Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 33007 | 99 | 12.2 | 72% |
Classes in level above (level 2) |
| ID, lev. above |
Publications | Label for level above |
|---|---|---|
| 512 | 14399 | PLASMA SOURCES SCIENCE & TECHNOLOGY//PLASMA DISPLAY PANEL PDP//PLASMA DISPLAY PANEL |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | MAGNETIC NEUTRAL LINE | Author keyword | 4 | 75% | 3% | 3 |
| 2 | NEUTRAL LOOP DISCHARGE | Author keyword | 4 | 56% | 5% | 5 |
| 3 | TCO LESS DSCS | Author keyword | 2 | 67% | 2% | 2 |
| 4 | NLD | Author keyword | 2 | 33% | 5% | 5 |
| 5 | TITANIUM DOPED INDIUM OXIDE | Author keyword | 1 | 38% | 3% | 3 |
| 6 | ELECTRON MEANDERING MOTION | Author keyword | 1 | 100% | 2% | 2 |
| 7 | MAGNETIC NEUTRAL LOOP DISCHARGE | Author keyword | 1 | 100% | 2% | 2 |
| 8 | MAGNETIC NULL DISCHARGE SPUTTERING | Author keyword | 1 | 100% | 2% | 2 |
| 9 | MAGNETIC NULL FIELD | Author keyword | 1 | 100% | 2% | 2 |
| 10 | NEUTRAL LOOP DISCHARGE PLASMA | Author keyword | 1 | 100% | 2% | 2 |
Web of Science journal categories |
Author Key Words |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | LOOP DISCHARGE PLASMA | 4 | 44% | 7% | 7 |
| 2 | NEUTRAL LOOP DISCHARGE | 2 | 43% | 3% | 3 |
| 3 | PLASMA PRODUCTION | 1 | 10% | 5% | 5 |
| 4 | HYDROGEN RF DISCHARGE | 0 | 33% | 1% | 1 |
| 5 | ELECTRON MOTION | 0 | 17% | 2% | 2 |
| 6 | SOL GEL COMBUSTION | 0 | 17% | 1% | 1 |
| 7 | NANOPOROUS FSNO2 FILMS | 0 | 100% | 1% | 1 |
| 8 | SIO2 ETCHING PROCESS | 0 | 100% | 1% | 1 |
| 9 | XE HE | 0 | 100% | 1% | 1 |
| 10 | XE NE | 0 | 100% | 1% | 1 |
Journals |
Reviews |
| Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
|---|---|---|---|---|
| Magnetic neutral loop discharge (NLD) plasmas for surface processing | 2008 | 17 | 26 | 73% |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | CPST | 1 | 23% | 3.0% | 3 |
| 2 | MASTERS COURSE | 0 | 25% | 1.0% | 1 |
| 3 | OPT TELECOMMUN COMPONENTS | 0 | 20% | 1.0% | 1 |
| 4 | NANO BIOPHOTON TEAM | 0 | 13% | 1.0% | 1 |
| 5 | SEMICOND ELECT TECHNOL | 0 | 13% | 1.0% | 1 |
| 6 | ELECT SYST COMP ENGN | 0 | 11% | 1.0% | 1 |
| 7 | SANGBUK MYUN | 0 | 100% | 1.0% | 1 |
| 8 | SEMICOND TECHOL | 0 | 100% | 1.0% | 1 |
Related classes at same level (level 1) |
| Rank | Relatedness score | Related classes |
|---|---|---|
| 1 | 0.0000163844 | LOW INDUCTANCE ANTENNA//LOW DAMAGE PROCESS//INDUCTIVELY COUPLED PLASMA |
| 2 | 0.0000146093 | SPACE PLASMA POWER PROP GRP//SPACE PLASMA POWER PROP//HELICON WAVE |
| 3 | 0.0000104583 | ELECT DEVICES MAT TECHNOL//SIO2 ETCHING//PLASMA ETCHING |
| 4 | 0.0000081863 | NON STANDARD LIGHTNING IMPULSE WAVEFORM//DIELECTRIC BREAKDOWN VOLTAGE TIME CHARACTERISTICS V T CHARACTERISTICS//CO2 GAS GAP |
| 5 | 0.0000076612 | WET ETCHING OF GLASS//DEEP GLASS ETCHING//TECH SUPPORT MACHINERY MET IND |
| 6 | 0.0000068972 | INDIUM TIN OXIDE//ITO//INDIUM TIN OXIDE ITO |
| 7 | 0.0000067747 | SPRAY ETCHING//ETCH FACTOR//ETCHING FACTOR |
| 8 | 0.0000065682 | COUNTER ELECTRODE//COUNTER ELECTRODES//DYE SENSITIZED SOLAR CELL |
| 9 | 0.0000056810 | ELECTROLYTIC COPPER ADDITION//BCL3 PLASMA//FIS CHIM SUPERFICI INTER E |
| 10 | 0.0000053731 | PARTICLE PHYS PARTICLE IRRADIAT MOE//PARTICLE PHYS PARTICLE IRRADIAT//PARTICLE PARTICLE IRRADIAT MOE |