Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
2646 | 2988 | 19.9 | 60% |
Classes in level above (level 3) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
315 | 35473 | SURFACE & COATINGS TECHNOLOGY//PLASMA NITRIDING//HIGH ENTROPY ALLOYS |
Classes in level below (level 1) |
ID, lev. below | Publications | Label for level below |
---|---|---|
2151 | 2272 | HIPIMS//HPPMS//HIGH POWER IMPULSE MAGNETRON SPUTTERING |
23796 | 280 | FUSED HOLLOW CATHODE//HOLLOW CATHODE//PLASMA GRP |
27288 | 191 | LASER POLISHING//SELF ION ASSISTED DEPOSITION//QUASISTATIC PROBLEM OF THERMOELASTICITY |
29324 | 154 | ENERGY RESOLVED MASS SPECTROSCOPY//TRIODE ION PLATING//HOLLOW CATHODE ARC PLASMA |
33463 | 91 | ENVIRONM DEV SOC GRP//STAKEHOLDER MAP//STAKEHOLDER STRATEGY |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | HIPIMS | Author keyword | 99 | 68% | 3% | 87 |
2 | HPPMS | Author keyword | 38 | 70% | 1% | 32 |
3 | HIGH POWER IMPULSE MAGNETRON SPUTTERING | Author keyword | 35 | 62% | 1% | 36 |
4 | GRP DRAFT | Address | 32 | 78% | 1% | 21 |
5 | IONIZED PHYSICAL VAPOR DEPOSITION | Author keyword | 22 | 81% | 0% | 13 |
6 | IFM MAT PHYS | Address | 22 | 55% | 1% | 27 |
7 | TARGET UTILIZATION | Author keyword | 21 | 90% | 0% | 9 |
8 | PULSED MAGNETRON | Author keyword | 20 | 100% | 0% | 9 |
9 | MAGNETRON | Author keyword | 19 | 21% | 3% | 80 |
10 | PLASMA COATINGS PHYS | Address | 18 | 56% | 1% | 22 |
Web of Science journal categories |
Author Key Words |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | PULSED MAGNETRON DISCHARGE | 55 | 87% | 1% | 27 |
2 | TARGET EROSION | 49 | 94% | 1% | 17 |
3 | PLANAR MAGNETRON | 42 | 61% | 2% | 45 |
4 | PHYSICAL VAPOR DEPOSITION | 39 | 24% | 5% | 144 |
5 | TITANIUM DEPOSITION | 31 | 92% | 0% | 12 |
6 | GAS RAREFACTION | 30 | 100% | 0% | 12 |
7 | SPUTTERING DISCHARGE | 27 | 83% | 1% | 15 |
8 | POWER DENSITIES | 26 | 56% | 1% | 32 |
9 | METAL IONIZATION | 23 | 100% | 0% | 10 |
10 | CYLINDRICAL MAGNETRON | 18 | 89% | 0% | 8 |
Journals |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | VAKUUM-TECHNIK | 3 | 13% | 1% | 18 |
Reviews |
Title | Publ. year | Cit. | Active references | % act. ref. to same field |
---|---|---|---|---|
High power impulse magnetron sputtering discharge | 2012 | 98 | 197 | 94% |
High power pulsed magnetron sputtering: A review on scientific and engineering state of the art | 2010 | 201 | 111 | 68% |
Fundamental understanding and modeling of reactive sputtering processes | 2005 | 243 | 17 | 94% |
Ionized physical vapor deposition (IPVD): A review of technology and applications | 2006 | 317 | 154 | 49% |
An introduction to thin film processing using high-power impulse magnetron sputtering | 2012 | 53 | 103 | 79% |
Control of reactive sputtering processes | 2005 | 142 | 22 | 95% |
Physics and phenomena in pulsed magnetrons: an overview | 2009 | 30 | 55 | 95% |
The use of hollow cathodes in deposition processes: A critical review | 2015 | 1 | 200 | 33% |
Computer modelling of magnetron discharges | 2009 | 23 | 51 | 94% |
Plasma diagnostics for understanding the plasma-surface interaction in HiPIMS discharges: a review | 2014 | 3 | 288 | 65% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | GRP DRAFT | 32 | 78% | 0.7% | 21 |
2 | IFM MAT PHYS | 22 | 55% | 0.9% | 27 |
3 | PLASMA COATINGS PHYS | 18 | 56% | 0.7% | 22 |
4 | NANOTECHNOL PVD | 9 | 43% | 0.6% | 17 |
5 | CHIM INORGAN ANALYT | 9 | 32% | 0.8% | 23 |
6 | PLASMA GRP | 8 | 41% | 0.5% | 16 |
7 | FUNCT COATING SUR E ENGN | 6 | 80% | 0.1% | 4 |
8 | PHYS VVI | 6 | 50% | 0.3% | 9 |
9 | SUR E ENGN GRP | 6 | 20% | 0.9% | 27 |
10 | LOW TEMP PLASMA | 6 | 33% | 0.5% | 15 |
Related classes at same level (level 2) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000029840 | SURFACE & COATINGS TECHNOLOGY//PLASMA NITRIDING//EXPANDED AUSTENITE |
2 | 0.0000023337 | PLASMA SOURCES SCIENCE & TECHNOLOGY//PLASMA DISPLAY PANEL PDP//PLASMA DISPLAY PANEL |
3 | 0.0000021933 | VACUUM ARC//CATHODE SPOT//VACUUM ARCS |
4 | 0.0000018260 | DIFFUSION BARRIER//ELECTROMIGRATION//CU METALLIZATION |
5 | 0.0000013549 | TITANIUM OXIDE//TIO2 110//TIO2 THIN FILMS |
6 | 0.0000013463 | SURFACE DIFFUSION//ISLAND MORPHOLOGY//LATINOAMER ESTUDIOS ILYA PRIGOGINE |
7 | 0.0000010577 | DIAMOND LIKE CARBON//CARBON NITRIDE//DIAMOND AND RELATED MATERIALS |
8 | 0.0000010335 | PLASMA PROP//HALL THRUSTER//PLASMADYNAM ELECT PROP |
9 | 0.0000009831 | CIRCULAR BRAGG PHENOMENON//GLANCING ANGLE DEPOSITION//ANTIREFLECTION |
10 | 0.0000008905 | ELECT DEVICES MAT TECHNOL//PLASMA ETCHING//SIO2 ETCHING |