Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 2214 | 2246 | 20.8 | 64% |
Classes in level above (level 2) |
| ID, lev. above |
Publications | Label for level above |
|---|---|---|
| 824 | 11237 | PLASMA POLYMERIZATION//PLASMA PROCESSES AND POLYMERS//LOW K |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | LOW K | Author keyword | 96 | 42% | 8% | 177 |
| 2 | SIOC H FILMS | Author keyword | 94 | 97% | 1% | 28 |
| 3 | PLASMA PROC TECHNOL | Address | 61 | 82% | 2% | 36 |
| 4 | LOW K MATERIALS | Author keyword | 38 | 62% | 2% | 39 |
| 5 | NANO THIN FILM MAT | Address | 35 | 74% | 1% | 26 |
| 6 | LOW K DIELECTRICS | Author keyword | 31 | 43% | 2% | 55 |
| 7 | SIOF | Author keyword | 31 | 73% | 1% | 24 |
| 8 | LOW K DIELECTRIC THIN FILMS | Author keyword | 26 | 64% | 1% | 25 |
| 9 | LOW DIELECTRIC CONSTANT | Author keyword | 22 | 29% | 3% | 64 |
| 10 | XPEQT | Address | 21 | 90% | 0% | 9 |
Web of Science journal categories |
Author Key Words |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | LOW K | 96 | 42% | 8% | 177 | Search LOW+K | Search LOW+K |
| 2 | SIOC H FILMS | 94 | 97% | 1% | 28 | Search SIOC+H+FILMS | Search SIOC+H+FILMS |
| 3 | LOW K MATERIALS | 38 | 62% | 2% | 39 | Search LOW+K+MATERIALS | Search LOW+K+MATERIALS |
| 4 | LOW K DIELECTRICS | 31 | 43% | 2% | 55 | Search LOW+K+DIELECTRICS | Search LOW+K+DIELECTRICS |
| 5 | SIOF | 31 | 73% | 1% | 24 | Search SIOF | Search SIOF |
| 6 | LOW K DIELECTRIC THIN FILMS | 26 | 64% | 1% | 25 | Search LOW+K+DIELECTRIC+THIN+FILMS | Search LOW+K+DIELECTRIC+THIN+FILMS |
| 7 | LOW DIELECTRIC CONSTANT | 22 | 29% | 3% | 64 | Search LOW+DIELECTRIC+CONSTANT | Search LOW+DIELECTRIC+CONSTANT |
| 8 | LOW K MATERIAL | 20 | 54% | 1% | 25 | Search LOW+K+MATERIAL | Search LOW+K+MATERIAL |
| 9 | INTERMETAL DIELECTRIC | 19 | 74% | 1% | 14 | Search INTERMETAL+DIELECTRIC | Search INTERMETAL+DIELECTRIC |
| 10 | LOW K DIELECTRIC | 18 | 35% | 2% | 41 | Search LOW+K+DIELECTRIC | Search LOW+K+DIELECTRIC |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | LOW K | 81 | 57% | 4% | 97 |
| 2 | LOW DIELECTRIC CONSTANT | 69 | 33% | 8% | 175 |
| 3 | METHYLSILSESQUIOXANE | 60 | 79% | 2% | 38 |
| 4 | DIELECTRIC CONSTANT MATERIALS | 46 | 47% | 3% | 72 |
| 5 | SIOF FILMS | 38 | 76% | 1% | 26 |
| 6 | LOW K DIELECTRICS | 33 | 46% | 2% | 54 |
| 7 | CONSTANT MATERIALS | 30 | 44% | 2% | 52 |
| 8 | COPPER DRIFT | 30 | 84% | 1% | 16 |
| 9 | SPIN ON GLASS | 27 | 47% | 2% | 43 |
| 10 | INTERLAYER DIELECTRICS | 24 | 53% | 1% | 32 |
Journals |
Reviews |
| Title | Publ. year | Cit. | Active references | % act. ref. to same field |
|---|---|---|---|---|
| Low dielectric constant materials for microelectronics | 2003 | 848 | 147 | 56% |
| Low Dielectric Constant Materials | 2010 | 186 | 384 | 47% |
| Porous pSiCOH Ultralow-k Dielectrics for Chip Interconnects Prepared by PECVD | 2009 | 58 | 26 | 92% |
| Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects-State of the art | 2014 | 13 | 22 | 55% |
| Review of polymer materials with low dielectric constant | 2010 | 37 | 57 | 63% |
| The effects of vacuum ultraviolet radiation on low-k dielectric films | 2012 | 14 | 71 | 63% |
| Low-Dielectric Constant Insulators for Future Integrated Circuits and Packages | 2011 | 15 | 61 | 52% |
| Time Dependent Dielectric Breakdown in Copper Low-k Interconnects: Mechanisms and Reliability Models | 2012 | 8 | 31 | 61% |
| Porous Dielectrics in Microelectronic Wiring Applications | 2010 | 10 | 72 | 88% |
| Development of a low-dielectric-constant polymer for the fabrication of integrated circuit interconnect | 2000 | 201 | 4 | 25% |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | PLASMA PROC TECHNOL | 61 | 82% | 1.6% | 36 |
| 2 | NANO THIN FILM MAT | 35 | 74% | 1.2% | 26 |
| 3 | XPEQT | 21 | 90% | 0.4% | 9 |
| 4 | NANOTHIN FILM MAT | 17 | 79% | 0.5% | 11 |
| 5 | LOG TECHNOL DEV | 16 | 39% | 1.5% | 33 |
| 6 | MECH ENERGY PROD ENGN | 8 | 45% | 0.6% | 14 |
| 7 | NANODEVICES SYST | 5 | 15% | 1.4% | 32 |
| 8 | OCOTILLO MAT | 5 | 63% | 0.2% | 5 |
| 9 | SEMICOND MAT PROC | 4 | 31% | 0.5% | 12 |
| 10 | ADV NANOTECH DEV TEAM | 4 | 75% | 0.1% | 3 |
Related classes at same level (level 1) |
| Rank | Relatedness score | Related classes |
|---|---|---|
| 1 | 0.0000125421 | FLUOROCARBON FILMS//FLUORINATED AMORPHOUS CARBON//A C F |
| 2 | 0.0000075484 | HMDSO//HEXAMETHYLDISILOXANE//HEXAMETHYLDISILOXANE HMDSO |
| 3 | 0.0000069682 | DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE |
| 4 | 0.0000065719 | HYDROGEN SILSESQUIOXANE//HSQ//HSQ RESIST |
| 5 | 0.0000063358 | BOROPHOSPHOSILICATE GLASS BPSG//ATMOSPHERIC PRESSURE CVD//BPSG |
| 6 | 0.0000057462 | ATOMIC LAYER ETCHING//GATE CHARGING//NEUTRAL BEAM ETCHING |
| 7 | 0.0000052694 | LEHRSTUHL FUNKT MAT//BK MOL SCI//LS E13 |
| 8 | 0.0000052372 | PLASMA POLYMERIZATION//SINTESIS CARACTERIZAC//GEORGE SUDARSHAN PHYS COMP SCI |
| 9 | 0.0000049150 | SILICON CARBONITRIDE//SILICON CARBON NITRIDE//SILICON CARBONITRIDE FILM |
| 10 | 0.0000046088 | ELECT DEVICES MAT TECHNOL//SIO2 ETCHING//PLASMA ETCHING |