Class information for:
Level 2: CHEMICAL MECHANICAL POLISHING//CHEMICAL MECHANICAL PLANARIZATION//CMP

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
2776 2621 19.7 52%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 3)


ID, lev.
above		 Publications Label for level above
288 37686 INTERNATIONAL JOURNAL OF ROCK MECHANICS AND MINING SCIENCES//ENGINEERING, MANUFACTURING//INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Classes in level below (level 1)


ID, lev. below Publications Label for level below
2892 2045 CHEMICAL MECHANICAL POLISHING//CHEMICAL MECHANICAL PLANARIZATION//CMP
19644 431 MAKYOH TOPOGRAPHY//WIRE SAWING//WAFER PRODUCTION
29943 145 BIASED DC PLASMA SPUTTERING//CIRCUIT PATTERN//AL2O3 ABRASIVE

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 CHEMICAL MECHANICAL POLISHING Author keyword 284 56% 13% 351
2 CHEMICAL MECHANICAL PLANARIZATION Author keyword 93 65% 3% 88
3 CMP Author keyword 84 31% 8% 221
4 CHEMICAL MECHANICAL POLISHING CMP Author keyword 72 48% 4% 111
5 CHEMICAL MECHANICAL PLANARIZATION CMP Author keyword 39 60% 2% 43
6 DISHING Author keyword 30 68% 1% 27
7 NANO SOI PROC Address 26 55% 1% 33
8 FAB Address 25 77% 1% 17
9 POST CMP CLEANING Author keyword 17 55% 1% 21
10 COPPER CMP Author keyword 17 75% 0% 12

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 CHEMICAL MECHANICAL POLISHING 284 56% 13% 351 Search CHEMICAL+MECHANICAL+POLISHING Search CHEMICAL+MECHANICAL+POLISHING
2 CHEMICAL MECHANICAL PLANARIZATION 93 65% 3% 88 Search CHEMICAL+MECHANICAL+PLANARIZATION Search CHEMICAL+MECHANICAL+PLANARIZATION
3 CMP 84 31% 8% 221 Search CMP Search CMP
4 CHEMICAL MECHANICAL POLISHING CMP 72 48% 4% 111 Search CHEMICAL+MECHANICAL+POLISHING+CMP Search CHEMICAL+MECHANICAL+POLISHING+CMP
5 CHEMICAL MECHANICAL PLANARIZATION CMP 39 60% 2% 43 Search CHEMICAL+MECHANICAL+PLANARIZATION+CMP Search CHEMICAL+MECHANICAL+PLANARIZATION+CMP
6 DISHING 30 68% 1% 27 Search DISHING Search DISHING
7 POST CMP CLEANING 17 55% 1% 21 Search POST+CMP+CLEANING Search POST+CMP+CLEANING
8 COPPER CMP 17 75% 0% 12 Search COPPER+CMP Search COPPER+CMP
9 DIAMOND CONDITIONER 17 75% 0% 12 Search DIAMOND+CONDITIONER Search DIAMOND+CONDITIONER
10 WITHIN WAFER NON UNIFORMITY 17 100% 0% 8 Search WITHIN+WAFER+NON+UNIFORMITY Search WITHIN+WAFER+NON+UNIFORMITY

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 CMP 538 77% 14% 367
2 CHEMICAL MECHANICAL PLANARIZATION 209 71% 6% 169
3 PLANARIZATION 194 54% 10% 252
4 COPPER CMP 82 92% 1% 33
5 CMP PROCESS 49 82% 1% 28
6 REMOVAL RATE 46 63% 2% 46
7 CMP SLURRIES 44 100% 1% 16
8 IODATE BASED SLURRIES 24 91% 0% 10
9 MICRO CONTACT 23 79% 1% 15
10 SLURRY 22 12% 7% 176

Journals

Reviews


Title Publ. year Cit. Active references % act. ref.
to same field
Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms 2010 73 86 70%
Chemical mechanical planarization for microelectronics applications 2004 214 141 62%
Grinding of silicon wafers: A review from historical perspectives 2008 31 28 93%
Review on copper chemical-mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI) - An electrochemical perspective 2007 49 54 80%
Mechanical properties of nanoparticles: basics and applications 2014 14 249 14%
Colloid aspects of chemical-mechanical planarization 2008 33 55 65%
Hydrodynamics of slurry flow in chemical mechanical polishing - A review 2006 27 26 92%
Basic mechanisms and models of multi-wire sawing 2004 64 23 52%
Machining processes for sapphire wafers: a literature review 2011 6 27 78%
Simultaneous double side grinding of silicon wafers: a literature review 2006 11 7 100%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 NANO SOI PROC 26 55% 1.3% 33
2 FAB 25 77% 0.6% 17
3 ENERGY OURCES TECHNOL 14 46% 0.9% 23
4 ADV SEMICOND MAT DEVICE DEV 8 50% 0.4% 11
5 SEMICOND DISPLAY 6 80% 0.2% 4
6 ADV SEMICOND MAT DEVICES DEV 6 41% 0.4% 11
7 GP TECHNOL 6 100% 0.2% 4
8 SEE TEAM 4 67% 0.2% 4
9 ELECT RD GRP 4 75% 0.1% 3
10 SHENZHEN MICRO NANO MFG 3 43% 0.2% 6

Related classes at same level (level 2)


Rank Relatedness score Related classes
1 0.0000015976 PHOTORESIST REMOVAL//WET OZONE//HYDROGEN TERMINATION
2 0.0000013631 INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE//ENGINEERING, MANUFACTURING//MACHINING SCIENCE AND TECHNOLOGY
3 0.0000013432 DIFFUSION BARRIER//ELECTROMIGRATION//CU METALLIZATION
4 0.0000009550 CORROSION INHIBITION//MILD STEEL//ACID INHIBITION
5 0.0000006956 INDUSTRIAL DIAMOND REVIEW//PROVINCIAL KEY STONE MACHINING//ROCK CUTTING
6 0.0000006240 DE ALLOYING//NANOPOROUS COPPER//NANOPOROUS GOLD
7 0.0000005837 ELECTROCHEMICAL OSCILLATIONS//IRON ELECTRODISSOLUTION//POTENTIAL OSCILLATIONS
8 0.0000005828 BGAAS//REGIONAL DENSITY FUNCTIONAL THEORY//HIGH P SURE GRP
9 0.0000005811 NANOTRIBOLOGY//DRY ADHESIVE//DRY ADHESION
10 0.0000005667 PHYSICOCHEMICAL AND STRUCTURAL PROPERTIES//SOL EMULSION GEL//MONODISPERSED PARTICLE