Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
23934 | 275 | 19.2 | 29% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
3544 | 966 | ELECTROCHEMICAL MIGRATION//SECT PROD PROC QUAL//MECHANICAL RELIABILITY PREDICTION |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | PLASTIC ENCAPSULATED MICROCIRCUIT | Author keyword | 7 | 67% | 2% | 6 |
2 | NONHERMETIC | Author keyword | 4 | 75% | 1% | 3 |
3 | DORMANT STORAGE | Author keyword | 3 | 100% | 1% | 3 |
4 | NEUROLOGICAL PROSTHESES | Author keyword | 3 | 100% | 1% | 3 |
5 | PLASTIC ENCAPSULATED MICROCIRCUITS | Author keyword | 3 | 50% | 1% | 4 |
6 | PLASTIC INTEGRATED CIRCUIT PACKAGING | Author keyword | 2 | 67% | 1% | 2 |
7 | BRITISH HEART FDN SKELETAL MUSCLE ASSIST GRP | Address | 1 | 50% | 1% | 2 |
8 | NONHERMETIC PACKAGE | Author keyword | 1 | 100% | 1% | 2 |
9 | RELIABILITY COMPARISON | Author keyword | 1 | 50% | 1% | 2 |
10 | IMPLANTED DEVICES GRP | Address | 1 | 21% | 2% | 5 |
Web of Science journal categories |
Author Key Words |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | NEUROLOGICAL PROSTHESES | 3 | 38% | 2% | 6 |
2 | NONHERMETIC ALUMINUM SICS | 2 | 67% | 1% | 2 |
3 | HUMIDITY BIAS BEHAVIOR | 2 | 43% | 1% | 3 |
4 | BIAS HUMIDITY PERFORMANCE | 1 | 50% | 1% | 2 |
5 | CRACK LIKE CAVITIES | 1 | 100% | 1% | 2 |
6 | RESISTIVE FIELD SHIELD | 1 | 50% | 1% | 2 |
7 | ENCAPSULANT | 1 | 14% | 2% | 6 |
8 | ACCELERATION FACTORS | 1 | 33% | 1% | 2 |
9 | A SIN H | 1 | 50% | 0% | 1 |
10 | MOISTURE PROTECTION | 1 | 50% | 0% | 1 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
---|---|---|---|---|
Corrosion-induced degradation of microelectronic devices | 1996 | 21 | 4 | 100% |
Corrosion of silicon integrated circuits and lifetime predictions in implantable electronic devices | 2013 | 3 | 33 | 58% |
Plastic packages survive where hermetic packages fail | 1996 | 3 | 1 | 100% |
THE CHALLENGES FOR HERMETIC ENCAPSULATION OF IMPLANTED DEVICES - A REVIEW | 1994 | 28 | 27 | 26% |
APPLICATION OF POLYMER IN ENCAPSULATION OF ELECTRONIC PARTS | 1988 | 24 | 11 | 36% |
20 YEARS OF NEUROLOGICAL PROSTHESIS-MAKING | 1987 | 16 | 7 | 29% |
HUMIDITY TESTING OF SILICONE POLYMERS FOR CORROSION CONTROL OF IMPLANTED MEDICAL ELECTRONIC PROSTHESES | 1986 | 5 | 2 | 100% |
THERMOGRAVIMETRIC ANALYSIS OF SILICONE ELASTOMERS AS INTEGRATED-CIRCUIT DEVICE ENCAPSULANTS | 1984 | 1 | 2 | 100% |
EFFECT OF ROOM-TEMPERATURE-VULCANIZED SILICONE CURE IN DEVICE PACKAGING | 1987 | 0 | 5 | 60% |
PLASTIC ENCAPSULATED SEMICONDUCTOR-DEVICES - BIBLIOGRAPHY .5. | 1981 | 0 | 7 | 100% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | BRITISH HEART FDN SKELETAL MUSCLE ASSIST GRP | 1 | 50% | 0.7% | 2 |
2 | IMPLANTED DEVICES GRP | 1 | 21% | 1.8% | 5 |
3 | ACCESS NETWORK S | 1 | 50% | 0.4% | 1 |
4 | BIOMED STIMULAT MONITORING GRP BISTIMO | 1 | 50% | 0.4% | 1 |
5 | CALCE PROGNOST HLTH MONITORING | 1 | 50% | 0.4% | 1 |
6 | ETUD INTEGRAT COMPOSANTS SYST ELECT | 1 | 50% | 0.4% | 1 |
7 | HYBRID MICROCIRCUITS GRP | 1 | 50% | 0.4% | 1 |
8 | POLIGONO IND T CANTOS | 1 | 50% | 0.4% | 1 |
9 | MAT ENGN CHARACTERIZAT SYNTH RECYCLING 4MAT | 0 | 33% | 0.4% | 1 |
10 | SCF | 0 | 25% | 0.4% | 1 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000186839 | ELECTROCHEMICAL MIGRATION//MECHANICAL RELIABILITY PREDICTION//CONDUCTIVE ANODIC FILAMENT |
2 | 0.0000168572 | UNDERFILL FLOW//WIRE SWEEP//BUMP PITCH |
3 | 0.0000157876 | COMMERCIAL RELIABILITY PROGRAM//ELECTRONIC COMPONENT RELIABILITY//INTERNET CALIBRATION |
4 | 0.0000118092 | THERMAL ENGN TECHNOL//J AN MARINE SCI TECHNOL//INP WAFERS |
5 | 0.0000091235 | ORAL BIOL MAXILLO IAL BIOL//STATE BIOBASED FIBER MANU TURE TECHNOL//BIOMOL CIBLES CELLULAI TUMORALES |
6 | 0.0000082049 | DMSMS//STRESS BALANCING//OBSOLESCENCE MANAGEMENT |
7 | 0.0000066982 | JOHNS HOPKINS APL TECHNICAL DIGEST//GPS TRANSLATORS//SECUR ANAL |
8 | 0.0000065733 | YIELDED UNYIELDED REGIONS//SHEET THICKNESS//CALENDER ROLLER SYSTEM |
9 | 0.0000063058 | NERVE CUFF//CUFF ELECTRODE//NERVE CUFF ELECTRODE |
10 | 0.0000052632 | DFRP//HIGH STRENGTH POLYETHYLENE FIBER//MECHANICAL LOSS |