Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
2847 | 2446 | 18.8 | 50% |
Classes in level above (level 3) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
315 | 35473 | SURFACE & COATINGS TECHNOLOGY//PLASMA NITRIDING//HIGH ENTROPY ALLOYS |
Classes in level below (level 1) |
ID, lev. below | Publications | Label for level below |
---|---|---|
10693 | 975 | PARASITIC REACTION//CVD REACTOR//MOCVD REACTOR |
18318 | 492 | MICROBENDING LOSS//OPTICAL FIBER MECHANICAL FACTORS//AEM GRP |
20709 | 388 | RAPID THERMAL PROCESSING RTP//RAPID THERMAL PROCESSING//CTOD FRACTURE TOUGHNESS TESTING |
22037 | 339 | MEASUREMENT ENGN SENSOR TECHNOL//PHYS TECHNOL LOW DIMENS STRUCT//PLANAR MICROCAVITIES |
27909 | 179 | INTERFACIAL SHEARS//NON LOCAL STRESS CURVATURE RELATIONS//NON UNIFORM MISFIT STRAIN |
34356 | 73 | PIN CHUCK//VACUUM PIN CHUCK//WAFER FLATNESS |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | INTERFACIAL SHEARS | Author keyword | 20 | 100% | 0% | 9 |
2 | MICROBENDING LOSS | Author keyword | 12 | 63% | 0% | 12 |
3 | RAPID THERMAL PROCESSING RTP | Author keyword | 10 | 38% | 1% | 20 |
4 | RAPID THERMAL PROCESSING | Author keyword | 9 | 20% | 2% | 41 |
5 | PIN CHUCK | Author keyword | 9 | 67% | 0% | 8 |
6 | NON LOCAL STRESS CURVATURE RELATIONS | Author keyword | 8 | 100% | 0% | 5 |
7 | NON UNIFORM MISFIT STRAIN | Author keyword | 8 | 100% | 0% | 5 |
8 | VACUUM PIN CHUCK | Author keyword | 8 | 100% | 0% | 5 |
9 | SURFSCAN ADE | Address | 6 | 80% | 0% | 4 |
10 | CTOD FRACTURE TOUGHNESS TESTING | Author keyword | 6 | 100% | 0% | 4 |
Web of Science journal categories |
Author Key Words |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | MOCVD REACTORS | 54 | 75% | 2% | 39 |
2 | WALL TUBULAR REACTORS | 32 | 85% | 1% | 17 |
3 | INDUCED MICROBENDING LOSSES | 31 | 92% | 0% | 12 |
4 | INDUCED STRESS VOIDS | 30 | 84% | 1% | 16 |
5 | VAPOR DEPOSITION REACTOR | 25 | 66% | 1% | 23 |
6 | CVD CARBON | 23 | 100% | 0% | 10 |
7 | HORIZONTAL REACTORS | 19 | 80% | 0% | 12 |
8 | COMPLEX FLOW PHENOMENA | 17 | 79% | 0% | 11 |
9 | CVD REACTORS | 17 | 72% | 1% | 13 |
10 | FILM SUBSTRATE SYSTEMS | 16 | 54% | 1% | 21 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references | % act. ref. to same field |
---|---|---|---|---|
FLOW PHENOMENA IN CHEMICAL VAPOR-DEPOSITION OF THIN-FILMS | 1991 | 108 | 63 | 67% |
Chemical vapour deposition of coatings | 2003 | 524 | 205 | 6% |
Metal organic vapour phase epitaxy of AlN, GaN, InN and their alloys: A key chemical technology for advanced device applications | 2013 | 12 | 159 | 13% |
MODELING AND CONTROL OF MICROELECTRONICS MATERIALS PROCESSING | 1995 | 31 | 105 | 43% |
Predictive Analytical Thermal Stress Modeling in Electronics and Photonics | 2009 | 5 | 59 | 63% |
DESIGN AND MODELING OF CHEMICAL VAPOR-DEPOSITION REACTORS | 1992 | 28 | 96 | 75% |
Fluid-dynamics during vapor epitaxy and modeling | 2003 | 6 | 34 | 94% |
Temperature Measurement in Rapid Thermal Processing with Focus on the Application to Flash Lamp Annealing | 2011 | 2 | 13 | 46% |
Effect of temperature rise and hydrostatic pressure on microbending loss and refractive index change in double-coated optical fiber | 2006 | 2 | 12 | 83% |
Kinetic approach to materials synthesis by gas-phase deposition | 1998 | 11 | 60 | 57% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | SURFSCAN ADE | 6 | 80% | 0.2% | 4 |
2 | SILICON NANOELECT | 5 | 44% | 0.3% | 8 |
3 | AEM GRP | 2 | 67% | 0.1% | 2 |
4 | FUNDAMENTAL SCI DEF WIDE BAND G SE | 2 | 67% | 0.1% | 2 |
5 | MEASUREMENT ENGN SENSOR TECHNOL | 2 | 67% | 0.1% | 2 |
6 | MECH ENGN MARIBOR | 2 | 67% | 0.1% | 2 |
7 | PHYS TECHNOL LOW DIMENS STRUCT | 2 | 67% | 0.1% | 2 |
8 | RTP PROD BUSINESS UNIT | 2 | 67% | 0.1% | 2 |
9 | ISOBE RD | 2 | 31% | 0.2% | 5 |
10 | DIPARTIMENTO CHIM FIS PLICATA | 2 | 14% | 0.4% | 11 |
Related classes at same level (level 2) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000015531 | INTERFACIAL SILICON EMISSION//SILICON OXIDATION//GENIE URBAIN ENVIRONM |
2 | 0.0000013906 | GAAS ON SI//GAAS SI//GAINP |
3 | 0.0000013170 | DIFFUSION BARRIER//ELECTROMIGRATION//CU METALLIZATION |
4 | 0.0000010288 | SIGE//GERMANIUM//STRAINED SI |
5 | 0.0000009379 | ELECT DEVICES MAT TECHNOL//PLASMA ETCHING//SIO2 ETCHING |
6 | 0.0000008624 | ELLIPSOMETRY//MUELLER MATRIX//NANOOPT PROPERTY |
7 | 0.0000008562 | DRAW RESONANCE//FILM CASTING//MELT BLOWING |
8 | 0.0000007044 | LASER MICRO CLADDING//FREEFORM FABRICAT S//DIMETHYLALUMINUM HYDRIDE |
9 | 0.0000006933 | GAN//NITRIDES//GALLIUM NITRIDE |
10 | 0.0000006849 | PROPER ORTHOGONAL DECOMPOSITION//REDUCED BASIS METHOD//REDUCED BASIS METHODS |