Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
1406 | 7566 | 16.4 | 42% |
Classes in level above (level 3) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
129 | 64324 | IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION//MICROWAVE AND OPTICAL TECHNOLOGY LETTERS//IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS |
Classes in level below (level 1) |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | Journal | 624 | 42% | 15% | 1154 |
2 | SIGNAL INTEGRITY | Author keyword | 123 | 41% | 3% | 237 |
3 | REVERBERATION CHAMBER RC | Author keyword | 108 | 88% | 1% | 51 |
4 | REVERBERATION CHAMBER | Author keyword | 97 | 50% | 2% | 140 |
5 | SIMULTANEOUS SWITCHING NOISE | Author keyword | 71 | 64% | 1% | 69 |
6 | SIMULTANEOUS SWITCHING NOISE SSN | Author keyword | 62 | 65% | 1% | 60 |
7 | SUBSTRATE NOISE | Author keyword | 61 | 53% | 1% | 82 |
8 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | Journal | 61 | 23% | 3% | 233 |
9 | INTERCONNECT MODELING | Author keyword | 49 | 69% | 1% | 41 |
10 | SUBSTRATE COUPLING | Author keyword | 41 | 58% | 1% | 48 |
Web of Science journal categories |
Author Key Words |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | SIGNAL INTEGRITY | 123 | 41% | 3% | 237 | Search SIGNAL+INTEGRITY | Search SIGNAL+INTEGRITY |
2 | REVERBERATION CHAMBER RC | 108 | 88% | 1% | 51 | Search REVERBERATION+CHAMBER+RC | Search REVERBERATION+CHAMBER+RC |
3 | REVERBERATION CHAMBER | 97 | 50% | 2% | 140 | Search REVERBERATION+CHAMBER | Search REVERBERATION+CHAMBER |
4 | SIMULTANEOUS SWITCHING NOISE | 71 | 64% | 1% | 69 | Search SIMULTANEOUS+SWITCHING+NOISE | Search SIMULTANEOUS+SWITCHING+NOISE |
5 | SIMULTANEOUS SWITCHING NOISE SSN | 62 | 65% | 1% | 60 | Search SIMULTANEOUS+SWITCHING+NOISE+SSN | Search SIMULTANEOUS+SWITCHING+NOISE+SSN |
6 | SUBSTRATE NOISE | 61 | 53% | 1% | 82 | Search SUBSTRATE+NOISE | Search SUBSTRATE+NOISE |
7 | INTERCONNECT MODELING | 49 | 69% | 1% | 41 | Search INTERCONNECT+MODELING | Search INTERCONNECT+MODELING |
8 | SUBSTRATE COUPLING | 41 | 58% | 1% | 48 | Search SUBSTRATE+COUPLING | Search SUBSTRATE+COUPLING |
9 | POWER INTEGRITY | 37 | 44% | 1% | 64 | Search POWER+INTEGRITY | Search POWER+INTEGRITY |
10 | REVERBERATION CHAMBERS | 35 | 67% | 0% | 31 | Search REVERBERATION+CHAMBERS | Search REVERBERATION+CHAMBERS |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | MULTICONDUCTOR TRANSMISSION LINES | 71 | 58% | 1% | 83 |
2 | HIGH SPEED CIRCUITS | 69 | 68% | 1% | 61 |
3 | FREQUENCY DEPENDENT PARAMETERS | 67 | 89% | 0% | 31 |
4 | GROUND BOUNCE NOISE | 63 | 70% | 1% | 52 |
5 | WAVE FORM EVALUATION | 62 | 50% | 1% | 88 |
6 | SIMULTANEOUS SWITCHING NOISE | 59 | 61% | 1% | 62 |
7 | COMPUTATIONAL ELECTROMAGNETICS CEM | 34 | 57% | 1% | 40 |
8 | METALLIC ENCLOSURES | 33 | 100% | 0% | 13 |
9 | SELECTIVE VALIDATION FSV | 33 | 57% | 1% | 39 |
10 | TRANSMISSION LINES | 31 | 12% | 3% | 232 |
Journals |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | 624 | 42% | 15% | 1154 |
2 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 61 | 23% | 3% | 233 |
3 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 17 | 20% | 1% | 76 |
4 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 13 | 11% | 1% | 113 |
Reviews |
Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
---|---|---|---|---|
Simulation of high-speed interconnects | 2001 | 286 | 59 | 92% |
The Electromagnetic Compatibility of Integrated Circuits-Past, Present, and Future | 2009 | 49 | 44 | 84% |
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects | 2010 | 29 | 52 | 52% |
Substrate noise coupling in SoC design: Modeling, avoidance, and validation | 2006 | 36 | 54 | 89% |
A Review on the Drawbacks and Enhancement Opportunities of the Feature Selective Validation | 2014 | 1 | 9 | 89% |
Reverberation-chamber research - Then and now: A review of early work and comparison with current understanding | 2002 | 39 | 9 | 100% |
Review of Printed-Circuit-Board Level EMI/EMC Issues and Tools | 2010 | 8 | 6 | 100% |
Progress in the methodologies for the electrical modeling of interconnects and electronic packages | 2001 | 68 | 60 | 58% |
Development and Application of Integrated Optical Sensors for Intense E-Field Measurement | 2012 | 6 | 54 | 35% |
Digital circuit optimization via geometric programming | 2005 | 54 | 92 | 27% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | ELE OMAGNET COMPATIBIL | 41 | 51% | 0.8% | 57 |
2 | UAQ EMC | 41 | 63% | 0.5% | 41 |
3 | TERAHERTZ INTERCONNECT PACKAGE | 11 | 56% | 0.2% | 14 |
4 | RADIO SCI SECT | 11 | 78% | 0.1% | 7 |
5 | ELECT ENGN MEASUREMENT SCI | 8 | 100% | 0.1% | 5 |
6 | FIABILISAT SYST EMBARQUES | 8 | 100% | 0.1% | 5 |
7 | ELE OMAGNET COMPATIBIL GRP | 7 | 38% | 0.2% | 15 |
8 | AFDELING ESAT MICAS | 6 | 80% | 0.1% | 4 |
9 | ELECT ELECT CONTROL RUMENTAT ENG | 6 | 80% | 0.1% | 4 |
10 | GRP COMPATIBILITAT ELE OMAGNET | 6 | 80% | 0.1% | 4 |
Related classes at same level (level 2) |