Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
22255 | 331 | 24.4 | 44% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
504 | 14575 | PLATING AND SURFACE FINISHING//ELECTRODEPOSITION//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | UDIL | Address | 3 | 50% | 2% | 5 |
2 | BRINDISI FUEL CELL DURABIL | Address | 3 | 57% | 1% | 4 |
3 | LEVELLERS | Author keyword | 3 | 60% | 1% | 3 |
4 | GOLD ELECTRODEPOSITION | Author keyword | 3 | 42% | 2% | 5 |
5 | DIPARTIMENTO CHIM FIS PLICATA | Address | 2 | 16% | 4% | 13 |
6 | AU AG CU | Author keyword | 2 | 67% | 1% | 2 |
7 | NON CYANIDE ELECTROLYTE | Author keyword | 2 | 67% | 1% | 2 |
8 | CLIO LCP | Address | 2 | 43% | 1% | 3 |
9 | AMORPHOUS GOLD NICKEL ALLOY | Author keyword | 1 | 100% | 1% | 2 |
10 | GOLD ELECTRODEPOSIT | Author keyword | 1 | 100% | 1% | 2 |
Web of Science journal categories |
Author Key Words |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | LEVELLERS | 3 | 60% | 1% | 3 | Search LEVELLERS | Search LEVELLERS |
2 | GOLD ELECTRODEPOSITION | 3 | 42% | 2% | 5 | Search GOLD+ELECTRODEPOSITION | Search GOLD+ELECTRODEPOSITION |
3 | AU AG CU | 2 | 67% | 1% | 2 | Search AU+AG+CU | Search AU+AG+CU |
4 | NON CYANIDE ELECTROLYTE | 2 | 67% | 1% | 2 | Search NON+CYANIDE+ELECTROLYTE | Search NON+CYANIDE+ELECTROLYTE |
5 | AMORPHOUS GOLD NICKEL ALLOY | 1 | 100% | 1% | 2 | Search AMORPHOUS+GOLD+NICKEL+ALLOY | Search AMORPHOUS+GOLD+NICKEL+ALLOY |
6 | GOLD ELECTRODEPOSIT | 1 | 100% | 1% | 2 | Search GOLD+ELECTRODEPOSIT | Search GOLD+ELECTRODEPOSIT |
7 | NONCOHERENT NUCLEATION | 1 | 100% | 1% | 2 | Search NONCOHERENT+NUCLEATION | Search NONCOHERENT+NUCLEATION |
8 | SOFT GOLD | 1 | 100% | 1% | 2 | Search SOFT+GOLD | Search SOFT+GOLD |
9 | AU ALLOYS | 1 | 33% | 1% | 3 | Search AU+ALLOYS | Search AU+ALLOYS |
10 | NON CYANIDE | 1 | 33% | 1% | 3 | Search NON+CYANIDE | Search NON+CYANIDE |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | SOFT GOLD | 21 | 78% | 4% | 14 |
2 | THIOSULFATE SULFITE BATH | 15 | 77% | 3% | 10 |
3 | HARD GOLD | 9 | 64% | 3% | 9 |
4 | NONCOHERENT NUCLEATION | 9 | 83% | 2% | 5 |
5 | ELECTRONICS APPLICATIONS | 7 | 36% | 5% | 16 |
6 | NONCYANIDE BATH | 7 | 67% | 2% | 6 |
7 | MATRIX PARTICULATE COMPOSITES | 6 | 71% | 2% | 5 |
8 | ATOMISTIC ANALYSIS | 6 | 100% | 1% | 4 |
9 | BENZYLDIMETHYLPHENYLAMMONIUM CHLORIDE | 4 | 67% | 1% | 4 |
10 | ELECTROPLATED GOLD | 2 | 67% | 1% | 2 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references | % act. ref. to same field |
---|---|---|---|---|
Non-Cyanide Electrolytes for Gold Plating - A Review | 2013 | 5 | 30 | 83% |
Development of a non-toxic electrolyte for soft gold electrodeposition: an overview of work at University of Newcastle upon Tyne | 2003 | 23 | 16 | 94% |
Development of new electrolytic and electroless gold plating processes for electronics applications | 2006 | 14 | 8 | 100% |
Coupling of Morphology and Chemistry Leads to Morphogenesis in Electrochemical Metal Growth: A Review of the Reaction-Diffusion Approach | 2012 | 3 | 13 | 77% |
A review of nanostructural aspects of metal electrodeposition | 2008 | 105 | 217 | 11% |
An in situ electrochemical soft X-ray spectromicroscopy investigation of Fe galvanically coupled to Au | 2011 | 9 | 30 | 17% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | UDIL | 3 | 50% | 1.5% | 5 |
2 | BRINDISI FUEL CELL DURABIL | 3 | 57% | 1.2% | 4 |
3 | DIPARTIMENTO CHIM FIS PLICATA | 2 | 16% | 3.9% | 13 |
4 | CLIO LCP | 2 | 43% | 0.9% | 3 |
5 | SYST MAT | 1 | 100% | 0.6% | 2 |
6 | STUDIO PROC ELETTROD | 1 | 40% | 0.6% | 2 |
7 | DIPARTIMENTO ICMMPM | 1 | 12% | 1.8% | 6 |
8 | CNR INFM TASC | 1 | 50% | 0.3% | 1 |
9 | STUDIO PROCESSI ELETTRODICI | 1 | 50% | 0.3% | 1 |
10 | DIPARTIMENTO SCI MOTORIE SALUTE | 1 | 17% | 0.9% | 3 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000260732 | SILVER INDIUM ALLOY//SILVER BISMUTH ALLOYS//ROSTISLAV KAI EW PHYS CHEM |
2 | 0.0000186390 | ELECTRODEPOSITION OF NICKEL//2 FILM THEORY//AXIAL DISPERSION MODELS |
3 | 0.0000164252 | AFDELING COORDINATIECHEM//ALKALINE NON CYANIDE//INDUSTRIAL ELECTRO REFINING ELECTROLYTES |
4 | 0.0000127297 | HONG KONG BEIJING JOINT//MATEMATYKI FIZYKI//GEN LASER PHYS |
5 | 0.0000123894 | FLUXLESS BONDING//AU SN SOLDER//MAT MFG TECHNOL PROGRAM |
6 | 0.0000123071 | PERFLUOROSULFONATE IONOMERS//POLYACRYLAMIDE ADSORPTION//POLYACRYLIC ACID ADSORPTION |
7 | 0.0000118492 | COPPER POWDER FLOWABILITY//ELECTROLYTIC COPPER POWDER//REVERSING CURRENT |
8 | 0.0000118262 | SELF ANNEALING//COPPER ELECTRODEPOSITION//COPPER ELECTROPLATING |
9 | 0.0000108520 | ST S ANAL FAILURE DESIGN//FRETTING CORROSION//TIN PLATED CONTACT |
10 | 0.0000101086 | COFE FILMS//PRECIS ELECT TECHNOL//FECONI ALLOY |