Class information for:
Level 1: WET ETCHING OF GLASS//DEEP GLASS ETCHING//TECH SUPPORT MACHINERY MET IND

Basic class information

ID Publications Average number
of references
Avg. shr. active
ref. in WoS
25495 232 17.0 69%



Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)



ID, lev.
above
Publications Label for level above
1859 5530 NANOIMPRINT//NANOIMPRINT LITHOGRAPHY//UV NANOIMPRINT

Terms with highest relevance score



Rank Term Type of term Relevance score
(tfidf)
Class's shr.
of term's tot.
occurrences
Shr. of publ.
in class containing
term
Num. of
publ.
in class
1 WET ETCHING OF GLASS Author keyword 4 67% 2% 4
2 DEEP GLASS ETCHING Author keyword 2 67% 1% 2
3 TECH SUPPORT MACHINERY MET IND Address 2 67% 1% 2
4 TWICE DEPOSITED MASK Author keyword 2 67% 1% 2
5 INTEGRATED OPTOELECT MICROOPT GRP Address 2 40% 2% 4
6 GLASS ETCHING Author keyword 2 36% 2% 4
7 DEEP WET ETCHING Author keyword 1 50% 1% 2
8 NI HARD MASK Author keyword 1 100% 1% 2
9 PYREX GLASS Author keyword 1 15% 3% 6
10 MASKING LAYER Author keyword 1 33% 1% 2

Web of Science journal categories

Author Key Words



Rank Web of Science journal category Relevance score
(tfidf)
Class's shr.
of term's tot.
occurrences
Shr. of publ.
in class containing
term
Num. of
publ.
in class
LCSH search Wikipedia search
1 WET ETCHING OF GLASS 4 67% 2% 4 Search WET+ETCHING+OF+GLASS Search WET+ETCHING+OF+GLASS
2 DEEP GLASS ETCHING 2 67% 1% 2 Search DEEP+GLASS+ETCHING Search DEEP+GLASS+ETCHING
3 TWICE DEPOSITED MASK 2 67% 1% 2 Search TWICE+DEPOSITED+MASK Search TWICE+DEPOSITED+MASK
4 GLASS ETCHING 2 36% 2% 4 Search GLASS+ETCHING Search GLASS+ETCHING
5 DEEP WET ETCHING 1 50% 1% 2 Search DEEP+WET+ETCHING Search DEEP+WET+ETCHING
6 NI HARD MASK 1 100% 1% 2 Search NI+HARD+MASK Search NI+HARD+MASK
7 PYREX GLASS 1 15% 3% 6 Search PYREX+GLASS Search PYREX+GLASS
8 MASKING LAYER 1 33% 1% 2 Search MASKING+LAYER Search MASKING+LAYER
9 MICRO OPTICS FABRICATION 1 33% 1% 2 Search MICRO+OPTICS+FABRICATION Search MICRO+OPTICS+FABRICATION
10 BURIED CHANNEL TECHNOLOGY 1 50% 0% 1 Search BURIED+CHANNEL+TECHNOLOGY Search BURIED+CHANNEL+TECHNOLOGY

Key Words Plus



Rank Web of Science journal category Relevance score
(tfidf)
Class's shr.
of term's tot.
occurrences
Shr. of publ.
in class containing
term
Num. of
publ. in
class
1 PYREX GLASS 10 31% 12% 27
2 CF4 CHF3 PLASMAS 4 75% 1% 3
3 PATTERN FABRICATION 3 50% 2% 4
4 CARBON MOLDS 3 60% 1% 3
5 MASKING LAYERS 2 33% 3% 6
6 ECR RIBE 1 100% 1% 2
7 ALUMINUM OXIDATION 1 50% 0% 1
8 MICROFABRICATED NEBULIZER 1 22% 1% 2
9 DIELECTROPHORETIC CHIP 0 20% 1% 2
10 CRACKLESS 0 33% 0% 1

Journals

Reviews



Title Publ. year Cit. Active
references
% act. ref.
to same field
Preparation of random stamps for thermal nanoimprint 2012 0 4 25%

Address terms



Rank Address term Relevance score
(tfidf)
Class's shr.
of term's tot.
occurrences
Shr. of publ.
in class containing
term
Num. of
publ.
in class
1 TECH SUPPORT MACHINERY MET IND 2 67% 0.9% 2
2 INTEGRATED OPTOELECT MICROOPT GRP 2 40% 1.7% 4
3 MCGILL NANOTOOLS MICROFAB 1 50% 0.4% 1
4 MEMS NEMS CLUSTER 1 50% 0.4% 1
5 MICRO NANOFABRICAT UNIT 1 50% 0.4% 1
6 MICRO SYST INTEGRAT USIC 1 50% 0.4% 1
7 NANOLINK 1 50% 0.4% 1
8 FRAUNHOFER MACHINE TOOLS FORMING TECHNOL 0 33% 0.4% 1
9 NANO STRUCTURING 0 33% 0.4% 1
10 WAFER FABRICAT 0 33% 0.4% 1

Related classes at same level (level 1)



Rank Relatedness score Related classes
1 0.0000224684 LIBWE//BACKSIDE ETCHING//LASER INDUCED BACKSIDE WET ETCHING
2 0.0000169101 SPRAY ETCHING//ETCH FACTOR//ETCHING FACTOR
3 0.0000123970 WAFER BONDING//ANODIC BONDING//SILICON WAFER BONDING
4 0.0000117984 NANOIMPRINT//NANOIMPRINT LITHOGRAPHY//UV NANOIMPRINT
5 0.0000107283 GLASS PRESSING//TV PANEL//GLASS MOLDING PRESS GMP
6 0.0000099096 MICROLENS ARRAY//MICROLENS//MICROLENSES
7 0.0000093309 MICROCHIP ELECTROPHORESIS//MICROCHIP//MICROCHIP CAPILLARY ELECTROPHORESIS
8 0.0000080757 ELECT DEVICES MAT TECHNOL//SIO2 ETCHING//PLASMA ETCHING
9 0.0000076612 MAGNETIC NEUTRAL LINE//NEUTRAL LOOP DISCHARGE//TCO LESS DSCS
10 0.0000071588 PLATED THROUGH HOLE//ENDICOTT ELECT PACKAGING//THREE DIMENSIONAL 3 D CHIP STACKING