Class information for:
Level 1: SPRAY ETCHING//ETCH FACTOR//ETCHING FACTOR

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
24219 267 20.2 42%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
2900 2299 PHOTORESIST REMOVAL//WET OZONE//HYDROGEN TERMINATION

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ.
in class
1 SPRAY ETCHING Author keyword 3 57% 1% 4
2 ETCH FACTOR Author keyword 2 67% 1% 2
3 ETCHING FACTOR Author keyword 2 50% 1% 3
4 42 ALLOY Author keyword 1 100% 1% 2
5 KDG Address 1 100% 1% 2
6 SACRIFICIAL OXIDE Author keyword 1 29% 1% 4
7 PHOTOCHEMICAL MACHINING Author keyword 1 33% 1% 3
8 DEPTH OF ETCH Author keyword 1 50% 0% 1
9 ETCHING FAILURE Author keyword 1 50% 0% 1
10 EVANESCENT FIELD WAVEGUIDE Author keyword 1 50% 0% 1

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ.
in class		 LCSH search Wikipedia search
1 SPRAY ETCHING 3 57% 1% 4 Search SPRAY+ETCHING Search SPRAY+ETCHING
2 ETCH FACTOR 2 67% 1% 2 Search ETCH+FACTOR Search ETCH+FACTOR
3 ETCHING FACTOR 2 50% 1% 3 Search ETCHING+FACTOR Search ETCHING+FACTOR
4 42 ALLOY 1 100% 1% 2 Search 42+ALLOY Search 42+ALLOY
5 SACRIFICIAL OXIDE 1 29% 1% 4 Search SACRIFICIAL+OXIDE Search SACRIFICIAL+OXIDE
6 PHOTOCHEMICAL MACHINING 1 33% 1% 3 Search PHOTOCHEMICAL+MACHINING Search PHOTOCHEMICAL+MACHINING
7 DEPTH OF ETCH 1 50% 0% 1 Search DEPTH+OF+ETCH Search DEPTH+OF+ETCH
8 ETCHING FAILURE 1 50% 0% 1 Search ETCHING+FAILURE Search ETCHING+FAILURE
9 EVANESCENT FIELD WAVEGUIDE 1 50% 0% 1 Search EVANESCENT+FIELD+WAVEGUIDE Search EVANESCENT+FIELD+WAVEGUIDE
10 INTEGRATED CLEAN 1 50% 0% 1 Search INTEGRATED+CLEAN Search INTEGRATED+CLEAN

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 RESIST EDGES 7 53% 4% 10
2 DIOXIDE SACRIFICIAL LAYERS 6 80% 1% 4
3 HYDROGEN FLUORIDE SOLUTION 4 75% 1% 3
4 AQUEOUS HYDROGEN FLUORIDE 2 67% 1% 2
5 BUFFERED HYDROGEN FLUORIDE 2 67% 1% 2
6 FIXED GRID METHOD 2 67% 1% 2
7 ANHYDROUS HF 1 31% 1% 4
8 ETCHES 1 50% 1% 2
9 PARTIALLY COVERED CAVITIES 1 100% 1% 2
10 HF BASED SOLUTIONS 1 40% 1% 2

Journals

Reviews


Title Publ. year Cit. Active
references		 % act. ref.
to same field
Silicon dioxide sacrificial layer etching in surface micromachining 1997 61 28 32%
Non-Aqueous Cleaning Challenges for Preventing Damage to Fragile Nano-Structures: A Review 2014 2 18 17%
WET CHEMICAL ETCHING OF SILICATE-GLASSES IN HYDROFLUORIC-ACID BASED SOLUTIONS 1993 135 41 27%
A REVIEW OF THE CHEMICAL-REACTION MECHANISM AND KINETICS FOR HYDROFLUORIC-ACID ETCHING OF SILICON DIOXIDE FOR SURFACE MICROMACHING APPLICATIONS 1993 75 32 28%
UNIT PROCESSES IN THE MANUFACTURE OF INTEGRATED-CIRCUITS 1985 1 2 50%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ.
in class
1 KDG 1 100% 0.7% 2
2 SUR E CONDITIONING 1 50% 0.4% 1
3 RECH PLIQUEES 0 33% 0.4% 1
4 ADV ELECT MAT PROC 0 25% 0.4% 1
5 NETWORKING COMP SYST GRP 0 25% 0.4% 1
6 MICRO NANO TECHNOL SYST LIAO NING PROV 0 20% 0.4% 1
7 ARBEITSSTELLE POLITIK TECHNIK 0 100% 0.4% 1
8 CEPREI 0 100% 0.4% 1
9 CUSTOM IC TECHNOL 0 100% 0.4% 1
10 HBEREICH PROD 4 0 100% 0.4% 1

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000169101 WET ETCHING OF GLASS//DEEP GLASS ETCHING//TECH SUPPORT MACHINERY MET IND
2 0.0000163871 HYDROGEN TERMINATION//SHIZUOKA TORY//LAYER BY LAYER OXIDATION
3 0.0000118114 BOROPHOSPHOSILICATE GLASS BPSG//ATMOSPHERIC PRESSURE CVD//BPSG
4 0.0000101558 ANISOTROPIC ETCHING//MICRONANOSYST ENGN//MEMS MICRO NANO SYST
5 0.0000093523 NANOPYRAMID ARRAY//DOPANT ION IMPLANTATION//FIS SUPERFICIES INTER ES
6 0.0000080045 WET OZONE//PHOTORESIST REMOVAL//RESIST REMOVAL
7 0.0000078050 BRINE MIXING//SCALE MANAGEMENT//STIMULAT CHEM SECT
8 0.0000067747 MAGNETIC NEUTRAL LINE//NEUTRAL LOOP DISCHARGE//TCO LESS DSCS
9 0.0000065584 SMOLENSK BRANCH//SPEARMINT ESSENTIAL OIL//INNOVATIVE RESOURCES
10 0.0000059342 THIN SPRAY ON LINER//FIBRE REINFORCED SHOTCRETE//HEAT INSULATION COATING