Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
5420 | 1559 | 24.9 | 60% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
358 | 16774 | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS//SENSORS AND ACTUATORS A-PHYSICAL//JOURNAL OF MICROMECHANICS AND MICROENGINEERING |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | STRIP BENDING TEST | Author keyword | 15 | 88% | 0% | 7 |
2 | MEMS PROD | Address | 11 | 100% | 0% | 6 |
3 | HIGH CYCLE FATIGUE TEST | Author keyword | 6 | 80% | 0% | 4 |
4 | POLYSILICON MEMS | Author keyword | 6 | 80% | 0% | 4 |
5 | REACTION LAYER FATIGUE | Author keyword | 6 | 71% | 0% | 5 |
6 | BULGE TEST | Author keyword | 5 | 19% | 1% | 22 |
7 | MEMS MATERIAL | Author keyword | 4 | 67% | 0% | 4 |
8 | MAT SCI INTERCONNECT PACKAGING | Address | 4 | 75% | 0% | 3 |
9 | MEMS BUSINESS UNIT | Address | 3 | 43% | 0% | 6 |
10 | MICRO ESPI | Author keyword | 3 | 100% | 0% | 3 |
Web of Science journal categories |
Author Key Words |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | STRIP BENDING TEST | 15 | 88% | 0% | 7 | Search STRIP+BENDING+TEST | Search STRIP+BENDING+TEST |
2 | HIGH CYCLE FATIGUE TEST | 6 | 80% | 0% | 4 | Search HIGH+CYCLE+FATIGUE+TEST | Search HIGH+CYCLE+FATIGUE+TEST |
3 | POLYSILICON MEMS | 6 | 80% | 0% | 4 | Search POLYSILICON+MEMS | Search POLYSILICON+MEMS |
4 | REACTION LAYER FATIGUE | 6 | 71% | 0% | 5 | Search REACTION+LAYER+FATIGUE | Search REACTION+LAYER+FATIGUE |
5 | BULGE TEST | 5 | 19% | 1% | 22 | Search BULGE+TEST | Search BULGE+TEST |
6 | MEMS MATERIAL | 4 | 67% | 0% | 4 | Search MEMS+MATERIAL | Search MEMS+MATERIAL |
7 | MICRO ESPI | 3 | 100% | 0% | 3 | Search MICRO+ESPI | Search MICRO+ESPI |
8 | ELECTROSTATIC FORCE GRIP | 3 | 60% | 0% | 3 | Search ELECTROSTATIC+FORCE+GRIP | Search ELECTROSTATIC+FORCE+GRIP |
9 | OUT OF PLANE ESPI | 3 | 60% | 0% | 3 | Search OUT+OF+PLANE+ESPI | Search OUT+OF+PLANE+ESPI |
10 | THIN FILM PLASTICITY | 3 | 60% | 0% | 3 | Search THIN+FILM+PLASTICITY | Search THIN+FILM+PLASTICITY |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | GRAINED FILMS | 40 | 82% | 1% | 23 |
2 | MEMS MATERIALS | 32 | 65% | 2% | 31 |
3 | STRUCTURAL FILMS | 32 | 78% | 1% | 21 |
4 | POLYSILICON | 21 | 14% | 9% | 138 |
5 | SCALE POLYCRYSTALLINE SILICON | 18 | 83% | 1% | 10 |
6 | FREESTANDING GOLD FILMS | 16 | 64% | 1% | 16 |
7 | SILICON STRUCTURAL FILMS | 15 | 82% | 1% | 9 |
8 | LOAD DEFLECTION | 13 | 40% | 2% | 25 |
9 | COPPER FILMS | 13 | 18% | 4% | 64 |
10 | BULGE TEST | 13 | 31% | 2% | 34 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
---|---|---|---|---|
Microscale characterization of mechanical properties | 2007 | 110 | 86 | 43% |
Toughness evaluation of hard coatings and thin films | 2012 | 41 | 81 | 25% |
Mechanisms for fatigue of micron-scale silicon structural films | 2007 | 50 | 53 | 75% |
Dynamic fatigue of silicon | 2004 | 62 | 22 | 82% |
Strength and sharp contact fracture of silicon | 2006 | 95 | 88 | 31% |
Wafer-Scale Microtensile Testing of Thin Films | 2009 | 17 | 58 | 60% |
A review of MEMS-based microscale and nanoscale tensile and bending testing | 2003 | 69 | 23 | 78% |
A critical review of microscale mechanical testing methods used in the design of microelectromechanical systems | 2003 | 72 | 70 | 76% |
A review of deformation and fatigue of metals at small size scales | 2005 | 48 | 73 | 49% |
Mechanical testing of thin films and small structures | 2001 | 81 | 54 | 52% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | MEMS PROD | 11 | 100% | 0.4% | 6 |
2 | MAT SCI INTERCONNECT PACKAGING | 4 | 75% | 0.2% | 3 |
3 | MEMS BUSINESS UNIT | 3 | 43% | 0.4% | 6 |
4 | MICROSYST MAT GRP | 3 | 100% | 0.2% | 3 |
5 | ESTERLINE SENSORS GRP | 3 | 60% | 0.2% | 3 |
6 | MANOR ADT | 2 | 67% | 0.1% | 2 |
7 | MECH RELIABIL MODELING | 2 | 43% | 0.2% | 3 |
8 | MH | 1 | 38% | 0.2% | 3 |
9 | E ARZT | 1 | 100% | 0.1% | 2 |
10 | MAHRS UNIT | 1 | 100% | 0.1% | 2 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000133536 | DISLOCATION DYNAMICS//DISCRETE DISLOCATION DYNAMICS//DISLOCATION STARVATION |
2 | 0.0000111715 | AMERG//PHYS PROCEDES VIDE//INTRINSIC STRESS |
3 | 0.0000104975 | INTERFACIAL SHEARS//NON LOCAL STRESS CURVATURE RELATIONS//NON UNIFORM MISFIT STRAIN |
4 | 0.0000100410 | PROBE CARD//POROUS SILICON MICROMACHINING//VERTICAL ACTIVE DEVICES |
5 | 0.0000089990 | CLEAVAGE CRACKING//CRACK TRAPPING EFFECT//HEAT TREATMENT BY ANNEALING |
6 | 0.0000083746 | RF MEMS//RF MICROELECTROMECHANICAL SYSTEMS MEMS//DIELECTRIC CHARGING |
7 | 0.0000082281 | MODIFIED COUPLE STRESS THEORY//PULL IN INSTABILITY//DYNAMIC PULL IN INSTABILITY |
8 | 0.0000080786 | ELECTROMIGRATION//STRESS INDUCED MIGRATION//PRC MER |
9 | 0.0000080307 | MICROMIRROR//VARIABLE OPTICAL ATTENUATOR VOA//VERTICAL COMBDRIVES |
10 | 0.0000077803 | ACCELERATION SWITCH//INERTIAL SWITCH//CONSTANT FORCE MECHANISM |