Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 21815 | 347 | 25.2 | 66% |
Classes in level above (level 2) |
| ID, lev. above |
Publications | Label for level above |
|---|---|---|
| 688 | 12395 | LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | NANOSCALE SILVER PASTE | Author keyword | 9 | 83% | 1% | 5 |
| 2 | NANOSILVER PASTE | Author keyword | 7 | 64% | 2% | 7 |
| 3 | TIANJIN ADV JOINING TECHNOL | Address | 4 | 19% | 6% | 21 |
| 4 | CHIP ATTACHMENT | Author keyword | 4 | 75% | 1% | 3 |
| 5 | LED ENGN | Address | 4 | 75% | 1% | 3 |
| 6 | ADV MAT JOINING | Address | 4 | 18% | 6% | 20 |
| 7 | DIE ATTACH | Author keyword | 4 | 20% | 5% | 17 |
| 8 | NANO SILVER PASTE | Author keyword | 4 | 46% | 2% | 6 |
| 9 | COPPER JOINT | Author keyword | 3 | 100% | 1% | 3 |
| 10 | ADV CARBON TECHNOL | Address | 3 | 35% | 2% | 7 |
Web of Science journal categories |
Author Key Words |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | NANOSCALE SILVER PASTE | 9 | 83% | 1% | 5 | Search NANOSCALE+SILVER+PASTE | Search NANOSCALE+SILVER+PASTE |
| 2 | NANOSILVER PASTE | 7 | 64% | 2% | 7 | Search NANOSILVER+PASTE | Search NANOSILVER+PASTE |
| 3 | CHIP ATTACHMENT | 4 | 75% | 1% | 3 | Search CHIP+ATTACHMENT | Search CHIP+ATTACHMENT |
| 4 | DIE ATTACH | 4 | 20% | 5% | 17 | Search DIE+ATTACH | Search DIE+ATTACH |
| 5 | NANO SILVER PASTE | 4 | 46% | 2% | 6 | Search NANO+SILVER+PASTE | Search NANO+SILVER+PASTE |
| 6 | COPPER JOINT | 3 | 100% | 1% | 3 | Search COPPER+JOINT | Search COPPER+JOINT |
| 7 | DIE ATTACHMENT | 3 | 35% | 2% | 7 | Search DIE+ATTACHMENT | Search DIE+ATTACHMENT |
| 8 | SILVER SINTERING | 2 | 44% | 1% | 4 | Search SILVER+SINTERING | Search SILVER+SINTERING |
| 9 | LOW TEMPERATURE JOINING TECHNIQUE LTJT | 2 | 67% | 1% | 2 | Search LOW+TEMPERATURE+JOINING+TECHNIQUE+LTJT | Search LOW+TEMPERATURE+JOINING+TECHNIQUE+LTJT |
| 10 | SINTERING BONDING | 2 | 67% | 1% | 2 | Search SINTERING+BONDING | Search SINTERING+BONDING |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | AG METALLOORGANIC NANOPARTICLES | 31 | 92% | 3% | 12 |
| 2 | CHIP ATTACHMENT | 31 | 92% | 3% | 12 |
| 3 | METALLOORGANIC NANOPARTICLES | 23 | 76% | 5% | 16 |
| 4 | NANOSCALE SILVER | 19 | 68% | 5% | 17 |
| 5 | DIE ATTACH MATERIALS | 18 | 89% | 2% | 8 |
| 6 | SILVER PASTE | 12 | 59% | 4% | 13 |
| 7 | DIE ATTACH MATERIAL | 11 | 78% | 2% | 7 |
| 8 | SINTERED NANOSCALE SILVER | 9 | 83% | 1% | 5 |
| 9 | NANOSCALE SILVER PASTE | 8 | 100% | 1% | 5 |
| 10 | DIE ATTACH | 4 | 30% | 3% | 12 |
Journals |
Reviews |
| Title | Publ. year | Cit. | Active references | % act. ref. to same field |
|---|---|---|---|---|
| Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability | 2014 | 4 | 21 | 76% |
| Mechanical properties of nano-silver joints as die attach materials | 2012 | 41 | 67 | 36% |
| Die Attach Materials for High Temperature Applications: A Review | 2011 | 38 | 39 | 28% |
| Cold welding: a phenomenon for spontaneous self-healing and shape genesis at the nanoscale | 2015 | 1 | 55 | 13% |
| Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications | 2015 | 0 | 179 | 37% |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | TIANJIN ADV JOINING TECHNOL | 4 | 19% | 6.1% | 21 |
| 2 | LED ENGN | 4 | 75% | 0.9% | 3 |
| 3 | ADV MAT JOINING | 4 | 18% | 5.8% | 20 |
| 4 | ADV CARBON TECHNOL | 3 | 35% | 2.0% | 7 |
| 5 | INTELLIGENT STRUCT MAT SYST | 1 | 100% | 0.6% | 2 |
| 6 | VER UREN | 1 | 50% | 0.6% | 2 |
| 7 | TU BRAUN WEIG | 1 | 40% | 0.6% | 2 |
| 8 | ADV JOINING TECHNOL | 1 | 50% | 0.3% | 1 |
| 9 | CENT EUROPEAN TECHNOL CEITEC BUT | 1 | 50% | 0.3% | 1 |
| 10 | ELECT MACHINE DRIVE SYST | 1 | 50% | 0.3% | 1 |
Related classes at same level (level 1) |
| Rank | Relatedness score | Related classes |
|---|---|---|
| 1 | 0.0000264866 | FLUXLESS BONDING//AU SN SOLDER//MAT MFG TECHNOL PROGRAM |
| 2 | 0.0000158952 | INK JET PRINTING//PRINTED ELECTRONICS//CONDUCTIVE INK |
| 3 | 0.0000146094 | ELECTROCHEMICAL MIGRATION//MECHANICAL RELIABILITY PREDICTION//CONDUCTIVE ANODIC FILAMENT |
| 4 | 0.0000098913 | ANISOTROPIC CONDUCTIVE ADHESIVE ACA//ANISOTROPIC CONDUCTIVE FILM ACF//ANISOTROPIC CONDUCTIVE FILM |
| 5 | 0.0000093658 | INSULATED GATE BIPOLAR TRANSISTOR IGBT//LATERAL INSULATED GATE BIPOLAR TRANSISTOR LIGBT//INSULATED GATE BIPOLAR TRANSISTORS IGBTS |
| 6 | 0.0000080170 | COPPER NANOPARTICLES//ABT AC//CU NANOPARTICLES |
| 7 | 0.0000071787 | LEAD FREE SOLDER//PB FREE SOLDER//LEAD FREE SOLDERS |
| 8 | 0.0000069157 | JOURNAL OF ELECTRONIC PACKAGING//SOLDERING & SURFACE MOUNT TECHNOLOGY//SOLDER JOINT |
| 9 | 0.0000066099 | MODELS AND TECHNIQUES//SIZE DEPENDENT MELTING//NANO PHASE DIAGRAM |
| 10 | 0.0000063739 | 4H SIC//SILICON CARBIDE SIC//BIPOLAR JUNCTION TRANSISTORS BJTS |