Class information for:
Level 1: WAFER BONDING//ANODIC BONDING//SILICON WAFER BONDING

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
5609 1534 18.7 58%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
688 12395 LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 WAFER BONDING Author keyword 37 22% 10% 148
2 ANODIC BONDING Author keyword 34 35% 5% 79
3 SILICON WAFER BONDING Author keyword 27 78% 1% 18
4 DIRECT BONDING Author keyword 12 30% 2% 34
5 ROOM TEMPERATURE BONDING Author keyword 8 41% 1% 16
6 WAFER DIRECT BONDING Author keyword 7 43% 1% 13
7 HERMETICITY Author keyword 7 32% 1% 19
8 AR BEAM Author keyword 6 80% 0% 4
9 LATTICE UNDULATION Author keyword 6 80% 0% 4
10 LOW TEMPERATURE BONDING Author keyword 6 27% 1% 20

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 WAFER BONDING 37 22% 10% 148 Search WAFER+BONDING Search WAFER+BONDING
2 ANODIC BONDING 34 35% 5% 79 Search ANODIC+BONDING Search ANODIC+BONDING
3 SILICON WAFER BONDING 27 78% 1% 18 Search SILICON+WAFER+BONDING Search SILICON+WAFER+BONDING
4 DIRECT BONDING 12 30% 2% 34 Search DIRECT+BONDING Search DIRECT+BONDING
5 ROOM TEMPERATURE BONDING 8 41% 1% 16 Search ROOM+TEMPERATURE+BONDING Search ROOM+TEMPERATURE+BONDING
6 WAFER DIRECT BONDING 7 43% 1% 13 Search WAFER+DIRECT+BONDING Search WAFER+DIRECT+BONDING
7 HERMETICITY 7 32% 1% 19 Search HERMETICITY Search HERMETICITY
8 AR BEAM 6 80% 0% 4 Search AR+BEAM Search AR+BEAM
9 LATTICE UNDULATION 6 80% 0% 4 Search LATTICE+UNDULATION Search LATTICE+UNDULATION
10 LOW TEMPERATURE BONDING 6 27% 1% 20 Search LOW+TEMPERATURE+BONDING Search LOW+TEMPERATURE+BONDING

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 ATOMIC REARRANGEMENT 35 76% 2% 25
2 HERMETICITY 13 80% 1% 8
3 ION DRIFT PROCESSES 13 80% 1% 8
4 ROOM TEMPERATURE WAFER 12 75% 1% 9
5 BEAM SURFACE ACTIVATION 11 65% 1% 11
6 155 MU M WAVELENGTH LASERS 11 78% 0% 7
7 WAVELENGTH LASERS 9 48% 1% 13
8 DIELECTRIC ISOLATION 7 64% 0% 7
9 PLASMA ACTIVATION 7 64% 0% 7
10 SILICON FUSION 6 80% 0% 4

Journals

Reviews


Title Publ. year Cit. Active references % act. ref.
to same field
Wafer level packaging of MEMS 2008 87 33 45%
Adhesive wafer bonding 2006 198 79 32%
Wafer direct bonding: tailoring adhesion between brittle materials 1999 125 246 63%
Adhesion quantification methods for wafer bonding 2005 50 181 78%
Semiconductor wafer bonding 1998 106 69 67%
Anodic bonding 2006 55 131 50%
Wafer direct bonding: From advance substrate engineering to future applications in micro/nanoelectronics 2006 72 154 39%
Review of Test Methods Used for the Measurement of Hermeticity in Packages Containing Small Cavities 2012 3 8 88%
Measurements of True Leak Rates of MEMS Packages 2012 2 10 70%
SEMICONDUCTOR WAFER BONDING - A REVIEW OF INTERFACIAL PROPERTIES AND APPLICATIONS 1992 77 92 58%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ.
in class
1 WAFER BONDING 7 67% 0.4% 6
2 NANOMETER SCALE MFG SCI 2 67% 0.1% 2
3 ORION ELECT CO LTD 2 67% 0.1% 2
4 ZENTRUM MIKROTECHNOL 2 22% 0.4% 6
5 SP2M NRS 1 38% 0.2% 3
6 ADV MICROSYST INTEGRAT PACKAGING 1 100% 0.1% 2
7 OPTOELECT OKI 1 100% 0.1% 2
8 COMPUTAT DYNAM FRACTURE MECH 1 27% 0.2% 3
9 UBIQUITOUS MEMS MICRO ENGN UMEMSME 1 16% 0.3% 5
10 HIDEC 1 33% 0.1% 2

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000123970 WET ETCHING OF GLASS//DEEP GLASS ETCHING//TECH SUPPORT MACHINERY MET IND
2 0.0000108214 ION CUT//SURFACE BLISTERING//SMART CUT
3 0.0000102111 THROUGH SILICON VIA TSV//3 D INTEGRATION//KEEP OUT ZONE KOZ
4 0.0000094946 FLUXLESS BONDING//AU SN SOLDER//MAT MFG TECHNOL PROGRAM
5 0.0000090403 EPITAXIAL LIFT OFF//EPITAXIAL LIFT OFF ELO//PHOTONIC DOT
6 0.0000088206 BENZOCYCLOBUTENE//MICROWAVE MICROSYST//NON PLANAR DEVICES
7 0.0000073155 PIEZORESISTANCE//CAPACITIVE PRESSURE SENSOR//TOUCH MODE
8 0.0000071410 ANAL STRUCT MAT//UNITE RECH PHYS SOLIDE//TECHNOL SILICIUM
9 0.0000059045 UNCOOLED INFRARED IMAGING//OPTICAL READOUT//MICROBOLOMETER
10 0.0000051958 BIONEM BIO NANO ENGN TECHNOL MED//SOFT MATTER STRUCT GRP ID13//FLUIDIC INTERCONNECT