Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 24792 | 251 | 15.6 | 29% |
Classes in level above (level 2) |
| ID, lev. above |
Publications | Label for level above |
|---|---|---|
| 688 | 12395 | LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | THERMAL ENGN TECHNOL | Address | 1 | 100% | 1% | 2 |
| 2 | J AN MARINE SCI TECHNOL | Address | 1 | 27% | 2% | 4 |
| 3 | INP WAFERS | Author keyword | 1 | 50% | 0% | 1 |
| 4 | MCM C SUBSTRATES | Author keyword | 1 | 50% | 0% | 1 |
| 5 | PVP PARALLEL VECTOR PROCESSOR | Author keyword | 1 | 50% | 0% | 1 |
| 6 | HPC HIGH PERFORMANCE COMPUTING | Author keyword | 1 | 16% | 1% | 3 |
| 7 | CROSSBAR NETWORK | Author keyword | 0 | 20% | 1% | 2 |
| 8 | AND COPPER | Author keyword | 0 | 33% | 0% | 1 |
| 9 | BUS TRANSMISSION | Author keyword | 0 | 33% | 0% | 1 |
| 10 | CHIP JUNCTION TEMPERATURE | Author keyword | 0 | 33% | 0% | 1 |
Web of Science journal categories |
Author Key Words |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | INP WAFERS | 1 | 50% | 0% | 1 | Search INP+WAFERS | Search INP+WAFERS |
| 2 | MCM C SUBSTRATES | 1 | 50% | 0% | 1 | Search MCM+C+SUBSTRATES | Search MCM+C+SUBSTRATES |
| 3 | PVP PARALLEL VECTOR PROCESSOR | 1 | 50% | 0% | 1 | Search PVP+PARALLEL+VECTOR+PROCESSOR | Search PVP+PARALLEL+VECTOR+PROCESSOR |
| 4 | HPC HIGH PERFORMANCE COMPUTING | 1 | 16% | 1% | 3 | Search HPC+HIGH+PERFORMANCE+COMPUTING | Search HPC+HIGH+PERFORMANCE+COMPUTING |
| 5 | CROSSBAR NETWORK | 0 | 20% | 1% | 2 | Search CROSSBAR+NETWORK | Search CROSSBAR+NETWORK |
| 6 | AND COPPER | 0 | 33% | 0% | 1 | Search AND+COPPER | Search AND+COPPER |
| 7 | BUS TRANSMISSION | 0 | 33% | 0% | 1 | Search BUS+TRANSMISSION | Search BUS+TRANSMISSION |
| 8 | CHIP JUNCTION TEMPERATURE | 0 | 33% | 0% | 1 | Search CHIP+JUNCTION+TEMPERATURE | Search CHIP+JUNCTION+TEMPERATURE |
| 9 | SHORT FAULT | 0 | 33% | 0% | 1 | Search SHORT+FAULT | Search SHORT+FAULT |
| 10 | WIREABILITY | 0 | 33% | 0% | 1 | Search WIREABILITY | Search WIREABILITY |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | FILM TECHNOLOGY | 1 | 50% | 0% | 1 |
| 2 | THERMAL CONDUCTION MODULE | 0 | 33% | 0% | 1 |
| 3 | THERMAL RESISTANCE MEASUREMENT | 0 | 33% | 0% | 1 |
| 4 | PACKAGING TECHNOLOGY | 0 | 10% | 1% | 3 |
| 5 | INTEGRATED SENSORS | 0 | 17% | 0% | 1 |
| 6 | JOSEPHSON DATA PROCESSOR | 0 | 100% | 0% | 1 |
| 7 | LSI CHIPS | 0 | 100% | 0% | 1 |
Journals |
Reviews |
| Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
|---|---|---|---|---|
| REVIEW OF MULTILAYER CERAMICS FOR MICROELECTRONIC PACKAGING | 1984 | 24 | 10 | 60% |
| POSSIBILITIES OF DEEP-SUBMICROMETER CMOS FOR VERY-HIGH-SPEED COMPUTER LOGIC | 1993 | 8 | 54 | 19% |
| POLYIMIDES AS INTERLAYER DIELECTRICS FOR HIGH-PERFORMANCE INTERCONNECTIONS OF INTEGRATED-CIRCUITS | 1987 | 4 | 7 | 43% |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | THERMAL ENGN TECHNOL | 1 | 100% | 0.8% | 2 |
| 2 | J AN MARINE SCI TECHNOL | 1 | 27% | 1.6% | 4 |
| 3 | GAAS | 0 | 33% | 0.4% | 1 |
| 4 | SYST ULSI DEV | 0 | 25% | 0.4% | 1 |
| 5 | COMP OPERAT UNIT 1 | 0 | 14% | 0.4% | 1 |
| 6 | ASME ADV THERMAL | 0 | 100% | 0.4% | 1 |
| 7 | DENSEN WORKS | 0 | 100% | 0.4% | 1 |
| 8 | DISCRETE DEVICES DEV | 0 | 100% | 0.4% | 1 |
| 9 | ENGN 4TH | 0 | 100% | 0.4% | 1 |
| 10 | HIGH END POWER SYST DEV | 0 | 100% | 0.4% | 1 |
Related classes at same level (level 1) |
| Rank | Relatedness score | Related classes |
|---|---|---|
| 1 | 0.0000164011 | MINIMUM DISTANCE CALCULATION//FINE MOTION PLANNING//WESTERN NORWAY |
| 2 | 0.0000132061 | CELL RELAY//INFORMATION SYSTEMS COMMUNICATIONS APPLICATIONS//PL SOCIAL SCI ITS |
| 3 | 0.0000127954 | IBM SYST TECHNOL GRP//390//SERVER GRP |
| 4 | 0.0000125520 | HEAT TRANSFER INSTABILITY//INDIUM JOINT//INFRARED IR EMISSIONS |
| 5 | 0.0000123102 | PLATED THROUGH HOLE//ENDICOTT ELECT PACKAGING//THREE DIMENSIONAL 3 D CHIP STACKING |
| 6 | 0.0000122390 | FLEXIBLE COPPER CLAD LAMINATE//FLEXIBLE COPPER CLAD LAMINATE FCCL//SILANE MODIFIED POLYVINYLIMIDAZOLE |
| 7 | 0.0000118092 | PLASTIC ENCAPSULATED MICROCIRCUIT//NONHERMETIC//DORMANT STORAGE |
| 8 | 0.0000101657 | THERMAL PLACEMENT//DYNAMIC THERMAL MANAGEMENT DTM//TIME CONSTANT SPECTRUM |
| 9 | 0.0000077008 | SIMULTANEOUS SWITCHING NOISE//SIMULTANEOUS SWITCHING NOISE SSN//GROUND BOUNCE NOISE GBN |
| 10 | 0.0000074796 | BUILT IN REDUNDANCY ANALYSIS BIRA//CATASTROPHIC FAULT PATTERNS//CRITICAL AREA |