Class information for:
Level 1: ELECTROMIGRATION//STRESS INDUCED MIGRATION//PRC MER

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
2875 2050 21.2 50%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
1792 5778 DIFFUSION BARRIER//ELECTROMIGRATION//CU METALLIZATION

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 ELECTROMIGRATION Author keyword 91 24% 16% 327
2 STRESS INDUCED MIGRATION Author keyword 21 85% 1% 11
3 PRC MER Address 13 71% 0% 10
4 ELECTROMIGRATION EM Author keyword 11 43% 1% 20
5 HILLOCK Author keyword 7 29% 1% 19
6 CUSIN Author keyword 6 80% 0% 4
7 EE PHYS ELECT Address 6 80% 0% 4
8 ELECTROMIGRATION FAILURE Author keyword 6 80% 0% 4
9 SUR E EVALUAT Address 6 100% 0% 4
10 STRESS VOIDING Author keyword 5 55% 0% 6

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 ELECTROMIGRATION 91 24% 16% 327 Search ELECTROMIGRATION Search ELECTROMIGRATION
2 STRESS INDUCED MIGRATION 21 85% 1% 11 Search STRESS+INDUCED+MIGRATION Search STRESS+INDUCED+MIGRATION
3 ELECTROMIGRATION EM 11 43% 1% 20 Search ELECTROMIGRATION+EM Search ELECTROMIGRATION+EM
4 HILLOCK 7 29% 1% 19 Search HILLOCK Search HILLOCK
5 CUSIN 6 80% 0% 4 Search CUSIN Search CUSIN
6 ELECTROMIGRATION FAILURE 6 80% 0% 4 Search ELECTROMIGRATION+FAILURE Search ELECTROMIGRATION+FAILURE
7 STRESS VOIDING 5 55% 0% 6 Search STRESS+VOIDING Search STRESS+VOIDING
8 THIN FILM TRANSISTOR LIQUID CRYSTAL DISPLAYS 4 67% 0% 4 Search THIN+FILM+TRANSISTOR+LIQUID+CRYSTAL+DISPLAYS Search THIN+FILM+TRANSISTOR+LIQUID+CRYSTAL+DISPLAYS
9 SELF ALIGNED BARRIER 4 56% 0% 5 Search SELF+ALIGNED+BARRIER Search SELF+ALIGNED+BARRIER
10 AL 111 TEXTURE 3 100% 0% 3 Search AL+111+TEXTURE Search AL+111+TEXTURE

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 ELECTROMIGRATION 52 17% 14% 285
2 ALUMINUM BASED METALLIZATIONS 44 100% 1% 16
3 CONFINED METAL LINES 36 65% 2% 34
4 ALUMINUM FILMS 33 31% 4% 90
5 FILM CONDUCTORS 31 92% 1% 12
6 BAMBOO LINES 29 72% 1% 23
7 STRESS EVOLUTION 27 37% 3% 58
8 CONDUCTOR LINES 24 91% 0% 10
9 NEAR BAMBOO 24 91% 0% 10
10 THIN FILM CONDUCTORS 23 69% 1% 20

Journals

Reviews


Title Publ. year Cit. Active references % act. ref.
to same field
Electromigration of Cu/low dielectric constant interconnects 2006 71 33 76%
Electromigration reliability issues in dual-damascene Cu interconnections 2002 120 97 73%
Copper metallization for high performance silicon technology 2000 241 15 33%
Electromigration in submicron interconnect features of integrated circuits 2011 9 68 75%
Electromigration: A review 1997 111 42 86%
Electromigration in integrated circuit conductors 1999 83 14 79%
Electromigration in thin film conductors 1997 65 11 100%
Surface morphological response of crystalline solids to mechanical stresses and electric fields 2011 6 141 50%
ELECTROMIGRATION IN METALS 1989 373 18 44%
Interface reliability assessments. for Copper/Low-k products 2004 28 27 63%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 PRC MER 13 71% 0.5% 10
2 EE PHYS ELECT 6 80% 0.2% 4
3 SUR E EVALUAT 6 100% 0.2% 4
4 INTERCONNECT PACKAGING 4 29% 0.6% 13
5 MINIST EDUC BAND G SEMICOND MAT DEVICES 4 67% 0.2% 4
6 INTERCONNECT PACKAGING GRP 3 60% 0.1% 3
7 ADV DEVICE DEV 2 24% 0.4% 8
8 ADV PROC DEV PROJECT TEAM 2 67% 0.1% 2
9 ARRAY PROC TECHNOL GRP 2 67% 0.1% 2
10 TEST ANAL TECHNOL DEV 2 67% 0.1% 2

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000122868 LASER POLISHING//SELF ION ASSISTED DEPOSITION//QUASISTATIC PROBLEM OF THERMOELASTICITY
2 0.0000101166 W TI THIN FILMS//WTI THIN FILMS//SURFACE LASER TREATMENT
3 0.0000093673 AL PT//AMORPHOUS AL2PT//SELF ORGANISED STRUCTURE FORMATION
4 0.0000085781 INTERFACIAL SHEARS//NON LOCAL STRESS CURVATURE RELATIONS//NON UNIFORM MISFIT STRAIN
5 0.0000080786 STRIP BENDING TEST//MEMS PROD//HIGH CYCLE FATIGUE TEST
6 0.0000075811 DIRECT FORCE//WISSEN BEREICH THEORET PHYS//SCI PHYS ASTRON
7 0.0000075378 DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE
8 0.0000071577 MATH DESIGN MAT//SOLID STATE DEWETTING//SURFACE ENERGY ANISOTROPY
9 0.0000070979 ADSORBED LAYER INSTABILITY//ASARO TILLER GRINFELD INSTABILITY//STRETCHABLE SUBSTRATE
10 0.0000066595 SELF ANNEALING//COPPER ELECTRODEPOSITION//COPPER ELECTROPLATING