Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
2748 | 2082 | 19.5 | 55% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
138 | 22619 | IEEE TRANSACTIONS ON ELECTRON DEVICES//IEEE ELECTRON DEVICE LETTERS//SOLID-STATE ELECTRONICS |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | STRESS INDUCED LEAKAGE CURRENT | Author keyword | 32 | 58% | 2% | 37 |
2 | SOFT BREAKDOWN | Author keyword | 25 | 52% | 2% | 34 |
3 | DIELECTRIC BREAKDOWN BD | Author keyword | 24 | 91% | 0% | 10 |
4 | OXIDE RELIABILITY | Author keyword | 24 | 45% | 2% | 40 |
5 | OXIDE BREAKDOWN | Author keyword | 18 | 39% | 2% | 37 |
6 | DIELECTRIC BREAKDOWN | Author keyword | 15 | 15% | 5% | 94 |
7 | HARD BREAKDOWN | Author keyword | 14 | 57% | 1% | 16 |
8 | MOS DEVICES | Author keyword | 13 | 18% | 3% | 67 |
9 | ZI ROUSSET | Address | 11 | 56% | 1% | 14 |
10 | TIME DEPENDENT DIELECTRIC BREAKDOWN TDDB | Author keyword | 10 | 29% | 1% | 28 |
Web of Science journal categories |
Author Key Words |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | STRESS INDUCED LEAKAGE CURRENT | 32 | 58% | 2% | 37 | Search STRESS+INDUCED+LEAKAGE+CURRENT | Search STRESS+INDUCED+LEAKAGE+CURRENT |
2 | SOFT BREAKDOWN | 25 | 52% | 2% | 34 | Search SOFT+BREAKDOWN | Search SOFT+BREAKDOWN |
3 | DIELECTRIC BREAKDOWN BD | 24 | 91% | 0% | 10 | Search DIELECTRIC+BREAKDOWN+BD | Search DIELECTRIC+BREAKDOWN+BD |
4 | OXIDE RELIABILITY | 24 | 45% | 2% | 40 | Search OXIDE+RELIABILITY | Search OXIDE+RELIABILITY |
5 | OXIDE BREAKDOWN | 18 | 39% | 2% | 37 | Search OXIDE+BREAKDOWN | Search OXIDE+BREAKDOWN |
6 | DIELECTRIC BREAKDOWN | 15 | 15% | 5% | 94 | Search DIELECTRIC+BREAKDOWN | Search DIELECTRIC+BREAKDOWN |
7 | HARD BREAKDOWN | 14 | 57% | 1% | 16 | Search HARD+BREAKDOWN | Search HARD+BREAKDOWN |
8 | MOS DEVICES | 13 | 18% | 3% | 67 | Search MOS+DEVICES | Search MOS+DEVICES |
9 | TIME DEPENDENT DIELECTRIC BREAKDOWN TDDB | 10 | 29% | 1% | 28 | Search TIME+DEPENDENT+DIELECTRIC+BREAKDOWN+TDDB | Search TIME+DEPENDENT+DIELECTRIC+BREAKDOWN+TDDB |
10 | SILC | 7 | 25% | 1% | 23 | Search SILC | Search SILC |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | SILICON DIOXIDE FILMS | 62 | 31% | 8% | 169 |
2 | TRAP GENERATION | 55 | 44% | 5% | 95 |
3 | SOFT BREAKDOWN | 51 | 48% | 4% | 78 |
4 | INDUCED LEAKAGE CURRENT | 51 | 39% | 5% | 104 |
5 | SIO2 INDUCED SUBSTRATE CURRENT | 37 | 100% | 1% | 14 |
6 | OXIDE BREAKDOWN | 33 | 41% | 3% | 63 |
7 | HARD BREAKDOWN | 28 | 64% | 1% | 27 |
8 | THIN SIO2 FILMS | 27 | 51% | 2% | 37 |
9 | TRAP CREATION | 26 | 45% | 2% | 43 |
10 | POSITIVE CHARGE | 25 | 29% | 3% | 71 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references | % act. ref. to same field |
---|---|---|---|---|
Dielectric breakdown mechanisms in gate oxides | 2005 | 136 | 99 | 81% |
Ultra-thin dielectric breakdown in devices and circuits: A brief review | 2015 | 1 | 30 | 87% |
Electron transport through broken down ultra-thin SiO2 layers in MOS devices | 2004 | 58 | 124 | 86% |
Power-law voltage acceleration: A key element for ultra-thin gate oxide reliability | 2005 | 63 | 50 | 82% |
Reliability limits for the gate insulator in CMOS technology | 2002 | 102 | 112 | 80% |
Ultrathin gate oxide reliability: Physical models, statistics, and characterization | 2002 | 70 | 57 | 82% |
Modeling of tunneling current and gate dielectric reliability for nonvolatile memory devices | 2004 | 32 | 75 | 40% |
Dielectric reliability measurement methods: A review | 1998 | 54 | 84 | 74% |
RELIABILITY OF THIN SIO2 | 1994 | 70 | 39 | 64% |
Thin dielectric reliability assessment for DRAM technology with deep trench storage node | 2003 | 6 | 37 | 81% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | ZI ROUSSET | 11 | 56% | 0.7% | 14 |
2 | LEAA | 6 | 100% | 0.2% | 4 |
3 | AUTOMAT MICROELECT | 5 | 35% | 0.6% | 12 |
4 | ETUD MICROELECT MAT | 4 | 75% | 0.1% | 3 |
5 | L2MP POLYTECH | 4 | 75% | 0.1% | 3 |
6 | SEMICOND DEVICE RELIABIL | 4 | 75% | 0.1% | 3 |
7 | ENG ELECT | 4 | 46% | 0.3% | 6 |
8 | PHYS COMPOSANTS SEMICOND | 3 | 19% | 0.6% | 13 |
9 | ST MICROELECT | 2 | 32% | 0.3% | 6 |
10 | CORP RELIABIL METHODOL | 2 | 67% | 0.1% | 2 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000197716 | DIRECT TUNNELING//QUANTUM MECHANICAL EFFECTS QMES//WAVE FUNCTION PENETRATION |
2 | 0.0000165762 | SID4//DEUTERIUM D ANNEALING//TRAP CREATION |
3 | 0.0000148990 | BORON PENETRATION//REMOTE PLASMA NITRIDATION RPN//SI NITRIDE |
4 | 0.0000145524 | NEGATIVE BIAS TEMPERATURE INSTABILITY NBTI//NEGATIVE BIAS TEMPERATURE INSTABILITY//CHRISTIAN DOPPLER TCAD |
5 | 0.0000129188 | POLYOXIDE//INTERPOLY OXIDE//NONPLANAR POLYOXIDE |
6 | 0.0000124410 | OXIDE TRAPPED CHARGE//ELDRS//TOTAL IONIZING DOSE |
7 | 0.0000121180 | SINGLE EVENT BURNOUT SEB//SINGLE EVENT GATE RUPTURE SEGR//RREACT GRP |
8 | 0.0000119673 | HOT CARRIER//CHANNEL INITIATED SECONDARY ELECTRON CHISEL//HOT CARRIER DEGRADATION |
9 | 0.0000108447 | ATOMIC LAYER ETCHING//GATE CHARGING//NEUTRAL BEAM ETCHING |
10 | 0.0000095101 | MOS TUNNELING DIODE//ELECTRON HOLE PLASMA RECOMBINATION//LATERAL NONUNIFORMITY LNU |