Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
27288 | 191 | 13.4 | 41% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
2646 | 2988 | HIPIMS//HPPMS//HIGH POWER IMPULSE MAGNETRON SPUTTERING |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | LASER POLISHING | Author keyword | 5 | 27% | 8% | 15 |
2 | SELF ION ASSISTED DEPOSITION | Author keyword | 2 | 50% | 2% | 3 |
3 | QUASISTATIC PROBLEM OF THERMOELASTICITY | Author keyword | 1 | 100% | 1% | 2 |
4 | THERMAL STRENGTH CRITERION | Author keyword | 1 | 100% | 1% | 2 |
5 | VAPORIZATION OF MATERIAL | Author keyword | 1 | 100% | 1% | 2 |
6 | ADV DESIGN ANAL | Address | 1 | 40% | 1% | 2 |
7 | SINTERED BRONZE | Author keyword | 1 | 33% | 1% | 2 |
8 | AL REFLOW | Author keyword | 1 | 50% | 1% | 1 |
9 | ALUMINIUM TRANSPORT | Author keyword | 1 | 50% | 1% | 1 |
10 | ATOMIC FORCED MICROSCOPY AFM | Author keyword | 1 | 50% | 1% | 1 |
Web of Science journal categories |
Author Key Words |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | NONDESTRUCTIVE REGIMES | 3 | 100% | 2% | 3 |
2 | M2 STEEL | 0 | 33% | 1% | 1 |
3 | SILICON FUSION | 0 | 20% | 1% | 1 |
4 | SUBMICROLITER VOLUMES | 0 | 20% | 1% | 1 |
5 | CONTACT SYSTEMS | 0 | 14% | 1% | 1 |
6 | SMOOTH DIAMOND FILMS | 0 | 100% | 1% | 1 |
Journals |
Reviews |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | ADV DESIGN ANAL | 1 | 40% | 1.0% | 2 |
2 | DRAM DEV ALLIANCE | 1 | 20% | 1.6% | 3 |
3 | SIEMENS | 0 | 25% | 0.5% | 1 |
4 | SILICON TECHNOL DEV GRP | 0 | 17% | 0.5% | 1 |
5 | ULSI S | 0 | 13% | 0.5% | 1 |
6 | COMMON PHYS | 0 | 100% | 0.5% | 1 |
7 | DRAM DEV PROGRAM | 0 | 100% | 0.5% | 1 |
8 | ELECT FONDAMENTALE URA CNRS D022 | 0 | 100% | 0.5% | 1 |
9 | ETSNMN UPV | 0 | 100% | 0.5% | 1 |
10 | PROC ENGN INTERCONNECT | 0 | 100% | 0.5% | 1 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000136744 | ENERGY RESOLVED MASS SPECTROSCOPY//TRIODE ION PLATING//HOLLOW CATHODE ARC PLASMA |
2 | 0.0000131500 | EXPANDED CORE FIBER//FINE WIRING//H2 REDUCTION |
3 | 0.0000122868 | ELECTROMIGRATION//STRESS INDUCED MIGRATION//PRC MER |
4 | 0.0000106088 | RIMMING FLOW//RIMMING FLOWS//RIVULET FLOW |
5 | 0.0000105886 | BOROPHOSPHOSILICATE GLASS BPSG//ATMOSPHERIC PRESSURE CVD//BPSG |
6 | 0.0000105654 | HIPIMS//HPPMS//HIGH POWER IMPULSE MAGNETRON SPUTTERING |
7 | 0.0000084692 | DYNAMIC FRICTION POLISHING//P TYPE DIAMOND FILMS//DESIGN TECHNOL MONOCRYSTAL |
8 | 0.0000074096 | LANGMUIR SORPTION MODEL//ION CLUSTER BEAM DEPOSITION//IONIZED CLUSTER BEAM TECHNIQUE |
9 | 0.0000072293 | INFNSEZ LECCE//FAST SIGNALS//FOCUSED ION BEAM IMAGING |
10 | 0.0000069207 | LASER CLEANING//LASER ENGN GRP//ROLLS ROYCE COMP S SYST |