Class information for:
Level 1: LEAD FREE SOLDER//PB FREE SOLDER//LEAD FREE SOLDERS

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
96 4318 22.7 65%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
688 12395 LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 LEAD FREE SOLDER Author keyword 410 54% 12% 527
2 PB FREE SOLDER Author keyword 137 59% 4% 152
3 LEAD FREE SOLDERS Author keyword 126 59% 3% 141
4 JOURNAL OF ELECTRONIC MATERIALS Journal 96 10% 20% 878
5 INTERMETALLIC COMPOUND IMC Author keyword 81 67% 2% 74
6 INTERFACIAL REACTION Author keyword 80 30% 5% 228
7 SOLDER Author keyword 79 31% 5% 213
8 SN ZN Author keyword 79 88% 1% 37
9 COMPOSITE SOLDER Author keyword 78 83% 1% 44
10 SOLDERING Author keyword 68 31% 4% 182

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 LEAD FREE SOLDER 410 54% 12% 527 Search LEAD+FREE+SOLDER Search LEAD+FREE+SOLDER
2 PB FREE SOLDER 137 59% 4% 152 Search PB+FREE+SOLDER Search PB+FREE+SOLDER
3 LEAD FREE SOLDERS 126 59% 3% 141 Search LEAD+FREE+SOLDERS Search LEAD+FREE+SOLDERS
4 INTERMETALLIC COMPOUND IMC 81 67% 2% 74 Search INTERMETALLIC+COMPOUND+IMC Search INTERMETALLIC+COMPOUND+IMC
5 INTERFACIAL REACTION 80 30% 5% 228 Search INTERFACIAL+REACTION Search INTERFACIAL+REACTION
6 SOLDER 79 31% 5% 213 Search SOLDER Search SOLDER
7 SN ZN 79 88% 1% 37 Search SN+ZN Search SN+ZN
8 COMPOSITE SOLDER 78 83% 1% 44 Search COMPOSITE+SOLDER Search COMPOSITE+SOLDER
9 SOLDERING 68 31% 4% 182 Search SOLDERING Search SOLDERING
10 PB FREE SOLDERS 66 74% 1% 50 Search PB+FREE+SOLDERS Search PB+FREE+SOLDERS

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 LEAD FREE SOLDERS 608 67% 13% 542
2 LEAD FREE SOLDER 345 68% 7% 305
3 EUTECTIC SNPB 298 76% 5% 208
4 INTERFACIAL REACTIONS 286 45% 11% 473
5 BUMP METALLIZATION 237 80% 3% 146
6 CU SUBSTRATE 183 74% 3% 135
7 SN AG CU 165 63% 4% 165
8 PB FREE SOLDERS 164 75% 3% 118
9 FLIP CHIP TECHNOLOGY 140 86% 2% 70
10 SN AG 113 59% 3% 127

Journals


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 JOURNAL OF ELECTRONIC MATERIALS 96 10% 20% 878
2 SOLDERING & SURFACE MOUNT TECHNOLOGY 35 29% 2% 104

Reviews


Title Publ. year Cit. Active references % act. ref.
to same field
Interfacial reactions between lead-free solders and common base materials 2005 529 56 71%
Six cases of reliability study of Pb-free solder joints in electronic packaging technology 2002 850 55 80%
Lead-free solders in microelectronics 2000 1001 20 80%
Properties of lead-free solder alloys with rare earth element additions 2004 312 69 90%
Interfacial reaction issues for lead-free electronic solders 2007 138 82 98%
Impurity and alloying effects on interfacial reaction layers in Pb-free soldering 2010 90 126 79%
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints 2010 67 95 95%
A review: On the development of low melting temperature Pb-free solders 2014 9 108 94%
Magnetic nanoparticle-based solder composites for electronic packaging applications 2015 2 128 53%
Failure mechanisms of solder interconnects under current stressing in advanced electronic packages 2010 63 97 94%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 ELECT PACKAGING MAT 29 63% 0.7% 29
2 MICROJOINING 12 36% 0.6% 26
3 ASSEMBLY TEST GLOBAL MAT 11 100% 0.1% 6
4 TIANJIN ADV JOINTING TECHNOL 10 46% 0.4% 17
5 ELECT PACKAGING 10 24% 0.9% 38
6 INORGAN CHEM MAT CHEM 9 23% 0.8% 35
7 KEY STATE NEW DISPLAYS SYST INTEGRAT 9 83% 0.1% 5
8 ANORGAN CHEM MAT CHEM 7 53% 0.2% 9
9 MICRO ELECT PACKAGING CONSORTIUM 6 80% 0.1% 4
10 NIHON SUPER MANU TURE ELECT MAT 6 80% 0.1% 4

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000213206 JOURNAL OF ELECTRONIC PACKAGING//SOLDERING & SURFACE MOUNT TECHNOLOGY//SOLDER JOINT
2 0.0000203558 FLUXLESS BONDING//AU SN SOLDER//MAT MFG TECHNOL PROGRAM
3 0.0000173522 TIN WHISKER//TIN WHISKERS//SN WHISKER
4 0.0000121498 SPEISS//COPPER RICH ALLOY//NI PB
5 0.0000105079 IMPRESSION CREEP//INDENTATION CREEP TESTING//IMPRESSION TEST
6 0.0000087573 ALLOY THERMODYNAMICS//THERMODYNAMIC PREDICTING METHODS//GIPRONIKEL
7 0.0000071787 NANOSCALE SILVER PASTE//NANOSILVER PASTE//TIANJIN ADV JOINING TECHNOL
8 0.0000065433 SHANDITE//HETEROMETALLIC BONDS//PARKERITE
9 0.0000062242 TIN ELECTRODEPOSITION//CONNECTING RELIABILITY//POLYETHER LAPROL
10 0.0000060758 INNER LEAD BONDING ILB//INNER LEAD BONDING//LASER SOLDERING