Class information for:
Level 1: ELECTROLESS COPPER PLATING//ELECTROLESS COPPER DEPOSITION//ELECTROLESS DEPOSITION

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
7972 1231 21.5 58%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
504 14575 PLATING AND SURFACE FINISHING//ELECTRODEPOSITION//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 ELECTROLESS COPPER PLATING Author keyword 19 37% 3% 41
2 ELECTROLESS COPPER DEPOSITION Author keyword 18 61% 2% 19
3 ELECTROLESS DEPOSITION Author keyword 14 14% 8% 96
4 BOTTOM UP FILL Author keyword 8 100% 0% 5
5 COWP FILM Author keyword 8 100% 0% 5
6 ELECTROLESS COPPER Author keyword 7 40% 1% 14
7 HYPOPHOSPHITE ION Author keyword 6 80% 0% 4
8 ELECTROLESS DEPOSITION PROCESS Author keyword 6 71% 0% 5
9 ELECTROLESS Author keyword 5 13% 3% 36
10 PALLADIUM ACTIVATION Author keyword 4 67% 0% 4

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 ELECTROLESS COPPER PLATING 19 37% 3% 41 Search ELECTROLESS+COPPER+PLATING Search ELECTROLESS+COPPER+PLATING
2 ELECTROLESS COPPER DEPOSITION 18 61% 2% 19 Search ELECTROLESS+COPPER+DEPOSITION Search ELECTROLESS+COPPER+DEPOSITION
3 ELECTROLESS DEPOSITION 14 14% 8% 96 Search ELECTROLESS+DEPOSITION Search ELECTROLESS+DEPOSITION
4 BOTTOM UP FILL 8 100% 0% 5 Search BOTTOM+UP+FILL Search BOTTOM+UP+FILL
5 COWP FILM 8 100% 0% 5 Search COWP+FILM Search COWP+FILM
6 ELECTROLESS COPPER 7 40% 1% 14 Search ELECTROLESS+COPPER Search ELECTROLESS+COPPER
7 HYPOPHOSPHITE ION 6 80% 0% 4 Search HYPOPHOSPHITE+ION Search HYPOPHOSPHITE+ION
8 ELECTROLESS DEPOSITION PROCESS 6 71% 0% 5 Search ELECTROLESS+DEPOSITION+PROCESS Search ELECTROLESS+DEPOSITION+PROCESS
9 ELECTROLESS 5 13% 3% 36 Search ELECTROLESS Search ELECTROLESS
10 PALLADIUM ACTIVATION 4 67% 0% 4 Search PALLADIUM+ACTIVATION Search PALLADIUM+ACTIVATION

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 ULTRALARGE SCALE INTEGRATION 48 76% 3% 34
2 COW P THIN FILMS 30 84% 1% 16
3 BUILDUP LAYERS 23 100% 1% 10
4 ALKYL CARBOXYLIC ACID 21 90% 1% 9
5 WET CHEMICAL TREATMENTS 18 83% 1% 10
6 COPPER DEPOSITION 18 24% 5% 63
7 BIS 3 SULFOPROPYL DISULFIDE SPS 17 79% 1% 11
8 CU DEPOSITION 17 75% 1% 12
9 EXCESS TRIETHANOLAMINE 17 100% 1% 8
10 ULSI 15 27% 4% 48

Journals

Reviews


Title Publ. year Cit. Active references % act. ref.
to same field
Catalytic characterization of hollow silver/palladium nanoparticles synthesized by a displacement reaction 2009 15 11 64%
Metallization and nanostructuring of semiconductor surfaces by galvanic displacement processes 2007 65 137 27%
Selective Electroless Metallization of Patterned Polymeric Films for Lithography Applications 2009 57 242 20%
Improving electroless Cu via filling with optimized Pd activation 2006 17 23 70%
Selective electroless copper deposition on aluminum nitride substrate with patterned copper seed layer 2005 14 12 58%
Test methods for measuring tensile strength and ductility of electroplated and electroless copper deposits 2001 1 5 60%
30 years of electroless plating for semiconductor and polymer micro-systems 2015 0 112 38%
METALLIZATION OF PLASTICS BY ELECTROLESS PLATING 1993 4 29 72%
X-RAY PHOTOEMISSION SPECTROSCOPIC STUDY OF THE EFFECT OF OZONE ON VARIOUS STYRENE BUTADIENE CO-POLYMERS 1983 1 1 100%
EFFECTS OF OZONE EXPOSURE ON THE PHYSICAL-PROPERTIES OF BUTADIENE AND STYRENE BUTADIENE CO-POLYMERS 1983 0 1 100%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 MAT GEOSCI 2 15% 1.1% 13
2 TFCG 2 29% 0.4% 5
3 ADV NANOTECH DEV 1 50% 0.2% 2
4 MICROSYST TECHNOL CMST ELIS 1 100% 0.2% 2
5 PROTECT INFORMAT 1 100% 0.2% 2
6 ELIS TFCG 1 40% 0.2% 2
7 NANOSTRUCT SEMICOND ENGN 1 40% 0.2% 2
8 DIGITAL DISPLAY ENGN 1 16% 0.4% 5
9 SCI INGN SUR ES 1 12% 0.5% 6
10 DIPARTIMENTO MAT CHIM INGN CHIM GIULIO NATTA 1 50% 0.1% 1

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000204490 COATING OF NON STOICHIOMETRIC COPPER SULPHIDE//XPS INVESTIGATION//COBALT SULPHIDE COATINGS
2 0.0000202527 ELECTROLESS//ELECTROLESS PLATING//ELECTROLESS NICKEL
3 0.0000127037 SELF ANNEALING//COPPER ELECTRODEPOSITION//COPPER ELECTROPLATING
4 0.0000088255 PERFLUORINATED CARBOXYLATES//COPPER CVD//IR AND NMR
5 0.0000086291 UDIL//BRINDISI FUEL CELL DURABIL//LEVELLERS
6 0.0000085122 FLEXIBLE COPPER CLAD LAMINATE//FLEXIBLE COPPER CLAD LAMINATE FCCL//SILANE MODIFIED POLYVINYLIMIDAZOLE
7 0.0000072729 NI W ALLOYS//INDUCED CODEPOSITION//NI W ALLOY
8 0.0000069477 DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE
9 0.0000063849 SC SECTOR//TAN THIN FILM//CLEANER ELECT GRP
10 0.0000060691 ULTRASONIC CLEANING//ULTRASOUND RADIATION PRESSURE//REFRIGERANTS ALTERNATIVE