Class information for:
Level 1: JOURNAL OF ELECTRONIC PACKAGING//SOLDERING & SURFACE MOUNT TECHNOLOGY//SOLDER JOINT

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
2655 2108 20.4 40%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
688 12395 LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 JOURNAL OF ELECTRONIC PACKAGING Journal 71 23% 13% 270
2 SOLDERING & SURFACE MOUNT TECHNOLOGY Journal 36 29% 5% 105
3 SOLDER JOINT Author keyword 24 25% 4% 81
4 SOLDER Author keyword 20 16% 5% 111
5 SOLDER JOINTS Author keyword 18 29% 2% 52
6 UNDERFILL Author keyword 17 23% 3% 64
7 LEAD FREE SOLDER Author keyword 16 12% 6% 121
8 COMPONENT QUAL TECHNOL GRP Address 15 67% 1% 14
9 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES Journal 15 11% 6% 126
10 SOLDER JOINT RELIABILITY Author keyword 14 33% 2% 34

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 SOLDER JOINT 24 25% 4% 81 Search SOLDER+JOINT Search SOLDER+JOINT
2 SOLDER 20 16% 5% 111 Search SOLDER Search SOLDER
3 SOLDER JOINTS 18 29% 2% 52 Search SOLDER+JOINTS Search SOLDER+JOINTS
4 UNDERFILL 17 23% 3% 64 Search UNDERFILL Search UNDERFILL
5 LEAD FREE SOLDER 16 12% 6% 121 Search LEAD+FREE+SOLDER Search LEAD+FREE+SOLDER
6 SOLDER JOINT RELIABILITY 14 33% 2% 34 Search SOLDER+JOINT+RELIABILITY Search SOLDER+JOINT+RELIABILITY
7 SOLDERS 10 22% 2% 38 Search SOLDERS Search SOLDERS
8 CONVECTION REFLOW OVEN 8 100% 0% 5 Search CONVECTION+REFLOW+OVEN Search CONVECTION+REFLOW+OVEN
9 LEADFREE SOLDERS 8 100% 0% 5 Search LEADFREE+SOLDERS Search LEADFREE+SOLDERS
10 PB FREE SOLDER 7 16% 2% 40 Search PB+FREE+SOLDER Search PB+FREE+SOLDER

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 TERNARY 955SN 39AG 06CU SOLDER 22 81% 1% 13
2 SOLDER JOINT RELIABILITY 17 42% 2% 32
3 SOLDER JOINTS 17 18% 4% 85
4 CHIP SCALE PACKAGES 16 46% 1% 25
5 SOLDER COPPER JOINTS 15 82% 0% 9
6 TIN LEAD SOLDER 15 62% 1% 16
7 63SN 37PB SOLDER 15 71% 1% 12
8 SHAPE PREDICTION 15 73% 1% 11
9 63SN 37PB 14 64% 1% 14
10 BGA 14 39% 1% 28

Journals


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 JOURNAL OF ELECTRONIC PACKAGING 71 23% 13% 270
2 SOLDERING & SURFACE MOUNT TECHNOLOGY 36 29% 5% 105
3 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 15 11% 6% 126
4 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 7 13% 2% 52

Reviews


Title Publ. year Cit. Active
references		 % act. ref.
to same field
Solder joint fatigue models: review and applicability to chip scale packages 2000 200 5 100%
Reliability behavior of lead-free solder joints in electronic components 2013 13 88 74%
A review of board level solder joints for mobile applications 2008 36 17 71%
Thermomechanical behaviour of environmentally benign Pb-free solders 2009 30 94 49%
Advances in the Fabrication Processes and Applications of Wafer Level Packaging 2014 3 12 50%
Reliability of lead-free solder in power module with stochastic uncertainty 2009 9 9 89%
Review of methods to predict solder joint reliability under thermo-mechanical cycling 2007 20 18 83%
Deformation behavior of tin and some tin alloys 2007 28 60 50%
3D finite element modeling of 3D C2W (chip to wafer) drop test reliability: Optimization of internal architecture and materials 2014 1 10 50%
Reliability of Pb-free solders for harsh environment electronic assemblies 2012 3 48 44%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 COMPONENT QUAL TECHNOL GRP 15 67% 0.7% 14
2 ADV VEHICLE ELECT 9 55% 0.6% 12
3 ELECT ASSEMBLY PACKAGING 9 64% 0.4% 9
4 ST S RELIABIL 8 41% 0.8% 16
5 IAVT 6 100% 0.2% 4
6 CALCE ELECT PROD SYST CONSORTIUM 4 39% 0.4% 9
7 NSF ELECT CAVE3 4 67% 0.2% 4
8 NEW PACKAGE DEV 4 75% 0.1% 3
9 COMP AIDED SIMULAT PACKAGING RELIABIL 4 44% 0.3% 7
10 UB ELECT PACKAGING 4 44% 0.3% 7

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000213206 LEAD FREE SOLDER//PB FREE SOLDER//LEAD FREE SOLDERS
2 0.0000159683 PLATED THROUGH HOLE//ENDICOTT ELECT PACKAGING//THREE DIMENSIONAL 3 D CHIP STACKING
3 0.0000140614 UNDERFILL FLOW//WIRE SWEEP//BUMP PITCH
4 0.0000120362 IMPRESSION CREEP//INDENTATION CREEP TESTING//IMPRESSION TEST
5 0.0000097346 ELECT MFG ENGN GRP//SOLDER PASTE//PCBA REWORK
6 0.0000088673 MOIRE INTERFEROMETRY//ELECTRON BEAM MOIRE//NANO MOIRE
7 0.0000074471 HEAT TRANSFER INSTABILITY//INDIUM JOINT//INFRARED IR EMISSIONS
8 0.0000069157 NANOSCALE SILVER PASTE//NANOSILVER PASTE//TIANJIN ADV JOINING TECHNOL
9 0.0000068983 MICROBENDING LOSS//OPTICAL FIBER MECHANICAL FACTORS//AEM GRP
10 0.0000065900 ANISOTROPIC CONDUCTIVE ADHESIVE ACA//ANISOTROPIC CONDUCTIVE FILM ACF//ANISOTROPIC CONDUCTIVE FILM