Class information for:
Level 1: STRIP BENDING TEST//MEMS PROD//HIGH CYCLE FATIGUE TEST

Basic class information

ID Publications Average number
of references
Avg. shr. active
ref. in WoS
5420 1559 24.9 60%



Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)



ID, lev.
above
Publications Label for level above
358 16774 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS//SENSORS AND ACTUATORS A-PHYSICAL//JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Terms with highest relevance score



Rank Term Type of term Relevance score
(tfidf)
Class's shr.
of term's tot.
occurrences
Shr. of publ.
in class containing
term
Num. of
publ. in
class
1 STRIP BENDING TEST Author keyword 15 88% 0% 7
2 MEMS PROD Address 11 100% 0% 6
3 HIGH CYCLE FATIGUE TEST Author keyword 6 80% 0% 4
4 POLYSILICON MEMS Author keyword 6 80% 0% 4
5 REACTION LAYER FATIGUE Author keyword 6 71% 0% 5
6 BULGE TEST Author keyword 5 19% 1% 22
7 MEMS MATERIAL Author keyword 4 67% 0% 4
8 MAT SCI INTERCONNECT PACKAGING Address 4 75% 0% 3
9 MEMS BUSINESS UNIT Address 3 43% 0% 6
10 MICRO ESPI Author keyword 3 100% 0% 3

Web of Science journal categories

Author Key Words



Rank Web of Science journal category Relevance score
(tfidf)
Class's shr.
of term's tot.
occurrences
Shr. of publ.
in class containing
term
Num. of
publ. in
class
LCSH search Wikipedia search
1 STRIP BENDING TEST 15 88% 0% 7 Search STRIP+BENDING+TEST Search STRIP+BENDING+TEST
2 HIGH CYCLE FATIGUE TEST 6 80% 0% 4 Search HIGH+CYCLE+FATIGUE+TEST Search HIGH+CYCLE+FATIGUE+TEST
3 POLYSILICON MEMS 6 80% 0% 4 Search POLYSILICON+MEMS Search POLYSILICON+MEMS
4 REACTION LAYER FATIGUE 6 71% 0% 5 Search REACTION+LAYER+FATIGUE Search REACTION+LAYER+FATIGUE
5 BULGE TEST 5 19% 1% 22 Search BULGE+TEST Search BULGE+TEST
6 MEMS MATERIAL 4 67% 0% 4 Search MEMS+MATERIAL Search MEMS+MATERIAL
7 MICRO ESPI 3 100% 0% 3 Search MICRO+ESPI Search MICRO+ESPI
8 ELECTROSTATIC FORCE GRIP 3 60% 0% 3 Search ELECTROSTATIC+FORCE+GRIP Search ELECTROSTATIC+FORCE+GRIP
9 OUT OF PLANE ESPI 3 60% 0% 3 Search OUT+OF+PLANE+ESPI Search OUT+OF+PLANE+ESPI
10 THIN FILM PLASTICITY 3 60% 0% 3 Search THIN+FILM+PLASTICITY Search THIN+FILM+PLASTICITY

Key Words Plus



Rank Web of Science journal category Relevance score
(tfidf)
Class's shr.
of term's tot.
occurrences
Shr. of publ.
in class containing
term
Num. of
publ. in
class
1 GRAINED FILMS 40 82% 1% 23
2 MEMS MATERIALS 32 65% 2% 31
3 STRUCTURAL FILMS 32 78% 1% 21
4 POLYSILICON 21 14% 9% 138
5 SCALE POLYCRYSTALLINE SILICON 18 83% 1% 10
6 FREESTANDING GOLD FILMS 16 64% 1% 16
7 SILICON STRUCTURAL FILMS 15 82% 1% 9
8 LOAD DEFLECTION 13 40% 2% 25
9 COPPER FILMS 13 18% 4% 64
10 BULGE TEST 13 31% 2% 34

Journals

Reviews



Title Publ. year Cit. Active
references
% act. ref.
to same field
Microscale characterization of mechanical properties 2007 110 86 43%
Toughness evaluation of hard coatings and thin films 2012 41 81 25%
Mechanisms for fatigue of micron-scale silicon structural films 2007 50 53 75%
Dynamic fatigue of silicon 2004 62 22 82%
Strength and sharp contact fracture of silicon 2006 95 88 31%
Wafer-Scale Microtensile Testing of Thin Films 2009 17 58 60%
A review of MEMS-based microscale and nanoscale tensile and bending testing 2003 69 23 78%
A critical review of microscale mechanical testing methods used in the design of microelectromechanical systems 2003 72 70 76%
A review of deformation and fatigue of metals at small size scales 2005 48 73 49%
Mechanical testing of thin films and small structures 2001 81 54 52%

Address terms



Rank Address term Relevance score
(tfidf)
Class's shr.
of term's tot.
occurrences
Shr. of publ.
in class containing
term
Num. of
publ.
in class
1 MEMS PROD 11 100% 0.4% 6
2 MAT SCI INTERCONNECT PACKAGING 4 75% 0.2% 3
3 MEMS BUSINESS UNIT 3 43% 0.4% 6
4 MICROSYST MAT GRP 3 100% 0.2% 3
5 ESTERLINE SENSORS GRP 3 60% 0.2% 3
6 MANOR ADT 2 67% 0.1% 2
7 MECH RELIABIL MODELING 2 43% 0.2% 3
8 MH 1 38% 0.2% 3
9 E ARZT 1 100% 0.1% 2
10 MAHRS UNIT 1 100% 0.1% 2

Related classes at same level (level 1)



Rank Relatedness score Related classes
1 0.0000133536 DISLOCATION DYNAMICS//DISCRETE DISLOCATION DYNAMICS//DISLOCATION STARVATION
2 0.0000111715 AMERG//PHYS PROCEDES VIDE//INTRINSIC STRESS
3 0.0000104975 INTERFACIAL SHEARS//NON LOCAL STRESS CURVATURE RELATIONS//NON UNIFORM MISFIT STRAIN
4 0.0000100410 PROBE CARD//POROUS SILICON MICROMACHINING//VERTICAL ACTIVE DEVICES
5 0.0000089990 CLEAVAGE CRACKING//CRACK TRAPPING EFFECT//HEAT TREATMENT BY ANNEALING
6 0.0000083746 RF MEMS//RF MICROELECTROMECHANICAL SYSTEMS MEMS//DIELECTRIC CHARGING
7 0.0000082281 MODIFIED COUPLE STRESS THEORY//PULL IN INSTABILITY//DYNAMIC PULL IN INSTABILITY
8 0.0000080786 ELECTROMIGRATION//STRESS INDUCED MIGRATION//PRC MER
9 0.0000080307 MICROMIRROR//VARIABLE OPTICAL ATTENUATOR VOA//VERTICAL COMBDRIVES
10 0.0000077803 ACCELERATION SWITCH//INERTIAL SWITCH//CONSTANT FORCE MECHANISM