Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 34687 | 65 | 13.8 | 29% |
Classes in level above (level 2) |
| ID, lev. above |
Publications | Label for level above |
|---|---|---|
| 688 | 12395 | LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | PLATED THROUGH HOLE | Author keyword | 2 | 33% | 6% | 4 |
| 2 | ENDICOTT ELECT PACKAGING | Address | 1 | 100% | 3% | 2 |
| 3 | THREE DIMENSIONAL 3 D CHIP STACKING | Author keyword | 1 | 50% | 3% | 2 |
| 4 | BOND PULL STRENGTH | Author keyword | 1 | 50% | 2% | 1 |
| 5 | FIELD LIFE | Author keyword | 1 | 50% | 2% | 1 |
| 6 | INTERCONNECT STRESS TEST | Author keyword | 1 | 50% | 2% | 1 |
| 7 | RIGID FLEX PRINTED CIRCUIT | Author keyword | 1 | 50% | 2% | 1 |
| 8 | SEMICOND PROD SECTORS | Address | 1 | 50% | 2% | 1 |
| 9 | OCCAM PROCESS | Author keyword | 0 | 33% | 2% | 1 |
| 10 | VERTICAL INTERCONNECTIONS | Author keyword | 0 | 33% | 2% | 1 |
Web of Science journal categories |
Author Key Words |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | PLATED THROUGH HOLE | 2 | 33% | 6% | 4 | Search PLATED+THROUGH+HOLE | Search PLATED+THROUGH+HOLE |
| 2 | THREE DIMENSIONAL 3 D CHIP STACKING | 1 | 50% | 3% | 2 | Search THREE+DIMENSIONAL+3+D+CHIP+STACKING | Search THREE+DIMENSIONAL+3+D+CHIP+STACKING |
| 3 | BOND PULL STRENGTH | 1 | 50% | 2% | 1 | Search BOND+PULL+STRENGTH | Search BOND+PULL+STRENGTH |
| 4 | FIELD LIFE | 1 | 50% | 2% | 1 | Search FIELD+LIFE | Search FIELD+LIFE |
| 5 | INTERCONNECT STRESS TEST | 1 | 50% | 2% | 1 | Search INTERCONNECT+STRESS+TEST | Search INTERCONNECT+STRESS+TEST |
| 6 | RIGID FLEX PRINTED CIRCUIT | 1 | 50% | 2% | 1 | Search RIGID+FLEX+PRINTED+CIRCUIT | Search RIGID+FLEX+PRINTED+CIRCUIT |
| 7 | OCCAM PROCESS | 0 | 33% | 2% | 1 | Search OCCAM+PROCESS | Search OCCAM+PROCESS |
| 8 | VERTICAL INTERCONNECTIONS | 0 | 33% | 2% | 1 | Search VERTICAL+INTERCONNECTIONS | Search VERTICAL+INTERCONNECTIONS |
| 9 | THERMO MECHANICAL TESTING | 0 | 15% | 3% | 2 | Search THERMO+MECHANICAL+TESTING | Search THERMO+MECHANICAL+TESTING |
| 10 | CUT DEPTH | 0 | 25% | 2% | 1 | Search CUT+DEPTH | Search CUT+DEPTH |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | PLATED THROUGH HOLES | 1 | 40% | 3% | 2 |
| 2 | MULTILAYER INTERCONNECTION BOARDS | 1 | 50% | 2% | 1 |
| 3 | LONG TERM RELIABILITY | 0 | 33% | 2% | 1 |
| 4 | LINE STRUCTURES | 0 | 25% | 2% | 1 |
| 5 | ELECTROCHEMICAL REACTORS | 0 | 13% | 3% | 2 |
| 6 | GRID ARRAY ASSEMBLIES | 0 | 20% | 2% | 1 |
| 7 | BATTERY MODELS | 0 | 100% | 2% | 1 |
| 8 | POLYMER LINE STRUCTURES | 0 | 100% | 2% | 1 |
| 9 | PTH RELIABILITY | 0 | 100% | 2% | 1 |
Journals |
Reviews |
| Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
|---|---|---|---|---|
| HIGH-RESOLUTION OPTICAL INTERFERENCE MEASUREMENTS OF CHANGES IN BOND-LINE THICKNESS - A REVIEW | 1990 | 0 | 4 | 100% |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | ENDICOTT ELECT PACKAGING | 1 | 100% | 3.1% | 2 |
| 2 | SEMICOND PROD SECTORS | 1 | 50% | 1.5% | 1 |
| 3 | MAT SCI CHEM CHEM ENGNMINIST EDUC | 0 | 25% | 1.5% | 1 |
| 4 | ADV INTERCONNECT SYST S | 0 | 20% | 1.5% | 1 |
| 5 | DEVICE PACKAGING | 0 | 20% | 1.5% | 1 |
| 6 | THERMAL ANAL MAT PROC | 0 | 10% | 1.5% | 1 |
| 7 | FAILURE ANAL PHYS | 0 | 100% | 1.5% | 1 |
| 8 | HSDDL | 0 | 100% | 1.5% | 1 |
| 9 | RENEWABLE POWER BUSINESS UNIT | 0 | 100% | 1.5% | 1 |
Related classes at same level (level 1) |
| Rank | Relatedness score | Related classes |
|---|---|---|
| 1 | 0.0000170372 | THECLA//ACTS OF PAUL//HANMUN |
| 2 | 0.0000159683 | JOURNAL OF ELECTRONIC PACKAGING//SOLDERING & SURFACE MOUNT TECHNOLOGY//SOLDER JOINT |
| 3 | 0.0000154730 | THE REFINED THEORY//DECOMPOSED THEOREM//THE LURE METHOD |
| 4 | 0.0000143599 | INNER LEAD BONDING ILB//INNER LEAD BONDING//LASER SOLDERING |
| 5 | 0.0000123102 | THERMAL ENGN TECHNOL//J AN MARINE SCI TECHNOL//INP WAFERS |
| 6 | 0.0000110016 | IN CIRCUIT MEASUREMENT//COMPUTER AIDED DESIGN CAD TECHNIQUES//HIGH POWER RF TRANSISTORS |
| 7 | 0.0000090921 | BENZOCYCLOBUTENE//MICROWAVE MICROSYST//NON PLANAR DEVICES |
| 8 | 0.0000084248 | BLISTER TEST//SHAFT LOADED BLISTER TEST//FIXED ARM PEEL |
| 9 | 0.0000080153 | FLEXIBLE COPPER CLAD LAMINATE//FLEXIBLE COPPER CLAD LAMINATE FCCL//SILANE MODIFIED POLYVINYLIMIDAZOLE |
| 10 | 0.0000079507 | SPECKLE PHOTOGRAPHY//OPTIMO//YOUNG FRINGES |