Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
25495 | 232 | 17.0 | 69% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
1859 | 5530 | NANOIMPRINT//NANOIMPRINT LITHOGRAPHY//UV NANOIMPRINT |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | WET ETCHING OF GLASS | Author keyword | 4 | 67% | 2% | 4 |
2 | DEEP GLASS ETCHING | Author keyword | 2 | 67% | 1% | 2 |
3 | TECH SUPPORT MACHINERY MET IND | Address | 2 | 67% | 1% | 2 |
4 | TWICE DEPOSITED MASK | Author keyword | 2 | 67% | 1% | 2 |
5 | INTEGRATED OPTOELECT MICROOPT GRP | Address | 2 | 40% | 2% | 4 |
6 | GLASS ETCHING | Author keyword | 2 | 36% | 2% | 4 |
7 | DEEP WET ETCHING | Author keyword | 1 | 50% | 1% | 2 |
8 | NI HARD MASK | Author keyword | 1 | 100% | 1% | 2 |
9 | PYREX GLASS | Author keyword | 1 | 15% | 3% | 6 |
10 | MASKING LAYER | Author keyword | 1 | 33% | 1% | 2 |
Web of Science journal categories |
Author Key Words |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | WET ETCHING OF GLASS | 4 | 67% | 2% | 4 | Search WET+ETCHING+OF+GLASS | Search WET+ETCHING+OF+GLASS |
2 | DEEP GLASS ETCHING | 2 | 67% | 1% | 2 | Search DEEP+GLASS+ETCHING | Search DEEP+GLASS+ETCHING |
3 | TWICE DEPOSITED MASK | 2 | 67% | 1% | 2 | Search TWICE+DEPOSITED+MASK | Search TWICE+DEPOSITED+MASK |
4 | GLASS ETCHING | 2 | 36% | 2% | 4 | Search GLASS+ETCHING | Search GLASS+ETCHING |
5 | DEEP WET ETCHING | 1 | 50% | 1% | 2 | Search DEEP+WET+ETCHING | Search DEEP+WET+ETCHING |
6 | NI HARD MASK | 1 | 100% | 1% | 2 | Search NI+HARD+MASK | Search NI+HARD+MASK |
7 | PYREX GLASS | 1 | 15% | 3% | 6 | Search PYREX+GLASS | Search PYREX+GLASS |
8 | MASKING LAYER | 1 | 33% | 1% | 2 | Search MASKING+LAYER | Search MASKING+LAYER |
9 | MICRO OPTICS FABRICATION | 1 | 33% | 1% | 2 | Search MICRO+OPTICS+FABRICATION | Search MICRO+OPTICS+FABRICATION |
10 | BURIED CHANNEL TECHNOLOGY | 1 | 50% | 0% | 1 | Search BURIED+CHANNEL+TECHNOLOGY | Search BURIED+CHANNEL+TECHNOLOGY |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | PYREX GLASS | 10 | 31% | 12% | 27 |
2 | CF4 CHF3 PLASMAS | 4 | 75% | 1% | 3 |
3 | PATTERN FABRICATION | 3 | 50% | 2% | 4 |
4 | CARBON MOLDS | 3 | 60% | 1% | 3 |
5 | MASKING LAYERS | 2 | 33% | 3% | 6 |
6 | ECR RIBE | 1 | 100% | 1% | 2 |
7 | ALUMINUM OXIDATION | 1 | 50% | 0% | 1 |
8 | MICROFABRICATED NEBULIZER | 1 | 22% | 1% | 2 |
9 | DIELECTROPHORETIC CHIP | 0 | 20% | 1% | 2 |
10 | CRACKLESS | 0 | 33% | 0% | 1 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
---|---|---|---|---|
Preparation of random stamps for thermal nanoimprint | 2012 | 0 | 4 | 25% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | TECH SUPPORT MACHINERY MET IND | 2 | 67% | 0.9% | 2 |
2 | INTEGRATED OPTOELECT MICROOPT GRP | 2 | 40% | 1.7% | 4 |
3 | MCGILL NANOTOOLS MICROFAB | 1 | 50% | 0.4% | 1 |
4 | MEMS NEMS CLUSTER | 1 | 50% | 0.4% | 1 |
5 | MICRO NANOFABRICAT UNIT | 1 | 50% | 0.4% | 1 |
6 | MICRO SYST INTEGRAT USIC | 1 | 50% | 0.4% | 1 |
7 | NANOLINK | 1 | 50% | 0.4% | 1 |
8 | FRAUNHOFER MACHINE TOOLS FORMING TECHNOL | 0 | 33% | 0.4% | 1 |
9 | NANO STRUCTURING | 0 | 33% | 0.4% | 1 |
10 | WAFER FABRICAT | 0 | 33% | 0.4% | 1 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000224684 | LIBWE//BACKSIDE ETCHING//LASER INDUCED BACKSIDE WET ETCHING |
2 | 0.0000169101 | SPRAY ETCHING//ETCH FACTOR//ETCHING FACTOR |
3 | 0.0000123970 | WAFER BONDING//ANODIC BONDING//SILICON WAFER BONDING |
4 | 0.0000117984 | NANOIMPRINT//NANOIMPRINT LITHOGRAPHY//UV NANOIMPRINT |
5 | 0.0000107283 | GLASS PRESSING//TV PANEL//GLASS MOLDING PRESS GMP |
6 | 0.0000099096 | MICROLENS ARRAY//MICROLENS//MICROLENSES |
7 | 0.0000093309 | MICROCHIP ELECTROPHORESIS//MICROCHIP//MICROCHIP CAPILLARY ELECTROPHORESIS |
8 | 0.0000080757 | ELECT DEVICES MAT TECHNOL//SIO2 ETCHING//PLASMA ETCHING |
9 | 0.0000076612 | MAGNETIC NEUTRAL LINE//NEUTRAL LOOP DISCHARGE//TCO LESS DSCS |
10 | 0.0000071588 | PLATED THROUGH HOLE//ENDICOTT ELECT PACKAGING//THREE DIMENSIONAL 3 D CHIP STACKING |