJT MEMORY DEVICE SOLUT NETWORK | 2 | 67% | 0.1% | 2 |
10 | AIR CONDITIONING REFRIGERAT ENGN | 2 | 19% | 0.3% | 8 |
Related classes at same level (level 2) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000063006 | INTERFACIAL SILICON EMISSION//SILICON OXIDATION//GENIE URBAIN ENVIRONM |
2 | 0.0000030651 | SCANNING TUNNELING MICROSCOPY//ATOM WI LAYERS//VICINAL SINGLE CRYSTAL SURFACES |
3 | 0.0000020176 | AC SURFACE PHOTOVOLTAGE//ELECTRON WORK FUNCTION//SUPERCONDUCTIVITY MECHANISM |
4 | 0.0000015976 | CHEMICAL MECHANICAL POLISHING//CHEMICAL MECHANICAL PLANARIZATION//CMP |
5 | 0.0000015631 | POROUS SILICON//SILICON NANOCRYSTALS//SI NANOCRYSTALS |
6 | 0.0000013200 | HFO2//HIGH K//HIGH K DIELECTRICS |
7 | 0.0000013156 | SELF ASSEMBLED MONOLAYERS//SELF ASSEMBLED MONOLAYER//DIP PEN NANOLITHOGRAPHY |
8 | 0.0000012827 | SIGE//GERMANIUM//STRAINED SI |
9 | 0.0000012499 | ELECT DEVICES MAT TECHNOL//PLASMA ETCHING//SIO2 ETCHING |
10 | 0.0000011225 | IEEE TRANSACTIONS ON ELECTRON DEVICES//IEEE ELECTRON DEVICE LETTERS//SOLID-STATE ELECTRONICS |