Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
8178 | 1211 | 19.7 | 55% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
358 | 16774 | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS//SENSORS AND ACTUATORS A-PHYSICAL//JOURNAL OF MICROMECHANICS AND MICROENGINEERING |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | ANISOTROPIC ETCHING | Author keyword | 28 | 27% | 7% | 89 |
2 | MICRONANOSYST ENGN | Address | 23 | 86% | 1% | 12 |
3 | MEMS MICRO NANO SYST | Address | 13 | 80% | 1% | 8 |
4 | MICRO NANOSYST ENGN | Address | 13 | 80% | 1% | 8 |
5 | CONVEX CORNER | Author keyword | 10 | 73% | 1% | 8 |
6 | TMAH | Author keyword | 8 | 19% | 3% | 36 |
7 | TEXTURIZATION | Author keyword | 7 | 26% | 2% | 23 |
8 | TEXTURISATION | Author keyword | 7 | 46% | 1% | 11 |
9 | MICRONANO MED DEVICES | Address | 6 | 80% | 0% | 4 |
10 | TMAH SOLUTION | Author keyword | 6 | 80% | 0% | 4 |
Web of Science journal categories |
Author Key Words |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | ANISOTROPIC ETCHING | 28 | 27% | 7% | 89 | Search ANISOTROPIC+ETCHING | Search ANISOTROPIC+ETCHING |
2 | CONVEX CORNER | 10 | 73% | 1% | 8 | Search CONVEX+CORNER | Search CONVEX+CORNER |
3 | TMAH | 8 | 19% | 3% | 36 | Search TMAH | Search TMAH |
4 | TEXTURIZATION | 7 | 26% | 2% | 23 | Search TEXTURIZATION | Search TEXTURIZATION |
5 | TEXTURISATION | 7 | 46% | 1% | 11 | Search TEXTURISATION | Search TEXTURISATION |
6 | TMAH SOLUTION | 6 | 80% | 0% | 4 | Search TMAH+SOLUTION | Search TMAH+SOLUTION |
7 | ANISOTROPIC ETCHING OF SILICON | 6 | 71% | 0% | 5 | Search ANISOTROPIC+ETCHING+OF+SILICON | Search ANISOTROPIC+ETCHING+OF+SILICON |
8 | ELECTROCHEMICAL ETCH STOP | 6 | 50% | 1% | 8 | Search ELECTROCHEMICAL+ETCH+STOP | Search ELECTROCHEMICAL+ETCH+STOP |
9 | ETCHING SIMULATION | 5 | 60% | 0% | 6 | Search ETCHING+SIMULATION | Search ETCHING+SIMULATION |
10 | ACIDIC ETCHING | 5 | 54% | 1% | 7 | Search ACIDIC+ETCHING | Search ACIDIC+ETCHING |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | AQUEOUS KOH | 98 | 69% | 7% | 85 |
2 | TMAH | 43 | 50% | 5% | 62 |
3 | KOH | 30 | 21% | 10% | 124 |
4 | DISSOLUTION SLOWNESS SURFACE | 23 | 100% | 1% | 10 |
5 | TEXTURIZATION | 17 | 38% | 3% | 36 |
6 | CONVEX CORNERS | 13 | 55% | 1% | 16 |
7 | ROTATED QUARTZ PLATES | 12 | 86% | 0% | 6 |
8 | KOH SOLUTION | 11 | 46% | 1% | 18 |
9 | NAOH SOLUTIONS | 11 | 28% | 3% | 33 |
10 | THICKNESS CONTROL | 10 | 73% | 1% | 8 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references | % act. ref. to same field |
---|---|---|---|---|
The effect of alcohol additives on etching characteristics in KOH solutions | 2002 | 47 | 9 | 100% |
Fabrication techniques of convex corners in a (100)-silicon wafer using bulk micromachining: a review | 2007 | 21 | 56 | 68% |
Texturization of silicon wafers with Na2CO3 and Na2CO3/NaHCO3 solutions for heterojunction solar-cell applications | 2013 | 1 | 23 | 65% |
Anisotropy in the wet-etching of semiconductors | 2005 | 17 | 38 | 45% |
In search of perfection: Understanding the highly defect-selective chemistry of anisotropic etching | 2003 | 55 | 55 | 25% |
Model of anisotropic etching process for single crystal silicon | 1999 | 0 | 6 | 100% |
Galvanic Cell Formation: A Review of Approaches to Silicon Etching for Sensor Fabrication | 2001 | 13 | 50 | 44% |
Silicon microstructuring technology | 1996 | 121 | 24 | 21% |
Etch stop techniques for micromachining | 1997 | 32 | 218 | 30% |
Surface modification via wet chemical etching of single-crystalline silicon for photovoltaic application | 2013 | 0 | 19 | 42% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | MICRONANOSYST ENGN | 23 | 86% | 1.0% | 12 |
2 | MEMS MICRO NANO SYST | 13 | 80% | 0.7% | 8 |
3 | MICRO NANOSYST ENGN | 13 | 80% | 0.7% | 8 |
4 | MICRONANO MED DEVICES | 6 | 80% | 0.3% | 4 |
5 | INTEGRAT SENSORS ACTUATORS | 3 | 50% | 0.3% | 4 |
6 | RIM SOLID STATE CHEM | 2 | 19% | 0.9% | 11 |
7 | ENERGIA FOTOVOLTA | 2 | 67% | 0.2% | 2 |
8 | MICRO SYST ENGN | 2 | 12% | 1.2% | 14 |
9 | MICROSENSOR STRUCT | 2 | 43% | 0.2% | 3 |
10 | MICRO NANO SYST ENGN | 2 | 14% | 0.9% | 11 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000118394 | PIEZORESISTANCE//CAPACITIVE PRESSURE SENSOR//TOUCH MODE |
2 | 0.0000111790 | METAL ASSISTED CHEMICAL ETCHING//METAL ASSISTED ETCHING//RADIAL JUNCTION |
3 | 0.0000101558 | SPRAY ETCHING//ETCH FACTOR//ETCHING FACTOR |
4 | 0.0000089831 | INTER E ENGN GRP//CHAIR GEN MAT SCI//ALCOY ENGN |
5 | 0.0000081268 | HYDROGEN TERMINATION//SHIZUOKA TORY//LAYER BY LAYER OXIDATION |
6 | 0.0000076035 | IEEE JOURNAL OF PHOTOVOLTAICS//SILICON SOLAR CELLS//PROGRESS IN PHOTOVOLTAICS |
7 | 0.0000066032 | ANGULAR RATE SENSOR//VIBRATORY GYROSCOPE//VIBRATORY GYRO SENSOR |
8 | 0.0000061974 | ANTIREFLECTION//ANTI REFLECTION//MOTH EYE |
9 | 0.0000060956 | SOLAR CELL TEST//6224//POLY SILICON FILM |
10 | 0.0000060281 | HIGH RESOLUTION X RAY MICROSCOPY//INNER SHELL ELECTRON EXCITATION//INTENSE X RAYS |