Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
24778 | 252 | 15.4 | 42% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
2574 | 3220 | THERMAL FLOW SENSOR//MICROHOTPLATE//THERMOPILE |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | SENSORS SUR E TECHNOL PARTNERSHIP | Address | 6 | 80% | 2% | 4 |
2 | SMART MAT MEMS | Address | 3 | 39% | 3% | 7 |
3 | THIN FILM THERMOCOUPLES | Author keyword | 3 | 35% | 2% | 6 |
4 | MATCH X | Author keyword | 2 | 67% | 1% | 2 |
5 | MECHATRON SENSORTECHNOL | Address | 1 | 50% | 1% | 2 |
6 | SENSORS TECHNOL BRANCH | Address | 1 | 100% | 1% | 2 |
7 | THIN FILM STRAIN GAGE | Author keyword | 1 | 100% | 1% | 2 |
8 | CERAMIC THERMOCOUPLE | Author keyword | 1 | 40% | 1% | 2 |
9 | DIRECT WRITE FABRICATION | Author keyword | 1 | 50% | 0% | 1 |
10 | EMK | Address | 1 | 50% | 0% | 1 |
Web of Science journal categories |
Author Key Words |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | MICROTHERMOCOUPLES | 4 | 67% | 2% | 4 |
2 | RTD HEATERS | 3 | 100% | 1% | 3 |
3 | SPUTTERED SAMPLE | 3 | 100% | 1% | 3 |
4 | THERMOCOUPLES | 2 | 14% | 6% | 14 |
5 | STRAIN GAUGES | 1 | 10% | 3% | 7 |
6 | THIN FILM THERMOCOUPLES | 1 | 17% | 2% | 4 |
7 | DISCONTINUOUS FILMS | 1 | 50% | 0% | 1 |
8 | FILM STRAIN GAUGES | 1 | 50% | 0% | 1 |
9 | TEMPERATURE SENSOR ARRAY | 1 | 50% | 0% | 1 |
10 | RESOLVED REFLECTIVITY MEASUREMENTS | 0 | 15% | 1% | 2 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
---|---|---|---|---|
Progress and Challenges in Control of Chemical Processes | 2014 | 0 | 92 | 4% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | SENSORS SUR E TECHNOL PARTNERSHIP | 6 | 80% | 1.6% | 4 |
2 | SMART MAT MEMS | 3 | 39% | 2.8% | 7 |
3 | MECHATRON SENSORTECHNOL | 1 | 50% | 0.8% | 2 |
4 | SENSORS TECHNOL BRANCH | 1 | 100% | 0.8% | 2 |
5 | EMK | 1 | 50% | 0.4% | 1 |
6 | SOUTH UNIV 2801 | 1 | 50% | 0.4% | 1 |
7 | SW BAILEY XRAY DIFFRACT | 1 | 50% | 0.4% | 1 |
8 | ADV TRANSDUCER DEV | 0 | 33% | 0.4% | 1 |
9 | LIQUID PROPULS SYST | 0 | 33% | 0.4% | 1 |
10 | MOL IMAGING EXPT RADIOTHER Y IRME | 0 | 33% | 0.4% | 1 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000213083 | RESISTIVE FILMS//RELATIVE RESISTANCE CHANGE//MINIST HIGH TEMP MAT TESTS |
2 | 0.0000130627 | HEAT FLUX GAGE//MICRO C OUEST//NON INTEGER SYSTEM IDENTIFICATION |
3 | 0.0000125852 | UNCOOLED INFRARED IMAGING//OPTICAL READOUT//MICROBOLOMETER |
4 | 0.0000123824 | ELECTRO DEPOSIT//NI BI//ELECTRODEPOSIT |
5 | 0.0000123198 | INNER LEAD BONDING ILB//INNER LEAD BONDING//LASER SOLDERING |
6 | 0.0000122497 | PIEZORESISTANCE//CAPACITIVE PRESSURE SENSOR//TOUCH MODE |
7 | 0.0000110573 | ULTRASONIC CONSOLIDATION//ULTRASONIC WELDING//ULTRASONIC SPOT WELDING |
8 | 0.0000096154 | INDUCTIVE LABILITY//LABILE STATE//BOTULINUM TOXIN BOTX |
9 | 0.0000082005 | AU NI50FE50//ECS ENGN//CIENCIAS FIS LCFIS |
10 | 0.0000070940 | XRAY EMISS SPECT//CHICAGO OPERAT OFF//CROSSOVER TRANSITIONS |