Class information for:
Level 1: INTERFACIAL SHEARS//NON LOCAL STRESS CURVATURE RELATIONS//NON UNIFORM MISFIT STRAIN

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
27909 179 18.7 53%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
2847 2446 INTERFACIAL SHEARS//MICROBENDING LOSS//RAPID THERMAL PROCESSING RTP

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ.
in class
1 INTERFACIAL SHEARS Author keyword 20 100% 5% 9
2 NON LOCAL STRESS CURVATURE RELATIONS Author keyword 8 100% 3% 5
3 NON UNIFORM MISFIT STRAIN Author keyword 8 100% 3% 5
4 SURFSCAN ADE Address 6 80% 2% 4
5 STRESS CURVATURE RELATIONS Author keyword 6 100% 2% 4
6 WAFER GEOMETRY Author keyword 2 40% 2% 4
7 NON UNIFORM FILM THICKNESS Author keyword 1 100% 1% 2
8 NON UNIFORM WAFER CURVATURES Author keyword 1 100% 1% 2
9 NONLOCAL STRESS CURVATURE RELATIONS Author keyword 1 100% 1% 2
10 NONUNIFORM FILM TEMPERATURES AND STRESSES Author keyword 1 100% 1% 2

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ.
in class		 LCSH search Wikipedia search
1 INTERFACIAL SHEARS 20 100% 5% 9 Search INTERFACIAL+SHEARS Search INTERFACIAL+SHEARS
2 NON LOCAL STRESS CURVATURE RELATIONS 8 100% 3% 5 Search NON+LOCAL+STRESS+CURVATURE+RELATIONS Search NON+LOCAL+STRESS+CURVATURE+RELATIONS
3 NON UNIFORM MISFIT STRAIN 8 100% 3% 5 Search NON+UNIFORM+MISFIT+STRAIN Search NON+UNIFORM+MISFIT+STRAIN
4 STRESS CURVATURE RELATIONS 6 100% 2% 4 Search STRESS+CURVATURE+RELATIONS Search STRESS+CURVATURE+RELATIONS
5 WAFER GEOMETRY 2 40% 2% 4 Search WAFER+GEOMETRY Search WAFER+GEOMETRY
6 NON UNIFORM FILM THICKNESS 1 100% 1% 2 Search NON+UNIFORM+FILM+THICKNESS Search NON+UNIFORM+FILM+THICKNESS
7 NON UNIFORM WAFER CURVATURES 1 100% 1% 2 Search NON+UNIFORM+WAFER+CURVATURES Search NON+UNIFORM+WAFER+CURVATURES
8 NONLOCAL STRESS CURVATURE RELATIONS 1 100% 1% 2 Search NONLOCAL+STRESS+CURVATURE+RELATIONS Search NONLOCAL+STRESS+CURVATURE+RELATIONS
9 NONUNIFORM FILM TEMPERATURES AND STRESSES 1 100% 1% 2 Search NONUNIFORM+FILM+TEMPERATURES+AND+STRESSES Search NONUNIFORM+FILM+TEMPERATURES+AND+STRESSES
10 NONUNIFORM MISFIT STRAIN 1 100% 1% 2 Search NONUNIFORM+MISFIT+STRAIN Search NONUNIFORM+MISFIT+STRAIN

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 MISFIT STRAIN DISTRIBUTIONS 11 69% 5% 9
2 FILM SUBSTRATE SYSTEMS 10 44% 9% 17
3 SUBSTRATE SYSTEMS 4 34% 6% 10
4 STONEY FORMULA 2 33% 3% 6
5 STRESS DEFLECTION RELATIONS 2 50% 2% 3
6 CGS 2 43% 2% 3
7 MISFIT STRAIN 2 24% 3% 6
8 THIN FILM SUBSTRATE SYSTEMS 1 31% 2% 4
9 DEFLECTION RELATIONS 1 100% 1% 2
10 HOLOGRAPHIC MOIRE TECHNIQUE 1 100% 1% 2

Journals

Reviews


Title Publ. year Cit. Active
references		 % act. ref.
to same field
Observations of displacement fields in particulate composites 2003 0 1 100%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ.
in class
1 SURFSCAN ADE 6 80% 2.2% 4
2 EQUIPMENT INNOVAT TEAM 1 50% 0.6% 1
3 MIRCROENGN IMT 1 50% 0.6% 1
4 UTSUNOMIYA OPT PROD OPERAT 1 50% 0.6% 1
5 WAFER INSPECT GRP 0 33% 0.6% 1
6 INTEL COMMUN GRP 0 25% 0.6% 1
7 SEMICOND R D 0 25% 0.6% 1
8 HIGH IMPACT 0 14% 0.6% 1
9 FASTUMR 7608 0 10% 0.6% 1
10 HIGH ENERGY DENS PHYS SIMULAT HEDPS 0 10% 0.6% 1

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000206911 PIN CHUCK//VACUUM PIN CHUCK//WAFER FLATNESS
2 0.0000191420 MICROBENDING LOSS//OPTICAL FIBER MECHANICAL FACTORS//AEM GRP
3 0.0000186320 AMERG//PHYS PROCEDES VIDE//INTRINSIC STRESS
4 0.0000104975 STRIP BENDING TEST//MEMS PROD//HIGH CYCLE FATIGUE TEST
5 0.0000093927 CLEAVAGE CRACKING//CRACK TRAPPING EFFECT//HEAT TREATMENT BY ANNEALING
6 0.0000088850 CONDUCTING MOLECULE//PHYS QUANTUM ELECT//SINGLE MOLECULE DEVICE
7 0.0000088404 DYNAMIC FRACTURE//INTERSONIC CRACK PROPAGATION//DYNAMIC CRACK PROPAGATION
8 0.0000085781 ELECTROMIGRATION//STRESS INDUCED MIGRATION//PRC MER
9 0.0000070971 MORPHING STRUCTURES//BISTABLE COMPOSITES//CURED SHAPE
10 0.0000066701 RAPID THERMAL PROCESSING RTP//RAPID THERMAL PROCESSING//CTOD FRACTURE TOUGHNESS TESTING