Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
34596 | 67 | 18.1 | 19% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
3544 | 966 | ELECTROCHEMICAL MIGRATION//SECT PROD PROC QUAL//MECHANICAL RELIABILITY PREDICTION |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | BAYESIAN SEQUENTIAL TEST | Author keyword | 1 | 50% | 1% | 1 |
2 | INGENIOUS MICROMFG SYST GRP | Address | 1 | 50% | 1% | 1 |
3 | PROJECTION PURSUIT TYPE STATISTIC | Author keyword | 1 | 50% | 1% | 1 |
4 | DECAPSULATION | Author keyword | 1 | 22% | 3% | 2 |
5 | ASYMPTOTIC CHI SQUARE DISTRIBUTION | Author keyword | 0 | 33% | 1% | 1 |
6 | ELECT MECH SUPPORT DEMO | Address | 0 | 33% | 1% | 1 |
7 | EXPECTED STOPPING TIME | Author keyword | 0 | 33% | 1% | 1 |
8 | COPPER BALL BONDING | Author keyword | 0 | 25% | 1% | 1 |
9 | UPPER CONTROL LIMIT | Author keyword | 0 | 20% | 1% | 1 |
10 | COMPLEX MACHINING | Author keyword | 0 | 17% | 1% | 1 |
Web of Science journal categories |
Author Key Words |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | F DISTRIBUTION | 0 | 14% | 1% | 1 |
2 | EVALUATION TECHNIQUE ASSET | 0 | 100% | 1% | 1 |
3 | MIL HDBK 781 | 0 | 100% | 1% | 1 |
4 | MIL STD 781D | 0 | 100% | 1% | 1 |
Journals |
Reviews |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | INGENIOUS MICROMFG SYST GRP | 1 | 50% | 1.5% | 1 |
2 | ELECT MECH SUPPORT DEMO | 0 | 33% | 1.5% | 1 |
3 | QUAL RELIABIL ASSURANCE | 0 | 14% | 1.5% | 1 |
4 | MA COM | 0 | 11% | 1.5% | 1 |
5 | ELECT DEVICES CO | 0 | 10% | 1.5% | 1 |
6 | SUPPLIER QUAL ASSURANCE AE SQA1 | 0 | 100% | 1.5% | 1 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000167466 | COMMERCIAL RELIABILITY PROGRAM//ELECTRONIC COMPONENT RELIABILITY//INTERNET CALIBRATION |
2 | 0.0000103973 | ELECTROCHEMICAL MIGRATION//MECHANICAL RELIABILITY PREDICTION//CONDUCTIVE ANODIC FILAMENT |
3 | 0.0000099251 | POWER LAW PROCESS//RELIABILITY GROWTH//STAT RELIABIL |
4 | 0.0000080199 | WIRE BONDING//ULTRASONIC WEDGE BONDING//MICROJOINING |
5 | 0.0000076059 | GENERALIZED NEAR INTEGER GAMMA DISTRIBUTION//GENERALIZED INTEGER GAMMA DISTRIBUTION//WEAKLY STABLE DISTRIBUTION |
6 | 0.0000067508 | MULTIDIMENSIONAL INVARIANCE PRINCIPLE//CADLAG PROCESSES//L P ESTIMATORS |
7 | 0.0000067199 | SOFTWARE REJUVENATION//SOFTWARE AGING//OPTIMAL SOFTWARE REJUVENATION |
8 | 0.0000066895 | BEAM SPILL//HYDROGEN ION BEAM//POLYLACTATURETHANE |
9 | 0.0000060272 | CLOSED ENVIRONMENT//HEALTH SCORECARD//MULTI STATE FAILURE |
10 | 0.0000057904 | TIN ELECTRODEPOSITION//CONNECTING RELIABILITY//POLYETHER LAPROL |