Class information for:
Level 1: SELF ANNEALING//COPPER ELECTRODEPOSITION//COPPER ELECTROPLATING

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
4740 1661 23.4 59%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
504 14575 PLATING AND SURFACE FINISHING//ELECTRODEPOSITION//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 SELF ANNEALING Author keyword 18 61% 1% 19
2 COPPER ELECTRODEPOSITION Author keyword 15 34% 2% 37
3 COPPER ELECTROPLATING Author keyword 15 46% 1% 24
4 GLOBAL BUSINESS UNIT ELECT MAT Address 15 88% 0% 7
5 SUPERFILLING Author keyword 10 73% 0% 8
6 VIA FILLING Author keyword 9 48% 1% 13
7 LONGITUDINAL MICROSTRUCTURE Author keyword 6 80% 0% 4
8 DUAL DAMASCENE FABRICATION PROCESS Author keyword 6 100% 0% 4
9 FTIRRAS Author keyword 6 100% 0% 4
10 THROUGH HOLE ELECTRODEPOSITION Author keyword 6 100% 0% 4

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 SELF ANNEALING 18 61% 1% 19 Search SELF+ANNEALING Search SELF+ANNEALING
2 COPPER ELECTRODEPOSITION 15 34% 2% 37 Search COPPER+ELECTRODEPOSITION Search COPPER+ELECTRODEPOSITION
3 COPPER ELECTROPLATING 15 46% 1% 24 Search COPPER+ELECTROPLATING Search COPPER+ELECTROPLATING
4 SUPERFILLING 10 73% 0% 8 Search SUPERFILLING Search SUPERFILLING
5 VIA FILLING 9 48% 1% 13 Search VIA+FILLING Search VIA+FILLING
6 LONGITUDINAL MICROSTRUCTURE 6 80% 0% 4 Search LONGITUDINAL+MICROSTRUCTURE Search LONGITUDINAL+MICROSTRUCTURE
7 DUAL DAMASCENE FABRICATION PROCESS 6 100% 0% 4 Search DUAL+DAMASCENE+FABRICATION+PROCESS Search DUAL+DAMASCENE+FABRICATION+PROCESS
8 FTIRRAS 6 100% 0% 4 Search FTIRRAS Search FTIRRAS
9 THROUGH HOLE ELECTRODEPOSITION 6 100% 0% 4 Search THROUGH+HOLE+ELECTRODEPOSITION Search THROUGH+HOLE+ELECTRODEPOSITION
10 THROUGH HOLE FILLING 6 100% 0% 4 Search THROUGH+HOLE+FILLING Search THROUGH+HOLE+FILLING

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 SUPERCONFORMAL ELECTRODEPOSITION 225 83% 8% 127
2 4 5 DITHIAOCTANE 1 8 DISULFONIC ACID 79 87% 2% 39
3 DAMASCENE ELECTRODEPOSITION 77 96% 1% 24
4 ELECTROPLATING BATH 70 89% 2% 32
5 BLOCKING INHIBITORS 67 85% 2% 35
6 SUBMICROMETER TRENCHES 58 92% 1% 23
7 ROOM TEMPERATURE RECRYSTALLIZATION 52 100% 1% 18
8 ELECTROPLATED COPPER 46 62% 3% 48
9 ADDITIVE SYSTEM 42 94% 1% 15
10 COPPER ELECTRODEPOSITION 41 40% 5% 81

Journals

Reviews


Title Publ. year Cit. Active references % act. ref.
to same field
Microvia filling by copper electroplating using diazine black as a leveler 2009 23 50 100%
Superconformal Electrodeposition for 3-Dimensional Interconnects 2010 10 33 61%
Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide 2009 8 102 67%
SOME FUNDAMENTAL-ASPECTS OF LEVELING AND BRIGHTENING IN METAL ELECTRODEPOSITION 1991 152 10 40%
On the role of poly(ethylene glycol) in deposition of galvanic copper coatings 1998 30 20 65%
Advanced plating technology for electronic devices 2006 3 16 63%
A computational multi-reaction model of a Cu electrolysis cell 2009 1 6 50%
Modeling of acid copper electroplating: A review 1998 6 37 78%
Research Progress on Uniformity of MEMS Micro-Device Electrodeposition 2011 1 34 32%
Impact of trench aspect ratio on microstructure variation in as-deposited and annealed damascene Cu interconnect lines 2004 8 4 25%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ.
in class
1 GLOBAL BUSINESS UNIT ELECT MAT 15 88% 0.4% 7
2 ATOTECH 4 75% 0.2% 3
3 ADV ELECT ASSEMBLY 3 100% 0.2% 3
4 CICBSAS 2 67% 0.1% 2
5 MACHINERY CO 2 67% 0.1% 2
6 SMART E PLATING REG INNOVAT SYST 2 67% 0.1% 2
7 ADV INTERCONNECT SCI TECHNOL 1 50% 0.1% 2
8 BURLINGTON PLANT 1 100% 0.1% 2
9 DEEP SUBMICRON INTEGRATED CIRCUIT TECHNOL 1 100% 0.1% 2
10 EQUIPE SRS 1 50% 0.1% 2

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000142406 ELECTRODEPOSITION OF NICKEL//2 FILM THEORY//AXIAL DISPERSION MODELS
2 0.0000142108 AFDELING COORDINATIECHEM//ALKALINE NON CYANIDE//INDUSTRIAL ELECTRO REFINING ELECTROLYTES
3 0.0000137893 PL ELE OCHEM GRP//EDUCTORS//ELECTROPLATING TANK
4 0.0000127037 ELECTROLESS COPPER PLATING//ELECTROLESS COPPER DEPOSITION//ELECTROLESS DEPOSITION
5 0.0000123255 THROUGH SILICON VIA TSV//3 D INTEGRATION//KEEP OUT ZONE KOZ
6 0.0000118262 UDIL//BRINDISI FUEL CELL DURABIL//LEVELLERS
7 0.0000106928 TIN ELECTRODEPOSITION//CONNECTING RELIABILITY//POLYETHER LAPROL
8 0.0000099780 COPPER POWDER FLOWABILITY//ELECTROLYTIC COPPER POWDER//REVERSING CURRENT
9 0.0000072230 DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE
10 0.0000071221 SUPERCRITICAL CARBON DIOXIDE EMULSION//CO2 SUPERCRITICAL FLUID//ADDITIVE FREE WATTS BATH