Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
23558 | 287 | 14.7 | 66% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
178 | 21135 | INTEGRATED FERROELECTRICS//FERROELECTRIC THIN FILMS//PZT |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | MEMS PATTERNING | Author keyword | 3 | 100% | 1% | 3 |
2 | ETCHING DAMAGE | Author keyword | 3 | 30% | 2% | 7 |
3 | RUOX PT | Author keyword | 2 | 67% | 1% | 2 |
4 | TI MASK | Author keyword | 2 | 67% | 1% | 2 |
5 | ECR ION GUN | Author keyword | 1 | 100% | 1% | 2 |
6 | MAT DEVICE SECTOR | Address | 1 | 17% | 2% | 7 |
7 | CL 2 AR | Author keyword | 1 | 33% | 1% | 3 |
8 | MICROELECT TECH | Address | 1 | 33% | 1% | 3 |
9 | BARIUM STRONTIUM TITANATEBST | Author keyword | 1 | 50% | 0% | 1 |
10 | INTEGRATED FERROELECTRIC CAPACITORS | Author keyword | 1 | 50% | 0% | 1 |
Web of Science journal categories |
Author Key Words |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | MEMS PATTERNING | 3 | 100% | 1% | 3 | Search MEMS+PATTERNING | Search MEMS+PATTERNING |
2 | ETCHING DAMAGE | 3 | 30% | 2% | 7 | Search ETCHING+DAMAGE | Search ETCHING+DAMAGE |
3 | RUOX PT | 2 | 67% | 1% | 2 | Search RUOX+PT | Search RUOX+PT |
4 | TI MASK | 2 | 67% | 1% | 2 | Search TI+MASK | Search TI+MASK |
5 | ECR ION GUN | 1 | 100% | 1% | 2 | Search ECR+ION+GUN | Search ECR+ION+GUN |
6 | CL 2 AR | 1 | 33% | 1% | 3 | Search CL+2+AR | Search CL+2+AR |
7 | BARIUM STRONTIUM TITANATEBST | 1 | 50% | 0% | 1 | Search BARIUM+STRONTIUM+TITANATEBST | Search BARIUM+STRONTIUM+TITANATEBST |
8 | INTEGRATED FERROELECTRIC CAPACITORS | 1 | 50% | 0% | 1 | Search INTEGRATED+FERROELECTRIC+CAPACITORS | Search INTEGRATED+FERROELECTRIC+CAPACITORS |
9 | IR BASED ELECTRODE | 1 | 50% | 0% | 1 | Search IR+BASED+ELECTRODE | Search IR+BASED+ELECTRODE |
10 | LOW COO | 1 | 50% | 0% | 1 | Search LOW+COO | Search LOW+COO |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | INDUCTIVELY COUPLED CL 2 AR | 4 | 67% | 1% | 4 |
2 | ECR RF REACTOR | 2 | 67% | 1% | 2 |
3 | AR SPUTTER ETCH | 1 | 100% | 1% | 2 |
4 | SRBI2TA2O9 CAPACITORS | 1 | 50% | 1% | 2 |
5 | RF MAGNETRON | 1 | 25% | 1% | 3 |
6 | FERAM | 1 | 21% | 1% | 3 |
7 | IMPRINT CHARACTERISTICS | 1 | 50% | 0% | 1 |
8 | RAYLEIGH BEHAVIOR | 1 | 50% | 0% | 1 |
9 | SF6 AR | 1 | 50% | 0% | 1 |
10 | FERROELECTRIC CAPACITOR | 0 | 33% | 0% | 1 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
---|---|---|---|---|
Wet chemical etching method for BST thin films annealed at high temperature | 2008 | 7 | 17 | 47% |
Gold etching for microfabrication | 2014 | 1 | 34 | 24% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | MAT DEVICE SECTOR | 1 | 17% | 2.4% | 7 |
2 | MICROELECT TECH | 1 | 33% | 1.0% | 3 |
3 | MICRO NANO TECHNOL PROGRAM | 1 | 50% | 0.3% | 1 |
4 | ZI PETITE SAVATE | 1 | 50% | 0.3% | 1 |
5 | MICROELECT DEVICES MAT TECHNOL | 0 | 13% | 1.0% | 3 |
6 | MICROSTRUCT IL | 0 | 33% | 0.3% | 1 |
7 | PROC EQUIPMENT GRP | 0 | 33% | 0.3% | 1 |
8 | ULSI DEV HEADQUARTERS | 0 | 33% | 0.3% | 1 |
9 | ATMI | 0 | 25% | 0.3% | 1 |
10 | NEW MAT TECHNOL DEV | 0 | 25% | 0.3% | 1 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000256074 | INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING//TI HARD MASK//CL 2 BASED PLASMA |
2 | 0.0000255367 | HYDROGEN INDUCED DEGRADATION//SELECTIVELY NUCLEATED LATERAL CRYSTALLIZATION//FORMING GAS ANNEAL |
3 | 0.0000158329 | RUO2//RUOD3//RU |
4 | 0.0000156735 | ELECT DEVICES MAT TECHNOL//SIO2 ETCHING//PLASMA ETCHING |
5 | 0.0000132385 | PZT//PZT THIN FILMS//INTEGRATED FERROELECTRICS |
6 | 0.0000125312 | PZT THICK FILM//PIEZOELECTRIC THICK FILM//PZT THICK FILMS |
7 | 0.0000094115 | BST//BARIUM STRONTIUM TITANATE//TUNABILITY |
8 | 0.0000093981 | AEROSOL DEPOSITION METHOD//AEROSOL DEPOSITION//AEROSOL DEPOSITION METHOD ADM |
9 | 0.0000082456 | ELECTROLYTIC COPPER ADDITION//BCL3 PLASMA//FIS CHIM SUPERFICI INTER E |
10 | 0.0000078930 | SOCIOTECHNO SCI TECHNOL//N GAN//GALLIUM HYDROXIDE |