Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 24307 | 265 | 18.3 | 27% |
Classes in level above (level 2) |
| ID, lev. above |
Publications | Label for level above |
|---|---|---|
| 504 | 14575 | PLATING AND SURFACE FINISHING//ELECTRODEPOSITION//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | ELECTRODEPOSITION OF NICKEL | Author keyword | 1 | 40% | 1% | 2 |
| 2 | 2 FILM THEORY | Author keyword | 1 | 50% | 0% | 1 |
| 3 | AXIAL DISPERSION MODELS | Author keyword | 1 | 50% | 0% | 1 |
| 4 | FLUID FLUID REACTORS | Author keyword | 1 | 50% | 0% | 1 |
| 5 | REVERSING CURRENT | Author keyword | 0 | 20% | 1% | 2 |
| 6 | PULSATING CURRENT | Author keyword | 0 | 18% | 1% | 2 |
| 7 | NI COATINGS | Author keyword | 0 | 25% | 0% | 1 |
| 8 | NICKEL ELECTRODEPOSITS | Author keyword | 0 | 25% | 0% | 1 |
| 9 | INTERFACE BOUNDARIES | Author keyword | 0 | 20% | 0% | 1 |
| 10 | ELE OCHEM ICTM | Address | 0 | 17% | 0% | 1 |
Web of Science journal categories |
Author Key Words |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | ELECTRODEPOSITION OF NICKEL | 1 | 40% | 1% | 2 | Search ELECTRODEPOSITION+OF+NICKEL | Search ELECTRODEPOSITION+OF+NICKEL |
| 2 | 2 FILM THEORY | 1 | 50% | 0% | 1 | Search 2+FILM+THEORY | Search 2+FILM+THEORY |
| 3 | AXIAL DISPERSION MODELS | 1 | 50% | 0% | 1 | Search AXIAL+DISPERSION+MODELS | Search AXIAL+DISPERSION+MODELS |
| 4 | FLUID FLUID REACTORS | 1 | 50% | 0% | 1 | Search FLUID+FLUID+REACTORS | Search FLUID+FLUID+REACTORS |
| 5 | REVERSING CURRENT | 0 | 20% | 1% | 2 | Search REVERSING+CURRENT | Search REVERSING+CURRENT |
| 6 | PULSATING CURRENT | 0 | 18% | 1% | 2 | Search PULSATING+CURRENT | Search PULSATING+CURRENT |
| 7 | NI COATINGS | 0 | 25% | 0% | 1 | Search NI+COATINGS | Search NI+COATINGS |
| 8 | NICKEL ELECTRODEPOSITS | 0 | 25% | 0% | 1 | Search NICKEL+ELECTRODEPOSITS | Search NICKEL+ELECTRODEPOSITS |
| 9 | INTERFACE BOUNDARIES | 0 | 20% | 0% | 1 | Search INTERFACE+BOUNDARIES | Search INTERFACE+BOUNDARIES |
| 10 | ELECTRODEPOSITION OF COPPER | 0 | 17% | 0% | 1 | Search ELECTRODEPOSITION+OF+COPPER | Search ELECTRODEPOSITION+OF+COPPER |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | AC ELECTROLYSIS | 6 | 80% | 2% | 4 |
| 2 | SINUSOIDAL CURRENT | 3 | 100% | 1% | 3 |
| 3 | ALKYL BENZENE ELECTROLYTES | 1 | 100% | 1% | 2 |
| 4 | PULSATING CURRENT | 0 | 20% | 1% | 2 |
| 5 | FILM THEORY | 0 | 25% | 0% | 1 |
| 6 | DIFFUSIONAL BOUNDARY LAYERS | 0 | 20% | 0% | 1 |
| 7 | PULSED ELECTROLYSIS | 0 | 20% | 0% | 1 |
| 8 | UNSTEADY 2 FILM MODEL | 0 | 17% | 0% | 1 |
| 9 | VOLTAGE MODULATION | 0 | 14% | 0% | 1 |
| 10 | CURRENT METAL ELECTRODEPOSITION | 0 | 13% | 0% | 1 |
Journals |
Reviews |
| Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
|---|---|---|---|---|
| Mass transfer during electrodeposition of metals at a periodically changing rate | 1999 | 2 | 14 | 93% |
| PULSE PLATING | 1990 | 34 | 36 | 56% |
| INORGANIC METALLIC FINISHES, PROCESSES AND EQUIPMENT | 1984 | 2 | 2 | 50% |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | ELE OCHEM ICTM | 0 | 17% | 0.4% | 1 |
| 2 | CORROS SUR E TREATMENTS | 0 | 100% | 0.4% | 1 |
| 3 | ESCUELA PROC ENERGIE | 0 | 100% | 0.4% | 1 |
| 4 | TEAM PULSED CURRENTS COMPOSITE COATINGS | 0 | 100% | 0.4% | 1 |
Related classes at same level (level 1) |
| Rank | Relatedness score | Related classes |
|---|---|---|
| 1 | 0.0000215495 | COPPER POWDER FLOWABILITY//ELECTROLYTIC COPPER POWDER//REVERSING CURRENT |
| 2 | 0.0000200583 | TRIVALENT CHROMIUM BATH//TRIVALENT CHROMIUM//TRIVALENT CHROMIUM ELECTRODEPOSITION |
| 3 | 0.0000186390 | UDIL//BRINDISI FUEL CELL DURABIL//LEVELLERS |
| 4 | 0.0000154757 | COMPOSITE COATINGS//ELECTROCODEPOSITION//SEDIMENT CO DEPOSITION |
| 5 | 0.0000143698 | PL ELE OCHEM GRP//EDUCTORS//ELECTROPLATING TANK |
| 6 | 0.0000142406 | SELF ANNEALING//COPPER ELECTRODEPOSITION//COPPER ELECTROPLATING |
| 7 | 0.0000125016 | COFE FILMS//PRECIS ELECT TECHNOL//FECONI ALLOY |
| 8 | 0.0000106831 | NI W ALLOYS//INDUCED CODEPOSITION//NI W ALLOY |
| 9 | 0.0000096493 | ELECTRO DEPOSIT//NI BI//ELECTRODEPOSIT |
| 10 | 0.0000092502 | TOY GAME DESIGN//ELECTROCHEMICAL MACHINING//ELECTROCHEMICAL MACHINING ECM |