Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 27361 | 190 | 12.1 | 40% |
Classes in level above (level 2) |
| ID, lev. above |
Publications | Label for level above |
|---|---|---|
| 1406 | 7566 | IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY//SIGNAL INTEGRITY//REVERBERATION CHAMBER RC |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | IN CIRCUIT MEASUREMENT | Author keyword | 2 | 67% | 1% | 2 |
| 2 | COMPUTER AIDED DESIGN CAD TECHNIQUES | Author keyword | 1 | 50% | 1% | 2 |
| 3 | HIGH POWER RF TRANSISTORS | Author keyword | 1 | 100% | 1% | 2 |
| 4 | RFIC PACKAGES | Author keyword | 1 | 100% | 1% | 2 |
| 5 | THINK SHRINK SMALL OUTLINE PACKAGES | Author keyword | 1 | 100% | 1% | 2 |
| 6 | PACKAGE INDUCTANCE | Author keyword | 1 | 40% | 1% | 2 |
| 7 | PACKAGE MODELING | Author keyword | 1 | 21% | 2% | 3 |
| 8 | BACKPLANE CONNECTORS | Author keyword | 1 | 50% | 1% | 1 |
| 9 | BOND WIRE INDUCTANCE | Author keyword | 1 | 50% | 1% | 1 |
| 10 | ELECTRICAL PACKAGING MODELING | Author keyword | 1 | 50% | 1% | 1 |
Web of Science journal categories |
Author Key Words |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | WIDE BAND CHARACTERIZATION | 1 | 100% | 1% | 2 |
| 2 | TIME DOMAIN MEASUREMENTS | 1 | 27% | 2% | 3 |
| 3 | PACKAGE INDUCTANCE | 1 | 33% | 1% | 2 |
| 4 | NUBGA | 1 | 50% | 1% | 1 |
| 5 | SMALL OUTLINE PACKAGES | 1 | 50% | 1% | 1 |
| 6 | NONLINEAR DIFFRACTION TOMOGRAPHY | 0 | 25% | 1% | 1 |
| 7 | PEEC | 0 | 20% | 1% | 1 |
| 8 | MICROSTRIP TRANSMISSION LINES | 0 | 17% | 1% | 1 |
| 9 | DECOUPLING CAPACITOR | 0 | 13% | 1% | 1 |
| 10 | RECTANGULAR CONDUCTORS | 0 | 13% | 1% | 1 |
Journals |
Reviews |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | GUIDED SYST | 1 | 50% | 0.5% | 1 |
| 2 | ONDES SYST ASSOCIES OSA | 1 | 50% | 0.5% | 1 |
| 3 | RADAR SYST BUSINESS UNIT | 1 | 50% | 0.5% | 1 |
| 4 | XLIM UNITE MIXTE RECH 6172 | 1 | 50% | 0.5% | 1 |
| 5 | AD T WIRELESS SYST | 0 | 15% | 1.1% | 2 |
| 6 | FLORIDA COMMUN | 0 | 25% | 0.5% | 1 |
| 7 | UKM BANGI | 0 | 17% | 0.5% | 1 |
| 8 | TIME DOMAIN RF MEASUREMENT | 0 | 14% | 0.5% | 1 |
| 9 | WIRELESS INFRASTRUCT SYST | 0 | 14% | 0.5% | 1 |
| 10 | DESIGN TECHNOL DEV | 0 | 13% | 0.5% | 1 |
Related classes at same level (level 1) |
| Rank | Relatedness score | Related classes |
|---|---|---|
| 1 | 0.0000176618 | SIMULTANEOUS SWITCHING NOISE//SIMULTANEOUS SWITCHING NOISE SSN//GROUND BOUNCE NOISE GBN |
| 2 | 0.0000164067 | SCATTERING PARAMETER MEASUREMENT//SCATTERING MATRIX MEASUREMENT//MICROWAVE NETWORK ANALYZER |
| 3 | 0.0000153890 | INTERCONNECT MODELING//MOMENT MATCHING TECHNIQUES//HIGH SPEED INTERCONNECTS |
| 4 | 0.0000139845 | ON CHIP ANTENNA//60 GHZ//ANTENNA IN PACKAGE AIP |
| 5 | 0.0000126248 | ADV SUBSUR E IMAGING//TRANSITION DURATION//SAMPLING OSCILLOSCOPE |
| 6 | 0.0000110016 | PLATED THROUGH HOLE//ENDICOTT ELECT PACKAGING//THREE DIMENSIONAL 3 D CHIP STACKING |
| 7 | 0.0000084741 | SURGE PROTECTION DEVICE SPD//ELECTRIC SUBMERSIBLE PUMPS ESPS//PROTECTIVE DISTANCE |
| 8 | 0.0000084532 | REAL FREQUENCY TECHNIQUES//BROADBAND MATCHING//REAL FREQUENCY TECHNIQUE |
| 9 | 0.0000078919 | INTERMODULATIONS//ACTIVE ELECTRONICALLY SCANNING ARRAY//ANNULAR MICROSTRIP ANTENNA |
| 10 | 0.0000073205 | SOMMERFELD INTEGRALS//DISCRETE COMPLEX IMAGE METHOD DCIM//SURFACE WAVE POLES |