Class information for:
Level 2: DIFFUSION BARRIER//ELECTROMIGRATION//CU METALLIZATION

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
1792 5778 20.3 56%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 3)


ID, lev.
above		 Publications Label for level above
315 35473 SURFACE & COATINGS TECHNOLOGY//PLASMA NITRIDING//HIGH ENTROPY ALLOYS

Classes in level below (level 1)


ID, lev. below Publications Label for level below
2875 2050 ELECTROMIGRATION//STRESS INDUCED MIGRATION//PRC MER
3747 1840 DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE
13042 800 CVD W//FEATURE SCALE MODEL//FOCUS NEW YORK
16516 584 TUNGSTEN NITRIDE//WNX//GRP MAT ENGN SUPERFICIES
22185 334 W TI THIN FILMS//WTI THIN FILMS//SURFACE LASER TREATMENT
28345 170 CROSS BRIDGE KELVIN RESISTOR CBKR//CROSS KELVIN RESISTOR CKR//CROSS BRIDGE KELVIN RESISTOR

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 DIFFUSION BARRIER Author keyword 109 36% 4% 245
2 ELECTROMIGRATION Author keyword 100 25% 6% 342
3 CU METALLIZATION Author keyword 68 64% 1% 67
4 TANTALUM NITRIDE Author keyword 40 46% 1% 64
5 TUNGSTEN NITRIDE Author keyword 31 51% 1% 44
6 TA SI N Author keyword 27 78% 0% 18
7 CU DIFFUSION BARRIER Author keyword 21 75% 0% 15
8 STRESS INDUCED MIGRATION Author keyword 21 85% 0% 11
9 COPPER METALLIZATION Author keyword 18 41% 1% 34
10 ELECTROMIGRATION EM Author keyword 17 51% 0% 24

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 DIFFUSION BARRIER 109 36% 4% 245 Search DIFFUSION+BARRIER Search DIFFUSION+BARRIER
2 ELECTROMIGRATION 100 25% 6% 342 Search ELECTROMIGRATION Search ELECTROMIGRATION
3 CU METALLIZATION 68 64% 1% 67 Search CU+METALLIZATION Search CU+METALLIZATION
4 TANTALUM NITRIDE 40 46% 1% 64 Search TANTALUM+NITRIDE Search TANTALUM+NITRIDE
5 TUNGSTEN NITRIDE 31 51% 1% 44 Search TUNGSTEN+NITRIDE Search TUNGSTEN+NITRIDE
6 TA SI N 27 78% 0% 18 Search TA+SI+N Search TA+SI+N
7 CU DIFFUSION BARRIER 21 75% 0% 15 Search CU+DIFFUSION+BARRIER Search CU+DIFFUSION+BARRIER
8 STRESS INDUCED MIGRATION 21 85% 0% 11 Search STRESS+INDUCED+MIGRATION Search STRESS+INDUCED+MIGRATION
9 COPPER METALLIZATION 18 41% 1% 34 Search COPPER+METALLIZATION Search COPPER+METALLIZATION
10 ELECTROMIGRATION EM 17 51% 0% 24 Search ELECTROMIGRATION+EM Search ELECTROMIGRATION+EM

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 DIFFUSION BARRIER 121 35% 5% 281
2 COPPER METALLIZATION 97 53% 2% 128
3 CU METALLIZATION 92 59% 2% 103
4 METALLIZATIONS 85 57% 2% 101
5 TAN 83 60% 2% 91
6 ELECTROMIGRATION 79 20% 6% 348
7 METALLIZATION 69 15% 7% 415
8 DIFFUSION BARRIERS 69 34% 3% 169
9 COPPER SILICIDES 52 82% 1% 31
10 ALUMINUM BASED METALLIZATIONS 44 100% 0% 16

Journals

Reviews


Title Publ. year Cit. Active
references		 % act. ref.
to same field
Ultrathin diffusion barriers/liners for gigascale copper metallization 2000 242 52 77%
Electromigration reliability issues in dual-damascene Cu interconnections 2002 120 97 80%
Copper metallization for high performance silicon technology 2000 241 15 47%
Electromigration of Cu/low dielectric constant interconnects 2006 71 33 76%
ELECTROMIGRATION IN METALS 1989 373 18 61%
On the use of alloying elements for Cu interconnect applications 2006 55 28 82%
Copper interconnections and reliability 1998 172 34 50%
Electromigration: A review 1997 111 42 90%
Electromigration in integrated circuit conductors 1999 83 14 79%
Electromigration in submicron interconnect features of integrated circuits 2011 9 68 75%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 PRC MER 13 71% 0.2% 10
2 ADV PROC C ACITOR 11 67% 0.2% 10
3 EE PHYS ELECT 6 80% 0.1% 4
4 INTERCONNECT PACKAGING 6 33% 0.3% 15
5 SUR E EVALUAT 6 100% 0.1% 4
6 GRP MAT ENGN SUPERFICIES 5 47% 0.1% 8
7 NEW YORK STATE ADV THIN FILM TECHNOL 5 50% 0.1% 7
8 MEMORY DEV 5 18% 0.4% 24
9 CORP QUAL NETWORK 4 67% 0.1% 4
10 MINIST EDUC BAND G SEMICOND MAT DEVICES 4 67% 0.1% 4

Related classes at same level (level 2)


Rank Relatedness score Related classes
1 0.0000026060 ATOMIC LAYER DEPOSITION//CHEMICAL VAPOR DEPOSITION//MOLECULAR LAYER DEPOSITION MLD
2 0.0000018260 HIPIMS//HPPMS//HIGH POWER IMPULSE MAGNETRON SPUTTERING
3 0.0000015631 SURFACE & COATINGS TECHNOLOGY//PLASMA NITRIDING//EXPANDED AUSTENITE
4 0.0000013911 LASER MICRO CLADDING//FREEFORM FABRICAT S//DIMETHYLALUMINUM HYDRIDE
5 0.0000013805 BETA FESI2//SILICIDE//SILICIDES
6 0.0000013432 CHEMICAL MECHANICAL POLISHING//CHEMICAL MECHANICAL PLANARIZATION//CMP
7 0.0000013170 INTERFACIAL SHEARS//MICROBENDING LOSS//RAPID THERMAL PROCESSING RTP
8 0.0000012284 HIGH ENTROPY ALLOYS//HIGH ENTROPY ALLOY//PARTICLES HIGH ENERGY PHYS
9 0.0000011652 SURFACE DIFFUSION//ISLAND MORPHOLOGY//LATINOAMER ESTUDIOS ILYA PRIGOGINE
10 0.0000009444 PLASMA POLYMERIZATION//PLASMA PROCESSES AND POLYMERS//LOW K