Class information for:
Level 1: DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
3747 1840 20.8 68%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
1792 5778 DIFFUSION BARRIER//ELECTROMIGRATION//CU METALLIZATION

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 DIFFUSION BARRIER Author keyword 73 30% 11% 205
2 CU METALLIZATION Author keyword 65 63% 4% 66
3 TANTALUM NITRIDE Author keyword 38 46% 3% 63
4 TA SI N Author keyword 27 78% 1% 18
5 CU DIFFUSION BARRIER Author keyword 21 75% 1% 15
6 COPPER METALLIZATION Author keyword 14 37% 2% 31
7 TAN CU Author keyword 14 100% 0% 7
8 DIFFUSION BARRIERS Author keyword 13 26% 2% 41
9 ADV PROC C ACITOR Address 11 67% 1% 10
10 CUMG ALLOY Author keyword 11 100% 0% 6

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 DIFFUSION BARRIER 73 30% 11% 205 Search DIFFUSION+BARRIER Search DIFFUSION+BARRIER
2 CU METALLIZATION 65 63% 4% 66 Search CU+METALLIZATION Search CU+METALLIZATION
3 TANTALUM NITRIDE 38 46% 3% 63 Search TANTALUM+NITRIDE Search TANTALUM+NITRIDE
4 TA SI N 27 78% 1% 18 Search TA+SI+N Search TA+SI+N
5 CU DIFFUSION BARRIER 21 75% 1% 15 Search CU+DIFFUSION+BARRIER Search CU+DIFFUSION+BARRIER
6 COPPER METALLIZATION 14 37% 2% 31 Search COPPER+METALLIZATION Search COPPER+METALLIZATION
7 TAN CU 14 100% 0% 7 Search TAN+CU Search TAN+CU
8 DIFFUSION BARRIERS 13 26% 2% 41 Search DIFFUSION+BARRIERS Search DIFFUSION+BARRIERS
9 CUMG ALLOY 11 100% 0% 6 Search CUMG+ALLOY Search CUMG+ALLOY
10 CU INTERCONNECTION 9 55% 1% 12 Search CU+INTERCONNECTION Search CU+INTERCONNECTION

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 DIFFUSION BARRIER 82 29% 13% 236
2 TAN 70 56% 5% 85
3 CU METALLIZATION 64 51% 5% 89
4 COPPER SILICIDES 52 82% 2% 31
5 COPPER METALLIZATION 48 39% 5% 95
6 METALLIZATIONS 34 39% 4% 69
7 TANTALUM RUTHENIUM DIOXIDE 26 100% 1% 11
8 DIFFUSION BARRIERS 24 21% 6% 104
9 TA N 24 68% 1% 21
10 DIFFUSION BARRIER PROPERTIES 22 41% 2% 41

Journals

Reviews


Title Publ. year Cit. Active
references		 % act. ref.
to same field
Ultrathin diffusion barriers/liners for gigascale copper metallization 2000 242 52 60%
On the use of alloying elements for Cu interconnect applications 2006 55 28 43%
COPPER METALLIZATION FOR ULSI AND BEYOND 1995 177 65 45%
How tantalum proceeds phase change on tantalum nitride underlayer with sequential Ar plasma treatment 2013 1 15 80%
Multilevel interconnections for ULSI and GSI era 1997 282 61 18%
Impact of the unique physical properties of copper in silicon on characterization of copper diffusion barriers 2000 11 79 66%
Materials aspects of copper interconnection technology for semiconductor applications 2001 20 19 32%
Alteration for a diffusion barrier design concept in future high-density dynamic and ferroelectric random access memory devices 2003 12 51 43%
Encapsulated silver for integrated circuit metallization 2003 20 33 30%
COPPER DEPOSITION AND THERMAL-STABILITY ISSUES IN COPPER-BASED METALLIZATION FOR ULSI TECHNOLOGY 1992 80 67 40%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 ADV PROC C ACITOR 11 67% 0.5% 10
2 NEW YORK STATE ADV THIN FILM TECHNOL 5 50% 0.4% 7
3 MET DEPOSIT PROD GRP 4 75% 0.2% 3
4 NSF LOW POWER ELECT 4 56% 0.3% 5
5 SEMICOND MICROSYST TECHN IHM 3 100% 0.2% 3
6 INTEGRATED ELECT ELECT MFG ELECT MEDIA 3 45% 0.3% 5
7 SEMICOND MICROSYST TECHNOL 3 17% 0.9% 16
8 ACT MATRIX LIQUID CRYSTAL DISPLAY 3 50% 0.2% 4
9 DEEP SUBMICRON INTEGRATED CIRCUIT 2 67% 0.1% 2
10 UNIV CORP RELAT 2 50% 0.2% 3

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000186539 TUNGSTEN NITRIDE//WNX//GRP MAT ENGN SUPERFICIES
2 0.0000166856 W TI THIN FILMS//WTI THIN FILMS//SURFACE LASER TREATMENT
3 0.0000157176 PERFLUORINATED CARBOXYLATES//COPPER CVD//IR AND NMR
4 0.0000112042 TINX FILMS//MAT CHEM COATINGS//TDEAT
5 0.0000091048 RUO2//RUOD3//RU
6 0.0000082553 RESISTIVE FILMS//RELATIVE RESISTANCE CHANGE//MINIST HIGH TEMP MAT TESTS
7 0.0000075378 ELECTROMIGRATION//STRESS INDUCED MIGRATION//PRC MER
8 0.0000072230 SELF ANNEALING//COPPER ELECTRODEPOSITION//COPPER ELECTROPLATING
9 0.0000071525 DELTA MON//MOLYBDENUM NITRIDE//MOLYBDENUM NITRIDE COATINGS
10 0.0000069682 LOW K//SIOC H FILMS//PLASMA PROC TECHNOL