Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
34760 | 63 | 16.5 | 40% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
688 | 12395 | LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | HEAT TRANSFER INSTABILITY | Author keyword | 1 | 50% | 2% | 1 |
2 | INDIUM JOINT | Author keyword | 1 | 50% | 2% | 1 |
3 | INFRARED IR EMISSIONS | Author keyword | 1 | 50% | 2% | 1 |
4 | MEPHL MOSCOW ENGN PHYS | Address | 1 | 50% | 2% | 1 |
5 | MESH PLANES | Author keyword | 1 | 50% | 2% | 1 |
6 | NI W TAPES | Author keyword | 1 | 50% | 2% | 1 |
7 | SILICON DIES | Author keyword | 1 | 50% | 2% | 1 |
8 | ASSEMBLY TEST MAT OPERAT | Address | 0 | 25% | 2% | 1 |
9 | BOILING REGIME | Author keyword | 0 | 25% | 2% | 1 |
10 | IRFPAS | Author keyword | 0 | 25% | 2% | 1 |
Web of Science journal categories |
Author Key Words |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | HEAT TRANSFER INSTABILITY | 1 | 50% | 2% | 1 | Search HEAT+TRANSFER+INSTABILITY | Search HEAT+TRANSFER+INSTABILITY |
2 | INDIUM JOINT | 1 | 50% | 2% | 1 | Search INDIUM+JOINT | Search INDIUM+JOINT |
3 | INFRARED IR EMISSIONS | 1 | 50% | 2% | 1 | Search INFRARED+IR+EMISSIONS | Search INFRARED+IR+EMISSIONS |
4 | MESH PLANES | 1 | 50% | 2% | 1 | Search MESH+PLANES | Search MESH+PLANES |
5 | NI W TAPES | 1 | 50% | 2% | 1 | Search NI+W+TAPES | Search NI+W+TAPES |
6 | SILICON DIES | 1 | 50% | 2% | 1 | Search SILICON+DIES | Search SILICON+DIES |
7 | BOILING REGIME | 0 | 25% | 2% | 1 | Search BOILING+REGIME | Search BOILING+REGIME |
8 | IRFPAS | 0 | 25% | 2% | 1 | Search IRFPAS | Search IRFPAS |
9 | STRUCTURAL STRESS ANALYSIS | 0 | 25% | 2% | 1 | Search STRUCTURAL+STRESS+ANALYSIS | Search STRUCTURAL+STRESS+ANALYSIS |
10 | THERMAL DIODES | 0 | 25% | 2% | 1 | Search THERMAL+DIODES | Search THERMAL+DIODES |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | CERAMIC PACKAGES | 1 | 50% | 2% | 1 |
2 | POROUS METALLIC COATINGS | 1 | 50% | 2% | 1 |
3 | CLEAVAGE CRACKS | 0 | 33% | 2% | 1 |
4 | FLIP CHIPS | 0 | 20% | 2% | 1 |
5 | AU SN | 0 | 14% | 2% | 1 |
6 | CRYOGENIC LIQUID | 0 | 100% | 2% | 1 |
Journals |
Reviews |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | MEPHL MOSCOW ENGN PHYS | 1 | 50% | 1.6% | 1 |
2 | ASSEMBLY TEST MAT OPERAT | 0 | 25% | 1.6% | 1 |
3 | AFRL RYMT | 0 | 20% | 1.6% | 1 |
4 | LUOYANG ELE OOPT EQUIPMENT | 0 | 17% | 1.6% | 1 |
5 | UNIT 63880 | 0 | 17% | 1.6% | 1 |
6 | LEHRSTUHL FESTKORPERMECH | 0 | 14% | 1.6% | 1 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000240566 | FLUXLESS BONDING//AU SN SOLDER//MAT MFG TECHNOL PROGRAM |
2 | 0.0000166641 | CRYOGENIC CMOS//LOW TEMPERATURE ELECTRONICS//LOW TEMPERATURE CIRCUIT |
3 | 0.0000164171 | BW TECHNOL//MGO FILM//KANAGAWA IND TECHNOL |
4 | 0.0000156532 | A AXIS ORIENTED YBCO FILM//ARGON BEAM SPUTTERING//ELECTRODE RESISTIVITY |
5 | 0.0000154585 | BLOWN BOUNDARY LAYER//FAST EXOTHERMIC REACTIONS//GRP RENEWABLE ENERGY |
6 | 0.0000151172 | CEAIRFUS//LESIAOBSERV PARIS MEUDON//NRC HERZBERG ASTRON ASTROPHYS |
7 | 0.0000138235 | JOULE THOMSON COOLERS//SPACE CRYOGENICS//SORPTION COOLERS |
8 | 0.0000131425 | BENZOCYCLOBUTENE//MICROWAVE MICROSYST//NON PLANAR DEVICES |
9 | 0.0000125520 | THERMAL ENGN TECHNOL//J AN MARINE SCI TECHNOL//INP WAFERS |
10 | 0.0000091428 | RSFQ//SINGLE FLUX QUANTUM//SFQ |